Patents by Inventor Rafal Mickiewicz

Rafal Mickiewicz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8950267
    Abstract: Methods and apparatus for detecting cross-linking in a polymer, wherein, in some exemplary implementations, the polymer may constitute an encapsulation layer for a photovoltaic module. In one example, a polymer sample is physically deformed, and sample information relating to a relaxation or a recovery of the polymer sample in response to the deformation is obtained. The sample information is then compared to reference information relating to cross-linking of the polymeric material so as to determine a degree of cross-linking in the tested polymer sample. In one aspect, such a determination of polymer cross-linking is achieved without adversely affecting a relevant functionality of the polymer/encapsulation layer (e.g., without destruction to the polymer/encapsulation layer).
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: February 10, 2015
    Assignee: Fraunhofer USA, Inc.
    Inventors: Dan Doble, Rafal Mickiewicz, John Lloyd, Marco Jaeger, William F. Hartman
  • Publication number: 20120118071
    Abstract: Methods and apparatus for detecting cross-linking in a polymer, wherein, in some exemplary implementations, the polymer may constitute an encapsulation layer for a photovoltaic module. In one example, a polymer sample is physically deformed, and sample information relating to a relaxation or a recovery of the polymer sample in response to the deformation is obtained. The sample information is then compared to reference information relating to cross-linking of the polymeric material so as to determine a degree of cross-linking in the tested polymer sample. In one aspect, such a determination of polymer cross-linking is achieved without adversely affecting a relevant functionality of the polymer/encapsulation layer (e.g., without destruction to the polymer/encapsulation layer).
    Type: Application
    Filed: September 15, 2011
    Publication date: May 17, 2012
    Applicant: Fraunhofer USA, Inc.
    Inventors: Dan Doble, Rafal Mickiewicz, John Lloyd, Marco Jaeger, William F. Hartman