Patents by Inventor Rachel Creighton

Rachel Creighton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated fiber microneedle device for drug and vaccine delivery
    Patent number: 11517729
    Abstract: Systems and methods are provided for fabricating microneedle arrays that includes electrospun fibers preferentially disposed within the microneedles of the array. Providing the electrospun fibers preferentially in the microneedles allows for more of a drug or other substance present in the fibers to be deposited into tissue or to provide other benefits. A mold for forming the microneedle arrays includes an insulating surface layer. The insulating surface layer affects the electric field during electrospinning such that electrospun fibers are deposited preferentially within the microneedle cavities of the mold relative to the surface of the mold. A bulk material can then be applied to the mold to form the bulk of the microneedles with electrospun fibers embedded within and a backing layer to which the microneedles are attached.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: December 6, 2022
    Assignee: University of Washington
    Inventors: Rachel Creighton, Kim Woodrow
  • Integrated Fiber Microneedle Device for Drug and Vaccine Delivery
    Publication number: 20200054870
    Abstract: Systems and methods are provided for fabricating microneedle arrays that includes electrospun fibers preferentially disposed within the microneedles of the array. Providing the electrospun fibers preferentially in the microneedles allows for more of a drug or other substance present in the fibers to be deposited into tissue or to provide other benefits. A mold for forming the microneedle arrays includes an insulating surface layer. The insulating surface layer affects the electric field during electrospinning such that electrospun fibers are deposited preferentially within the microneedle cavities of the mold relative to the surface of the mold. A bulk material can then be applied to the mold to form the bulk of the microneedles with electrospun fibers embedded within and a backing layer to which the microneedles are attached.
    Type: Application
    Filed: August 20, 2019
    Publication date: February 20, 2020
    Inventors: Rachel Creighton, Kim Woodrow