Patents by Inventor Rafael Jose Lizares GUEVARA, III

Rafael Jose Lizares GUEVARA, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11145612
    Abstract: A method for manufacturing an integrated circuit package includes depositing a first layer of metal at a location of a first metal post that is for connecting an IC die to an external circuit. The method also includes depositing a second layer of metal at the location of the first metal post, and a first layer of metal at a location of a second metal post that is for connecting the IC die to an external circuit.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: October 12, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Rafael Jose Lizares Guevara, III
  • Publication number: 20190206820
    Abstract: A method for manufacturing an integrated circuit package includes depositing a first layer of metal at a location of a first metal post that is for connecting an IC die to an external circuit. The method also includes depositing a second layer of metal at the location of the first metal post, and a first layer of metal at a location of a second metal post that is for connecting the IC die to an external circuit.
    Type: Application
    Filed: December 28, 2017
    Publication date: July 4, 2019
    Inventor: Rafael Jose Lizares GUEVARA, III