Patents by Inventor Ra?anan Sover

Ra?anan Sover has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for integrated high Q inductors in FCGBA packages
    Patent number: 6972965
    Abstract: A high quality factor on-package, off-die inductor assembly is disclosed. The assembly includes a flip-chip, ball-grid array package substrate, an on-package, off-die trace line is coupled to one or more bumps attached to an upper surface of the package substrate. The trace line has a self-inductance and a predetermined length. The quality factor associated with the inductor is a ratio of the trace line's inductance to the trace lines resistance. The package substrate is a low loss laminate.
    Type: Grant
    Filed: February 4, 2003
    Date of Patent: December 6, 2005
    Assignee: Intel Corporation
    Inventors: Shmuel Ravid, Ra′anan Sover