Patents by Inventor Rachel K. Giunta

Rachel K. Giunta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of packaging and assembling micro-fluidic device
    Patent number: 6821819
    Abstract: A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.
    Type: Grant
    Filed: February 20, 2003
    Date of Patent: November 23, 2004
    Assignee: Sandia Corporation
    Inventors: Gilbert L. Benavides, Paul C. Galambos, John A. Emerson, Kenneth A. Peterson, Rachel K. Giunta, David Lee Zamora, Robert D. Watson
  • Packaging of electro-microfluidic devices
    Patent number: 6548895
    Abstract: A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.
    Type: Grant
    Filed: February 21, 2001
    Date of Patent: April 15, 2003
    Assignee: Sandia Corporation
    Inventors: Gilbert L. Benavides, Paul C. Galambos, John A. Emerson, Kenneth A. Peterson, Rachel K. Giunta, David Lee Zamora, Robert D. Watson
  • Packaging of electro-microfluidic devices
    Patent number: 6443179
    Abstract: A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.
    Type: Grant
    Filed: February 21, 2001
    Date of Patent: September 3, 2002
    Assignee: Sandia Corporation
    Inventors: Gilbert L. Benavides, Paul C. Galambos, John A. Emerson, Kenneth A. Peterson, Rachel K. Giunta, Robert D. Watson