Patents by Inventor Radesh Jewram
Radesh Jewram has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220380547Abstract: A thermal interface material delivered as a single-component precursor mixture which reacts to form a soft, solid material. Thermally conductive particles are dispersed in the reactive polymer matrix resulting in a composite material with high thermal conductivity. A reaction inhibitor is provided so that the one-component system is stable in storage and handling at room temperature, and curable at an elevated temperature. The uncured precursor material is easily dispensed using conventional single-component automated pumping equipment, and subsequently cured in place.Type: ApplicationFiled: May 19, 2022Publication date: December 1, 2022Inventors: Ryan Verhulst, Radesh Jewram, Reid J. Chesterfield
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Publication number: 20220151108Abstract: An electronic package includes a thermal interface for dissipating heat from an electronic component array including a plurality of electronic components secured to a substrate. The thermal interface includes a thin heat spreading layer for transferring heat input from the electronic components along directions transverse to heat flux. The heat spreading layer is part of a laminate structure that is efficiently utilized by spreading thermal energy across an input plane.Type: ApplicationFiled: January 24, 2022Publication date: May 12, 2022Inventors: Radesh Jewram, Yuan Zhao
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Publication number: 20210388203Abstract: A thermally conductive curable composition includes a first part and a second part, wherein the first part comprises a catalyst, a ceramic filler mixture, a low volatile organic liquid, and water, and the second part comprises a silyl modified reactive polymer, a low volatile organic liquid, and the ceramic filler mixture, and the low volatile organic liquid is present in the composition in an amount greater than about 50 wt. % based on the total weight of the silyl modified reactive polymer.Type: ApplicationFiled: August 27, 2021Publication date: December 16, 2021Inventors: Chunyong Wu, John Timmerman, Reid Chesterfield, Radesh Jewram
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Patent number: 8430264Abstract: A package for delivery of a tacky product includes a carrier with a plurality of cavities separately disposed along a length and width thereof. Each of the cavities in the carrier tape includes a base that is sized to operably receive and support the product within the cavity. The base of each cavity includes a surface profile which defines a contact surface area that is sufficiently low so as to facilitate removal of the product from the cavity without damage to the product. In some cases, the contact surface area is less than about 50% of a base surface area of the base. The carrier may be configured to stack with other carriers without risk of damage to the tacky product.Type: GrantFiled: April 12, 2011Date of Patent: April 30, 2013Assignee: The Bergquist CompanyInventors: Radesh Jewram, William E. McIntosh, Jeremy J. Schmitz
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Patent number: 8205766Abstract: A package for delivery of a tacky product includes a carrier tape with a plurality of cavities separately disposed along a length thereof. Each of the cavities in the carrier tape includes a base that is sized to operably receive and support the product. The base of each cavity includes a surface profile which defines a contact surface area that is sufficiently low so as to facilitate removal of the product from the cavity without damage to the product. In some cases, the contact surface area is less than about 50% of a base surface area of the base. The carrier tape may be configured for use in tape and reel packaging systems.Type: GrantFiled: May 20, 2009Date of Patent: June 26, 2012Assignee: The Bergquist CompanyInventors: Radesh Jewram, William E. McIntosh
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Patent number: 8110919Abstract: A package includes a thermal interface member which includes a bulk layer and a surface layer that is disposed on at least a portion of a surface of the bulk layer. The surface layer is highly thermally conductive, has a melting point exceeding a solder reflow temperature, and has a maximum cross-sectional thickness of less than about 10 microns.Type: GrantFiled: August 18, 2010Date of Patent: February 7, 2012Assignee: The Bergquist CompanyInventors: Radesh Jewram, Sanjay Misra
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Patent number: 8076773Abstract: A thermal interface member includes a bulk layer and a surface layer that is disposed on at least a portion of a surface of the bulk layer. The surface layer is highly thermally conductive, has a melting point exceeding a solder reflow temperature, and has a maximum cross-sectional thickness of less than about 10 microns.Type: GrantFiled: December 26, 2007Date of Patent: December 13, 2011Assignee: The Bergquist CompanyInventors: Radesh Jewram, Sanjay Misra
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Publication number: 20110186586Abstract: A package for delivery of a tacky product includes a carrier with a plurality of cavities separately disposed along a length and width thereof. Each of the cavities in the carrier tape includes a base that is sized to operably receive and support the product within the cavity. The base of each cavity includes a surface profile which defines a contact surface area that is sufficiently low so as to facilitate removal of the product from the cavity without damage to the product. In some cases, the contact surface area is less than about 50% of a base surface area of the base. The carrier may be configured to stack with other carriers without risk of damage to the tacky product.Type: ApplicationFiled: April 12, 2011Publication date: August 4, 2011Inventors: Radesh Jewram, William E. McIntosh, Jeremy J. Schmitz
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Publication number: 20100309634Abstract: A package includes a thermal interface member which includes a bulk layer and a surface layer that is disposed on at least a portion of a surface of the bulk layer. The surface layer is highly thermally conductive, has a melting point exceeding a solder reflow temperature, and has a maximum cross-sectional thickness of less than about 10 microns.Type: ApplicationFiled: August 18, 2010Publication date: December 9, 2010Inventors: Radesh Jewram, Sanjay Misra
