Patents by Inventor Rafael Augusto Prieto Herrera

Rafael Augusto Prieto Herrera has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat-transferring and electrically connecting device and electronic device
    Patent number: 10480833
    Abstract: A heat-transferring device is formed by a stack that includes at least one heat-conducting layer and at least one heat-absorbing layer. The at least one heat-conducting layer has at least one heat-collecting section placed facing a heat source and at least one heat-evacuating section placed facing a heat sink. The at least one heat-absorbing layer includes a phase-change material. One face of the at least one heat-absorbing layer is adjoined to at least one portion of at least one face of the heat-conducting layer.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: November 19, 2019
    Assignees: STMicroelectronics (Crolles 2) SAS, STMicroelectronics SA
    Inventors: Rafael Augusto Prieto Herrera, Jean-Philippe Colonna, Perceval Coudrain
  • Electronic device provided with a thermal dissipation member
    Patent number: 9997431
    Abstract: An electronic device includes a support and a component in the form of an integrated circuit chip having a rear face mounted above a front face of the support and a front face opposite its rear face. A block is provided for at least partially encapsulating the component above the front face of the support. The device also includes at least one thermal dissipation member having a flexible sheet having at least two portions folded onto one another while forming at least one fold between them, these portions facing one another at least partly.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: June 12, 2018
    Assignees: STMicroelectronics (Crolles 2) SAS, STMicroelectronics SA, Commissariat A L'Energie Atomique et aux Energies Alternatives
    Inventors: Rafael Augusto Prieto Herrera, Jean-Philippe Colonna, Perceval Coudrain
  • HEAT-TRANSFERRING AND ELECTRICALLY CONNECTING DEVICE AND ELECTRONIC DEVICE
    Publication number: 20180142923
    Abstract: A heat-transferring device is formed by a stack that includes at least one heat-conducting layer and at least one heat-absorbing layer. The at least one heat-conducting layer has at least one heat-collecting section placed facing a heat source and at least one heat-evacuating section placed facing a heat sink. The at least one heat-absorbing layer includes a phase-change material. One face of the at least one heat-absorbing layer is adjoined to at least one portion of at least one face of the heat-conducting layer.
    Type: Application
    Filed: November 2, 2017
    Publication date: May 24, 2018
    Applicants: STMicroelectronics (Crolles 2) SAS, STMicroelectronics SA
    Inventors: Rafael Augusto Prieto Herrera, Jean-Philippe Colonna, Perceval Coudrain
  • ELECTRONIC DEVICE PROVIDED WITH A THERMAL DISSIPATION MEMBER
    Publication number: 20170287806
    Abstract: An electronic device includes a support and a component in the form of an integrated circuit chip having a rear face mounted above a front face of the support and a front face opposite its rear face. A block is provided for at least partially encapsulating the component above the front face of the support. The device also includes at least one thermal dissipation member having a flexible sheet having at least two portions folded onto one another while forming at least one fold between them, these portions facing one another at least partly.
    Type: Application
    Filed: March 7, 2017
    Publication date: October 5, 2017
    Applicants: STMicroelectronics (Crolles 2) SAS, STMicroelectronics SA, Commissariat A L'Energie Atomique et aux Energies Alternatives
    Inventors: Rafael Augusto Prieto Herrera, Jean-Philippe Colonna, Perceval Coudrain