Patents by Inventor R. Wayne Johnson

R. Wayne Johnson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patterned die attach and packaging method using the same
    Patent number: 7786602
    Abstract: A semiconductor die is attached to a packaging substrate by a patterned layer of conductive metal that includes voids. The voids provide a space into which the metal may expand when heated in order to avoid placing mechanical stress on the bonds caused by mismatches in the thermal coefficients of thermal expansion of the die, the conductive metal bond layer and the substrate. An additional coating of conductive metal may be flowed over the bond lines to reinforce the bonds.
    Type: Grant
    Filed: June 6, 2007
    Date of Patent: August 31, 2010
    Assignee: The Boeing Company
    Inventors: Leora Peltz, R. Wayne Johnson