Patents by Inventor Racine Elysia Auxter NASSAU

Racine Elysia Auxter NASSAU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer inspection apparatuses
    Patent number: 11688623
    Abstract: A wafer inspection apparatus includes a support structure including a frame and vacuum chucks mounted thereon, each vacuum chuck having a support surface including a vacuum suction portion, the support structure configured to structurally support a wafer on one or more vacuum chucks, the frame defining an opening larger than an area of the wafer. The wafer inspection apparatus includes an electromagnetic wave emitter configured to irradiate an inspection electromagnetic wave to the wafer, a sensor configured to receive the inspection electromagnetic wave from the wafer based on the inspection electromagnetic wave passing through the wafer, and a driver configured to move at least one of the electromagnetic wave emitter or the frame to change an irradiation location of the wafer. Each vacuum chuck is configured to be selectively movable between a first location and a second location in relation to the frame.
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: June 27, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Racine Elysia Auxter Nassau, Namil Koo, Suhwan Park, Taeheung Ahn, Sangyeon Oh
  • WAFER INSPECTION APPARATUSES
    Publication number: 20210057262
    Abstract: A wafer inspection apparatus includes a support structure including a frame and vacuum chucks mounted thereon, each vacuum chuck having a support surface including a vacuum suction portion, the support structure configured to structurally support a wafer on one or more vacuum chucks, the frame defining an opening larger than an area of the wafer. The wafer inspection apparatus includes an electromagnetic wave emitter configured to irradiate an inspection electromagnetic wave to the wafer, a sensor configured to receive the inspection electromagnetic wave from the wafer based on the inspection electromagnetic wave passing through the wafer, and a driver configured to move at least one of the electromagnetic wave emitter or the frame to change an irradiation location of the wafer. Each vacuum chuck is configured to be selectively movable between a first location and a second location in relation to the frame.
    Type: Application
    Filed: March 30, 2020
    Publication date: February 25, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Racine Elysia Auxter NASSAU, Namil KOO, Suhwan PARK, Taeheung AHN, Sangyeon OH