Abstract: The present disclosure is generally directed to a variety of thermally conductive materials for use in semiconductor devices or other applications. In some cases, the materials may include aligned fibers such as carbon fibers, e.g., defining a substrate, and a metal such as solder. In some cases, the metal may be present within a transition metal rich solder alloy, a conductive medium such as a conductive ink, a thermal chemical vapor deposited solder, an oxide coated liquid metal, an oxide coated liquid metal transition metal rich solder alloy, etc. The metal may have a relatively low melting temperature in certain embodiments. The metal may be interspersed or infiltrated between the plurality of discontinuous fibers, and/or surround at least some of the fibers. In some cases, the metal may react with the carbon fibers to form metal carbides and/or diffuse into the carbon fibers, which may facilitate contact between the metal and the carbon fibers.