Patents by Inventor Rae-Hong Cho

Rae-Hong Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Insulating Adhesive Composition for Metal-Based Copper Clad Laminate (MCCL), Coated Metal Plate Using Same, and Method for Manufacturing Same
    Publication number: 20140377453
    Abstract: The present invention relates to an insulating adhesive composition for metal printed circuit board, an adhesive-coated metal plate using the same, and a method for manufacturing the adhesive-coated metal plate. The adhesive composition according to the present invention forms an adhesive layer that is excellent in terms of adhesion to a copper foil, electrical insulating properties, and thermal resistance. The composition contains a specific epoxy resin, a curing agent and alumina. According to the present invention, in coating the metal plate with the solvent type adhesive, a roll coating method is used to perform a continuous coating process on the metal plate, thereby improving productivity when compared to the general method using a sheet type adhesive film.
    Type: Application
    Filed: December 21, 2012
    Publication date: December 25, 2014
    Inventors: Chan Sup Park, Rae-Hong Cho, Dong Hyon Kim, Kyung Ho Park, Sang-Kwon Han, Chong Soo Park, Bae Geun Lee, Jung Bong Kim, Jae Man Han, Tae Kyoo Shin, Dae Chul Bae