Patents by Inventor Rachel Leigh Peters

Rachel Leigh Peters has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Active illumination source and PCB components having mountings for reduced Z-height and improved thermal conductivity
    Patent number: 10480720
    Abstract: PCBs, PCB components and PCB assemblies are provided with mounting configurations and structures for reducing Z height dimensions of the PCB assemblies and, in some instances, for improving thermal conductivity of the PCB components and assemblies. The active illumination device/source or other PCB components (e.g., camera modules and LED packages) are affixed to a mounting substrate that has a top surface that is physically and electrically mounted to a bottom surface of a PCB, with at least a portion of the active illumination device/source being concurrently positioned within one or more holes in the PCB. A thermal interface in contact with at least the mounting substrate can also be used for dissipating heat from the PCB components and PCB.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: November 19, 2019
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Raymond Kirk Price, Christopher John McMillan, Rachel Leigh Peters
  • ACTIVE ILLUMINATION SOURCE AND PCB COMPONENTS HAVING MOUNTINGS FOR REDUCED Z-HEIGHT AND IMPROVED THERMAL CONDUCTIVITY
    Publication number: 20190056067
    Abstract: PCBs, PCB components and PCB assemblies are provided with mounting configurations and structures for reducing Z height dimensions of the PCB assemblies and, in some instances, for improving thermal conductivity of the PCB components and assemblies. The active illumination device or other PCB components (e.g., camera modules and LED packages) are affixed to a mounting substrate that has a top surface that is physically and electrically mounted to a bottom surface of a PCB, with at least a portion of the active illumination device being concurrently positioned within one or more holes in the PCB. A thermal interface in contact with at least the mounting substrate can also be used for dissipating heat from the PCB components and PCB.
    Type: Application
    Filed: August 17, 2017
    Publication date: February 21, 2019
    Inventors: Raymond Kirk Price, Christopher John McMillan, Rachel Leigh Peters