Patents by Inventor Radisa Boskovic

Radisa Boskovic has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Spout pouch and method of making same
    Patent number: 11938709
    Abstract: The present disclosure includes a process for making a package having a spout. The process includes heating a sealing area of a spout to a temperature at or above a melting point of the spout material; heating two multilayer structures around a portion of their peripheries to adhere the peripheries of sealant layers and form a partially sealed package having an opening; inserting the heated spout into the opening; and pressing opposing surfaces of the two multilayer structures around the spout to close the opening around the spout. Each multilayer structure includes a multilayer film having the sealant layer having at least 40% by weight of an ethylene-based polymer having a melting point below 112 C; an external layer including an ethylene-based polymer; and at least one intermediate layer disposed between the sealant layer and the external layer having a melting point at least 15 C higher than the sealant layer.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: March 26, 2024
    Assignee: Dow Global Technologies LLC
    Inventors: Luis Alberto Santini, Radisa Boskovic, Peter Hermann Roland Sandkuehler, Ramon Pradas Cortina, Marti Nogué I Arbusa, Carlos Almor Morujo
  • SPOUT POUCH AND METHOD OF MAKING SAME
    Publication number: 20210162728
    Abstract: The present disclosure includes a process for making a package having a spout. The process includes heating a sealing area of a spout to a temperature at or above a melting point of the spout material; heating two multilayer structures around a portion of their peripheries to adhere the peripheries of sealant layers and form a partially sealed package having an opening; inserting the heated spout into the opening; and pressing opposing surfaces of the two multilayer structures around the spout to close the opening around the spout. Each multilayer structure includes a multilayer film having the sealant layer having at least 40% by weight of an ethylene-based polymer having a melting point below 112 C; an external layer including an ethylene-based polymer; and at least one intermediate layer disposed between the sealant layer and the external layer having a melting point at least 15 C higher than the sealant layer.
    Type: Application
    Filed: May 15, 2019
    Publication date: June 3, 2021
    Applicant: Dow Global Technologies LLC
    Inventors: Luis Alberto Santini, Radisa Boskovic, Peter Hermann Roland Sandkuehler, Ramon Pradas Cortina, Marti Nogué I Arbusa, Carlos Almor Morujo