Abstract: A method of forming a tubular structure including a first tube and a second tube. The steps of the method include first successively depositing layers of a first material and at least partially melting at least a portion of each deposited layer of the first material at predetermined locations to form the first tube. Second, successively depositing layers of a second material and at least partially melting at least a portion of each deposited layer of the second material at additional predetermined locations to form the second tube, wherein the second tube is attached to the first tube at an intersection. Additionally, at least partially melting steps include forming portions of a plurality of segments, and the first tube and the second tube share segments of the plurality of segments at their intersection.

Abstract: A three-dimensional structure is formed when layers of a material are deposited onto a substrate and scanned with a high energy beam to at least partially melt each layer of the material. Upon scanning the layers at predetermined locations a tube device having a first tube and a second tube intersected with the first tube is formed.

Abstract: A three-dimensional structure is formed when layers of a material are deposited onto a substrate and scanned with a high energy beam to at least partially melt each layer of the material. Upon scanning the layers at predetermined locations a tube device having a first tube and a second tube intersected with the first tube is formed.

Abstract: Efficient methods for lithographically fabricating spring structures onto a substrate containing contact pads or metal vias by forming both the spring metal and release material layers using a single mask. Specifically, a pad of release material is self-aligned to the spring metal finger using a photoresist mask or a plated metal pattern, or using lift-off processing techniques. A release mask is then used to release the spring metal finger while retaining a portion of the release material that secures the anchor portion of the spring metal finger to the substrate. When the release material is electrically conductive (e.g., titanium), this release material portion is positioned directly over the contact pad or metal via, and acts as a conduit to the spring metal finger in the completed spring structure. When the release material is non-conductive, a metal strap is formed to connect the spring metal finger to the contact pad/via.

Abstract: This invention relates to a method and apparatus for high-speed fluid flow control. More particularly, the invention is directed to a valve formed, at least in part, of an actuating material, such as piezoelectric or anti-ferro-electric material. The valve is used for controlling fluid flow (including air flow) in a variety of devices including imaging devices (e.g. printers, copiers, etc.) for which air flow is used to handle paper. In one embodiment, the subject valve takes advantage of the phenomenon of buckling, resultant bistability and other structural mechanics to efficiently, and in a high-speed manner, open and close to regulate fluid flow. In another embodiment, the valve includes implementation of the actuating material to bend an s-shaped blocking element within the valve. The valve is also advantageously implemented in matrices and formed using batch fabrication techniques.

Abstract: Efficient methods for lithographically fabricating spring structures onto a substrate containing contact pads or metal vias by forming both the spring metal and release material layers using a single mask. Specifically, a pad of release material is self-aligned to the spring metal finger using a photoresist mask or a plated metal pattern, or using lift-off processing techniques. A release mask is then used to release the spring metal finger while retaining a portion of the release material that secures the anchor portion of the spring metal finger to the substrate. When the release material is electrically conductive (e.g., titanium), this release material portion is positioned directly over the contact pad or metal via, and acts as a conduit to the spring metal finger in the completed spring structure. When the release material is non-conductive, a metal strap is formed to connect the spring metal finger to the contact pad or metal via, and also to further anchor the spring metal finger to the substrate.

Abstract: Efficient methods for lithographically fabricating spring structures onto a substrate containing contact pads or metal vias by forming both the spring metal and release material layers using a single mask. Specifically, a pad of release material is self-aligned to the spring metal finger using a photoresist mask or a plated metal pattern, or using lift-off processing techniques. A release mask is then used to release the spring metal finger while retaining a portion of the release material that secures the anchor portion of the spring metal finger to the substrate. When the release material is electrically conductive (e.g., titanium), this release material portion is positioned directly over the contact pad or metal via, and acts as a conduit to the spring metal finger in the completed spring structure. When the release material is non-conductive, a metal strap is formed to connect the spring metal finger to the contact pad/via.

Abstract: Efficient methods for lithographically fabricating spring structures onto a substrate containing contact pads or metal vias by forming both the spring metal and release material layers using a single mask. Specifically, a pad of release material is self-aligned to the spring metal finger using a photoresist mask or a plated metal pattern, or using lift-off processing techniques. A release mask is then used to release the spring metal finger while retaining a portion of the release material that secures the anchor portion of the spring metal finger to the substrate. When the release material is electrically conductive (e.g., titanium), this release material portion is positioned directly over the contact pad or metal via, and acts as a conduit to the spring metal finger in the completed spring structure. When the release material is non-conductive, a metal strap is formed to connect the spring metal finger to the contact pad or metal via, and also to further anchor the spring metal finger to the substrate.

Abstract: This invention relates to a method and apparatus for high-speed fluid flow control. More particularly, the invention is directed to a valve formed, at least in part, of an actuating material, such as piezoelectric or anti-ferro-electric material. The valve is used for controlling fluid flow (including air flow) in a variety of devices including imaging devices (e.g. printers, copiers, etc.) for which air flow is used to handle paper. In one embodiment, the subject valve takes advantage of the phenomenon of buckling, resultant bistability and other structural mechanics to efficiently, and in a high-speed manner, open and close to regulate fluid flow. In another embodiment, the valve includes implementation of the actuating material to bend an s-shaped blocking element within the valve. The valve is also advantageously implemented in matrices and formed using batch fabrication techniques.

Abstract: Efficient methods for lithographically fabricating spring structures onto a substrate containing contact pads or metal vias by forming both the spring metal and release material layers using a single mask. Specifically, a pad of release material is self-aligned to the spring metal finger using a photoresist mask or a plated metal pattern, or using lift-off processing techniques. A release mask is then used to release the spring metal finger while retaining a portion of the release material that secures the anchor portion of the spring metal finger to the substrate. When the release material is electrically conductive (e.g., titanium), this release material portion is positioned directly over the contact pad or metal via, and acts as a conduit to the spring metal finger in the completed spring structure. When the release material is non-conductive, a metal strap is formed to connect the spring metal finger to the contact pad or metal via, and also to further anchor the spring metal finger to the substrate.

Abstract: Batch fabrication of thin film structures can be facilitated by sandwiching a thin film between a first and a second polymeric or elastomeric layers. The sandwiched layer can be machined to define a thin film structure, typically a micoroelectromechanical element. This element is separated from the sandwiching layers by adhesive attachment to a target substrate.