Patents by Inventor Rachel Yie Fang Wai

Rachel Yie Fang Wai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8289508
    Abstract: A method of forming a device is disclosed. The method includes providing a substrate and processing a layer of the device on the substrate. The layer is inspected with an inspection tool for defects. The inspection tool is programmed with an inspection recipe determined from studying defects programmed into the layer at known locations.
    Type: Grant
    Filed: November 19, 2009
    Date of Patent: October 16, 2012
    Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
    Inventors: Victor Seng Keong Lim, Rachel Yie Fang Wai, Fang Hong Gn, Liang Choo Hsia
  • Patent number: 8178368
    Abstract: A method of forming a device is disclosed. The method includes providing a substrate on which the device is formed. It also includes forming a test cell on the substrate. The test cell includes a defect programmed into the cell to facilitate defect detection.
    Type: Grant
    Filed: November 19, 2009
    Date of Patent: May 15, 2012
    Assignee: GlobalFoundries Singapore Pte. Ltd.
    Inventors: Victor Seng Keong Lim, Rachel Yie Fang Wai, Fang Hong Gn, Liang Choo Hsia
  • Publication number: 20110114949
    Abstract: A method of forming a device is disclosed. The method includes providing a substrate on which the device is formed. It also includes forming a test cell on the substrate. The test cell includes a defect programmed into the cell to facilitate defect detection.
    Type: Application
    Filed: November 19, 2009
    Publication date: May 19, 2011
    Applicant: CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
    Inventors: Victor Seng Keong LIM, Rachel Yie Fang WAI, Fang Hong GN, Liang Choo HSIA
  • Publication number: 20110116085
    Abstract: A method of forming a device is disclosed. The method includes providing a substrate and processing a layer of the device on the substrate. The layer is inspected with an inspection tool for defects. The inspection tool is programmed with an inspection recipe determined from studying defects programmed into the layer at known locations.
    Type: Application
    Filed: November 19, 2009
    Publication date: May 19, 2011
    Applicant: CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
    Inventors: Victor Seng Keong LIM, Rachel Yie Fang WAI, Fang Hong GN, Liang Choo HSIA