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Patent number: 7760507Abstract: An interconnect structure for operable placement between a first body and a second body, wherein the interconnect structure includes a first surface for operable juxtaposition with the first body, a second surface for operable juxtaposition with the second body, and a thickness dimension defined between the first and second surfaces. The interconnect structure includes a first thermally conductive material and a second electrically conductive material, wherein the second electrically conductive material is formed in one or more distinct structures, with the structures forming at least one substantially continuous pathway of the second material through the thickness dimension. The interconnect structure exhibits a compressive modulus along a thickness axis of less than about 100 psi.Type: GrantFiled: December 26, 2007Date of Patent: July 20, 2010Assignee: The Bergquist CompanyInventors: Radesh Jewram, Sanjay Misra
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Publication number: 20090166854Abstract: A thermal interface member includes a bulk layer and a surface layer that is disposed on at least a portion of a surface of the bulk layer. The surface layer is highly thermally conductive, has a melting point exceeding a solder reflow temperature, and has a maximum cross-sectional thickness of less than about 10 microns.Type: ApplicationFiled: December 26, 2007Publication date: July 2, 2009Inventors: Radesh Jewram, Sanjay Misra
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Publication number: 20090168354Abstract: An interconnect structure for operable placement between a first body and a second body, wherein the interconnect structure includes a first surface for operable juxtaposition with the first body, a second surface for operable juxtaposition with the second body, and a thickness dimension defined between the first and second surfaces. The interconnect structure includes a first thermally conductive material and a second electrically conductive material, wherein the second electrically conductive material is formed in one or more distinct structures, with the structures forming at least one substantially continuous pathway of the second material through the thickness dimension. The interconnect structure exhibits a compressive modulus along a thickness axis of less than about 100 psi.Type: ApplicationFiled: December 26, 2007Publication date: July 2, 2009Inventors: Radesh Jewram, Sanjay Misra
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Patent number: 6984685Abstract: A stabilized thermally conductive mechanical compliant laminate pad to be interposed between opposed surfaces of a generating semi-conductor device and a heat sink, with the laminate pad comprising upper and lower laminae on opposed surfaces of a central stabilizing apertured grid. The laminae are subjected to a compressive force at an elevated temperature until portions of the laminae extend through the apertures to form a continuum. The laminae comprise a polymer matrix having a quantity of a low melting indium or gallium alloy and a thermally conductive particulate dispersed there through, with the polymer matrix being a hot wax or melt resin. With the upper and lower laminae positioned on opposed surfaces of a central stabilizing apertured grid a compressive load is applied to force portions of said laminae to pass through apertures in the mesh grid to form a continuum.Type: GrantFiled: October 24, 2002Date of Patent: January 10, 2006Assignee: The Bergquist CompanyInventors: Sanjay Misra, Radesh Jewram, G M Fazley Elahee
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Patent number: 6657297Abstract: A flexible plastic thermally conductive multilayer semiconductor mounting pad having a highly thermally conductive bulk layer with thermally conductive surface skin layers bonded integrally to opposed major surfaces thereof. The bulk layer and the surface skin layers are each filled with a finely divided thermally conductive particulate, with the skin layers being harder than the bulk layer and being blended with an amount of filler which is less than that present in the bulk layer.Type: GrantFiled: August 15, 2002Date of Patent: December 2, 2003Assignee: The Bergquist CompanyInventors: Radesh Jewram, Kasyap Venkata Seethamraju, Kevin L. Hanson
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Publication number: 20030187116Abstract: A stabilized thermally conductive mechanical compliant laminate pad to be interposed between opposed surfaces of a generating semi-conductor device and a heat sink, with the laminate pad comprising upper and lower laminae on opposed surfaces of a central stabilizing apertured grid. The laminae are subjected to a compressive force at an elevated temperature until portions of the laminae extend through the apertures to form a continuum. The laminae comprise a polymer matrix having a quantity of a low melting indium or gallium alloy and a thermally conductive particulate dispersed there through, with the polymer matrix being a hot wax or melt resin. With the upper and lower laminae positioned on opposed surfaces of a central stabilizing apertured grid a compressive load is applied to force portions of said laminae to pass through apertures in the mesh grid to form a continuum.Type: ApplicationFiled: October 24, 2002Publication date: October 2, 2003Applicant: The Bergquist CompanyInventors: Sanjay Misra, Radesh Jewram, G M Fazley Elahee
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Patent number: 6399209Abstract: A thermally conductive conformable interface pad for inter-position between a heat generating solid state electronic device and a heat sinking surface. The interface comprises a laminate of at least two layers, including a relatively soft conformable body layer with at least one surface consisting of an integrally bonded anti-blocking layer. The conformable body layer preferably comprises a thermally stable wax consisting of an alkyl substituted poly (hydro, methyl-siloxane) wax and a thermally conductive particulate solid, while the anti-blocking layer may comprise a mixture of an alkyl substituted poly (hydro, methyl-siloxane) wax and a silicone wax, a glassy polyester layer, or a cross-linked acrylic layer.Type: GrantFiled: March 28, 2000Date of Patent: June 4, 2002Assignee: The Bergquist CompanyInventors: Sanjay Misra, Robert E. Kranz, Radesh Jewram