Patents by Inventor Rachel Hellenga

Rachel Hellenga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10717018
    Abstract: One variation of a conductive construction tape for electrifying a stack of bricks in a studded-brick building system includes: a tape substrate defining a first linear array of perforations that each define a circular cross-section configured to receive a stud extending from a brick in the studded-brick building system and offset from an adjacent perforation in the linear array by a standard stud offset distance between studs extending from the brick; and a conductive tape layer applied over the tape substrate; an electrically-conductive material extending along the first linear array of perforations and cooperating with the tape substrate to define a total nominal thickness less than a thickness of the studded building brick; wherein the perforated conductive tape is configured to transiently install horizontally between bricks in the stack of bricks to communicate electrical current laterally across the stack of bricks.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: July 21, 2020
    Inventor: Rachel Hellenga
  • Publication number: 20190105580
    Abstract: One variation of a conductive construction tape for electrifying a stack of bricks in a studded-brick building system includes: a tape substrate defining a first linear array of perforations that each define a circular cross-section configured to receive a stud extending from a brick in the studded-brick building system and offset from an adjacent perforation in the linear array by a standard stud offset distance between studs extending from the brick; and a conductive tape layer applied over the tape substrate; an electrically-conductive material extending along the first linear array of perforations and cooperating with the tape substrate to define a total nominal thickness less than a thickness of the studded building brick; wherein the perforated conductive tape is configured to transiently install horizontally between bricks in the stack of bricks to communicate electrical current laterally across the stack of bricks.
    Type: Application
    Filed: December 6, 2018
    Publication date: April 11, 2019
    Inventor: Rachel Hellenga
  • Patent number: 10179295
    Abstract: One variation of a conductive construction tape for electrifying a stack of bricks in a studded-brick building system includes: a tape substrate defining a first linear array of perforations that each define a circular cross-section configured to receive a stud extending from a brick in the studded-brick building system and offset from an adjacent perforation in the linear array by a standard stud offset distance between studs extending from the brick; and a conductive tape layer applied over the tape substrate; an electrically-conductive material extending along the first linear array of perforations and cooperating with the tape substrate to define a total nominal thickness less than a thickness of the studded building brick; wherein the perforated conductive tape is configured to transiently install horizontally between bricks in the stack of bricks to communicate electrical current laterally across the stack of bricks.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: January 15, 2019
    Inventor: Rachel Hellenga
  • Publication number: 20170361240
    Abstract: One variation of a conductive construction tape for electrifying a stack of bricks in a studded-brick building system includes: a tape substrate defining a first linear array of perforations that each define a circular cross-section configured to receive a stud extending from a brick in the studded-brick building system and offset from an adjacent perforation in the linear array by a standard stud offset distance between studs extending from the brick; and a conductive tape layer applied over the tape substrate; an electrically-conductive material extending along the first linear array of perforations and cooperating with the tape substrate to define a total nominal thickness less than a thickness of the studded building brick; wherein the perforated conductive tape is configured to transiently install horizontally between bricks in the stack of bricks to communicate electrical current laterally across the stack of bricks.
    Type: Application
    Filed: September 1, 2017
    Publication date: December 21, 2017
    Inventor: Rachel Hellenga
  • Patent number: 9782686
    Abstract: One variation of a conductive construction tape for electrifying a stack of bricks in a studded-brick building system includes: a tape substrate defining a first linear array of perforations that each define a circular cross-section configured to receive a stud extending from a brick in the studded-brick building system and offset from an adjacent perforation in the linear array by a standard stud offset distance between studs extending from the brick; and a conductive tape layer applied over the tape substrate; an electrically-conductive material extending along the first linear array of perforations and cooperating with the tape substrate to define a total nominal thickness less than a thickness of the studded building brick; wherein the perforated conductive tape is configured to transiently install horizontally between bricks in the stack of bricks to communicate electrical current laterally across the stack of bricks.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: October 10, 2017
    Inventor: Rachel Hellenga
  • Publication number: 20170189828
    Abstract: One variation of a conductive construction tape for electrifying a stack of bricks in a studded-brick building system includes: a tape substrate defining a first linear array of perforations that each define a circular cross-section configured to receive a stud extending from a brick in the studded-brick building system and offset from an adjacent perforation in the linear array by a standard stud offset distance between studs extending from the brick; and a conductive tape layer applied over the tape substrate; an electrically-conductive material extending along the first linear array of perforations and cooperating with the tape substrate to define a total nominal thickness less than a thickness of the studded building brick; wherein the perforated conductive tape is configured to transiently install horizontally between bricks in the stack of bricks to communicate electrical current laterally across the stack of bricks.
    Type: Application
    Filed: September 9, 2016
    Publication date: July 6, 2017
    Inventor: Rachel Hellenga