Abstract: A wire bonder (900) with a rigid pedestal (902) having resilient inserts (920). A package (904) placed on the pedestal (902) contains an electrical device (906). The bond pads on the electrical device (906) are electrically connected to bond pads on the package (904) by a series of bond wires (908) through use of a well know bonding process. A vacuum source holds the package (904) against the pedestal (902) deforming the resilient strips (920) located in the rigid member (902) of the pedestal and ensuring good contact between the ground pads of the package (904) and conductive resilient members (920). The resilient members (920) are conductive and electrically connect the package grounds to a system ground (922).

Abstract: A system and related method to forecast based on events defined by event segments. The system includes a database or set of databases populated with selectable event segments characterized by known information and predictive information deemed by the user to be relevant to a particular organization for which future resource allocation predictions are desired. Rather than evaluate past data summaries alone to predict future resource allocation requirements, the system and related method input raw data that may be parsed and analyzed in any selectable combination to produce one or more forecasts to produce resource allocation information. One use of the system and related method is to calculate staffing requirements for a contact center at a selectable level of granularity.

Abstract: The invention concerns new secreted factors encoded by clones P00184-D11 (SEQ ID NO: 1), P00185_D11 (SEQ ID NO: 3), P00188_D12 (SEQ ID NO: 5), P00188_E01 (SEQ ID NO: 7), P00194_G01 (SEQ ID NO: 9), P00194_G05 (SEQ ID NO: 11), P00194_H10 (SEQ ID NO: 13), P00199_D08 (SEQ ID NO: 15), P00203_D04 (SEQ ID NO: 17), P00203_E06 (SEQ ID NO: 19), P00209_F06 (SEQ ID NO: 21), P00219_D02 (SEQ ID NO: 23), P00219_F06 (SEQ ID NO: 25), P00220_H05 (SEQ ID NO: 27), P00222_G03 (SEQ ID NO: 29), P00225_C01 (SEQ ID NO: 32), P00227_D11 (SEQ ID NO: 34), P00228_F03 (SEQ ID NO: 36), P00233_H08 (SEQ ID NO: 38), P00235_008 (SEQ ID NO: 40), P00239_C11 (SEQ ID NO: 42), P00240_E05 (SEQ ID NO: 45), P00247_A04 (SEQ ID NO: 50), P00248_B04 (SEQ ID NO: 52), P00249_F09 (SEQ ID NO: 54), P00258_A10 (SEQ ID NO: 56), P00262_C10 (SEQ ID NO: 58), P00269_H08 (SEQ ID NO: 62), P00628_H02 (SEQ ID NO: 66), P00629_C08 (SEQ ID NO: 68), P00641_G11 (SEQ ID NO: 71), P00648_E12 (SEQ ID NO: 73), P00697_C03 (SEQ ID NO: 75), and other mammalian homologues and variants

Abstract: A wire bonder (900) with a rigid pedestal (902) having resilient inserts (920). A package (904) placed on the pedestal (902) contains an electrical device (906). The bond pads on the electrical device (906) are electrically connected to bond pads on the package (904) by a series of bond wires (908) through use of a well know bonding process. A vacuum source holds the package (904) against the pedestal (902) deforming the resilient strips (920) located in the rigid member (902) of the pedestal and ensuring good contact between the ground pads of the package (904) and conductive resilient members (920). The resilient members (920) are conductive and electrically connect the package grounds to a system ground (922).