Abstract: An electronic device includes a substrate, a semiconductor die, and a molded package structure that encloses a portion of the semiconductor die and extends to a portion of the substrate. A sensor surface extends along a side of the semiconductor die, and conductive terminals extend outward from the side and have ends soldered to conductive features of the substrate. The side of the semiconductor die is spaced apart from the substrate and the conductive terminals forming a cage structure that laterally surrounds the sensor surface. The molded package structure has a cavity that extends between the sensor surface and the substrate, and the cavity extends in an interior of a cage structure formed by the conductive terminals.

Abstract: A semiconductor die includes a substrate including a semiconductor surface including circuitry electrically connected to die bond pads that include a first die bond pad exposed by a passivation layer, a top dielectric layer over the passivation layer, and a metal layer electrically connected to the first die bond pad. A pillar is on the metal layer over the first die bond pad, and a solder cap is on a top side of the pillar. The solder cap includes an essentially vertical sidewall portion generally beginning at a top corner edge of the pillar.

Abstract: A semiconductor package includes a semiconductor die having a device side, a conductive layer coupled to the device side, a conductive pillar coupled to the conductive layer, the conductive pillar having an upper portion and a base portion, the upper portion having a wider diameter than the base portion and the conductive pillar either having a mushroom shape or having sloped sides on the base portion extending away from the upper portion to the conductive layer, a polyimide layer coupled to the conductive layer and surrounding the conductive pillar, a solder layer coupled to the conductive pillar, wherein the polyimide layer does not extend between a top surface of the conductive pillar and the solder layer, and a conductive terminal coupled to the solder layer and exposed to a surface of the semiconductor package, the device side of the semiconductor die facing the conductive terminal.