Patents by Inventor Radha Nayak

Radha Nayak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MULTI-FUNCTION ACTIVE ACCESSORIES FOR LED LAMPS
    Publication number: 20230313977
    Abstract: Apparatus and methods of attaching accessories to LED lamps and for providing active accessories in LED lamps are disclosed. The active accessories include single-function active accessories as well as multi-function active accessories.
    Type: Application
    Filed: January 12, 2023
    Publication date: October 5, 2023
    Inventors: LASZLO TAKACS, WILFRED A. MARTIS, FRANK SHUM, ARTEM MISHIN, VINOD KHOSLA, RADHA NAYAK, MICHAEL RAGAN KRAMES
  • MULTI-FUNCTION ACTIVE ACCESSORIES FOR LED LAMPS
    Publication number: 20200056765
    Abstract: Apparatus and methods of attaching accessories to LED lamps and for providing active accessories in LED lamps are disclosed. The active accessories include single-function active accessories as well as multi-function active accessories.
    Type: Application
    Filed: August 26, 2019
    Publication date: February 20, 2020
    Inventors: LASZLO TAKACS, WILFRED A. MARTIS, FRANK SHUM, ARTEM MISHIN, VINOD KHOSLA, RADHA NAYAK, MICHAEL RAGAN KRAMES
  • Multi-function active accessories for LED lamps
    Patent number: 10436422
    Abstract: Apparatus and methods of attaching accessories to LED lamps and for providing active accessories in LED lamps are disclosed. The active accessories include single-function active accessories as well as multi-function active accessories.
    Type: Grant
    Filed: November 17, 2014
    Date of Patent: October 8, 2019
    Assignee: SORAA, INC.
    Inventors: Laszlo Takacs, Wilfred A. Martis, Frank Shum, Artem Mishin, Vinod Khosla, Radha Nayak, Michael Ragan Krames
  • Backside etching in a scrubber
    Patent number: 6921494
    Abstract: A scrubber device is provided. The scrubber device may etch a backside of a wafer and may clean a frontside of the wafer simultaneously. The scrubber device may comprise a programmed controller adapted to supply a non-etching fluid to a frontside of the wafer whenever an etching fluid is supplied to the backside of the wafer.
    Type: Grant
    Filed: June 6, 2003
    Date of Patent: July 26, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Brian J. Brown, Madhavi Chandrachood, Radha Nayak, Fred C. Redeker, Michael Sugarman, John M. White
  • Backside etching in a scrubber
    Publication number: 20030209255
    Abstract: A scrubber device is provided. The scrubber device may etch a backside of a wafer and may clean a frontside of the wafer simultaneously. The scrubber device may comprise a programmed controller adapted to supply a non-etching fluid to a frontside of the wafer whenever an etching fluid is supplied to the backside of the wafer.
    Type: Application
    Filed: June 6, 2003
    Publication date: November 13, 2003
    Applicant: Applied Materials, Inc.
    Inventors: Brian J. Brown, Madhavi Chandrachood, Radha Nayak, Fred C. Redeker, Michael Sugarman, John M. White
  • Method and apparatus for removal of unwanted electroplating deposits
    Publication number: 20030038107
    Abstract: An apparatus and associated method for removing deposits from a substrate. In one aspect, a system is provided which supplies etchant to an edge bead removal chamber. The apparatus includes an etchant delivery system, an etchant tank, a sensor, and a mixing tank.
    Type: Application
    Filed: October 11, 2002
    Publication date: February 27, 2003
    Applicant: Applied Materials, Inc.
    Inventors: Radha Nayak, Yezdi Dordi, Joseph Stevens, Peter Hey
  • Apparatus with etchant mixing assembly for removal of unwanted electroplating deposits
    Patent number: 6494219
    Abstract: Embodiments of the invention generally provide an etchant mixing assembly for a semiconductor processing system. The etchant mixing assembly includes at least one acid source, at least one oxidizer source, a mixing tank selectively in fluid communication with the at least one acid source and the at least one oxidizer source, and a mixed etchant tank in fluid communication with the mixing tank. Additionally, a system controller configured to sense a low level of fluid in the mixed etchant tank, cause a fresh fluid solution to be mixed in the mixing tank, and cause the fresh fluid solution to the communicated to the mixed etchant tank is also provided in the etchant mixing assembly.
    Type: Grant
    Filed: July 12, 2000
    Date of Patent: December 17, 2002
    Assignee: Applied Materials, Inc.
    Inventors: Radha Nayak, Yezdi Dordi, Joseph Stevens, Peter Hey
  • Chemical mixture for copper removal in electroplating systems
    Publication number: 20020048953
    Abstract: A method and chemical composition for selectively etching unwanted metal deposits on a surface of a wafer. In one aspect, a method of processing a substrate is provided which includes providing a substrate to an edge bead removal system, and applying a chemical etchant comprising citric acid and an oxidizing agent to the substrate. In one aspect, a chemical composition of citric acid and hydrogen peroxide is provided which is a relatively weak acid having a pH greater than about 1.0.
    Type: Application
    Filed: June 15, 2001
    Publication date: April 25, 2002
    Inventor: Radha Nayak