Patents by Inventor Raf Vandersmissen

Raf Vandersmissen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for transferring and stacking of semiconductor devices
    Patent number: 6812078
    Abstract: A method is presented in which an active element, e.g. a semiconductor device, is embedded in a passive circuitry formed on a low-cost substrate, having good dielectric properties. After forming the active element on a first substrate, the active elements are singulated and transferred to a second substrate. The active element is bonded to this second substrate and the portion of the first substrate, on which this active element is created, is removed selectively to the active element and the low-cost substrate. On this second substrate passive circuitry may be present or it can be formed after the attachment of the active element. The passive circuitry is interconnected to the active element or other components or dies present on the low-cost substrate.
    Type: Grant
    Filed: February 21, 2003
    Date of Patent: November 2, 2004
    Assignees: IMEC, vzw, Umicore
    Inventors: Staf Borghs, Eric Beyne, Raf Vandersmissen
  • Method for transferring and stacking of semiconductor devices
    Publication number: 20040029329
    Abstract: A method is presented in which an active element, e.g. a semiconductor device, is embedded in a passive circuitry formed on a low-cost substrate, having good dielectric properties. After forming the active element on a first substrate, the active elements are singulated and transferred to a second substrate. The active element is bonded to this second substrate and the portion of the first substrate, on which this active element is created, is removed selectively to the active element and the low-cost substrate. On this second substrate passive circuitry may be present or it can be formed after the attachment of the active element. The passive circuitry is interconnected to the active element or other components or dies present on the low-cost substrate.
    Type: Application
    Filed: February 21, 2003
    Publication date: February 12, 2004
    Inventors: Staf Borghs, Eric Beyne, Raf Vandersmissen
  • Method for transferring and stacking of semiconductor devices
    Patent number: 6576505
    Abstract: A method is presented in which an active element, e.g. a semiconductor device, is embedded in a passive circuitry formed on a low-cost substrate, having good dielectric properties. After forming the active element on a first substrate, the active elements are singulated and transferred to a second substrate. The active element is bonded to this second substrate and the portion of the first substrate, on which this active element is created, is removed selectively to the active element and the low-cost substrate. On this second substrate passive circuitry may be present or it can be formed after the attachment of the active element. The passive circuitry is interconnected to the active element or other components or dies present on the low-cost substrate.
    Type: Grant
    Filed: January 29, 2001
    Date of Patent: June 10, 2003
    Assignees: Imec, VZW, Umicore
    Inventors: Staf Borghs, Eric Beyne, Raf Vandersmissen
  • METHOD FOR TRANSFERRING AND STACKING OF SEMICONDUCTOR DEVICES
    Publication number: 20030040145
    Abstract: A method is presented in which an active element, e.g. a semiconductor device, is embedded in a passive circuitry formed on a low-cost substrate, having good dielectric properties. After forming the active element on a first substrate, the active elements are singulated and transferred to a second substrate. The active element is bonded to this second substrate and the portion of the first substrate, on which this active element is created, is removed selectively to the active element and the low-cost substrate. On this second substrate passive circuitry may be present or it can be formed after the attachment of the active element. The passive circuitry is interconnected to the active element or other components or dies present on the low-cost substrate.
    Type: Application
    Filed: January 29, 2001
    Publication date: February 27, 2003
    Inventors: Staf Borghs, Eric Beyne, Raf Vandersmissen