Abstract: An electrical contact element that solves many problems associated with making electrical connections to integrated circuit chips. The contact element fits in small areas, but in some configurations can provide compliance in multiple directions to provide the required compliance. The contacts are shaped to provide relatively large stroke and also large force for good electrical contact. Contact elements according to the invention are incorporated into contactors for making electrical contact to Ball Grid Arrays for testing. Contact elements according to the invention are also incorporated into Ball Grid Array packages, and used as a mounting point for solder balls. The contact elements make the electrical connection withstand stress associated with differential thermal expansion.

Abstract: An expandable gripper for semiconductor processing equipment that allows the pitch between semiconductor chips to be adjusted. To adjust the pitch, several pick and place mechanisms are mounted around a shaft using nuts. The threads of the nuts have variable leads, causing each to travel a different amount as the shaft rotates. All of the threads engage the shaft because a compliant layer is attached to the shaft.

Abstract: A semiconductor chip tray holding chips in individual bins that can each be independently moved with six degrees of freedom. The bins are held in the tray with a flexural bearing system. The flexural bearing system centers the chips at a nominal position allows compliant motion of the bins. The flexural bearing system is made of four beams, with pairs joined at right angles through flexural bearings.