Abstract: Examples of the disclosure relate to heat exchangers. The heat exchangers could be evaporators or condensers. The heat exchangers can comprise a plurality of structures extending from a base plate where adjacent structures are separated by at least a first distance. The heat exchangers can also comprise at least one cover plate positioned over ends of the plurality of structures so that the at least one cover plate is spaced from the ends of the plurality of structures by a second distance where the second distance is smaller than the first distance. The at least one cover plate is brazed to the plurality of structures by brazing material provided between the ends of the plurality of structures and the at least one cover plate.

Abstract: Examples of the disclosure relate to an apparatus. The apparatus comprises a housing portion and a flexible portion. The housing portion comprises one or more heat sources. The flexible portion is configured to be moved between a closed configuration and an open configuration wherein in the closed configuration the flexible portion is housed in the housing portion and in the open configuration the flexible portion is positioned outside of the housing. The flexible portion comprises a flexible display and an oscillating heat pipe. The oscillating heat pipe is coupled to the one or more heat sources in the housing portion. The oscillating heat pipe is flexible and configured to move with the flexible portion between the closed configuration and the open configuration. One or more condenser regions of the oscillating heat pipe are positioned in the flexible portion.

Abstract: Examples of the disclosure relate to a three-dimensional chip. The three-dimensional chip includes a plurality of integrated circuit layers and one or more microfluidic channel layers. The plurality of integrated circuit layers includes one or more electronic and/or photonic components and are arranged in a stack. The one or more microfluidic channel layers are positioned between integrated circuit layers. The microfluidic channel layers include microfluidic channels and the microfluidic channels are configured to enable working fluid to flow through the microfluidic channels to provide passive heat transfer for the one or more electronic and/or photonic components in the integrated circuit layers. The microfluidic channels include one or more portions that extend along a microfluidic channel layer and one or more portions that extend through a microfluidic channel layer.

Abstract: Examples of the disclosure relate to heat exchangers. The heat exchangers can comprise a plurality of channels configured for flow of working fluid. The plurality of channels can be configured to move between a non-expanded configuration and an expanded configuration such that, in the non-expanded configuration the plurality of channels are sized so as to allow for movement of the heat exchanger relative to one or more heat sources and in the expanded configuration the plurality of channels are sized so as to restrict movement of the heat exchanger relative to the one or more heat sources. The plurality of channels are configured so that changes in internal pressure of the working fluid causes the plurality of channels to move between the non-expanded configuration and the expanded configuration.

Abstract: Examples of the disclosure relate to an apparatus comprising means for: receiving a plurality of input values comprising physical parameters of, at least part of, a cooling system; using the received input values to estimate dimensionless ratios providing a measure of at least one of; heat transfer within at least part of a cooling system, pressure loss within at least part of a cooling system; using the dimensionless ratios to determine at least one performance metric of at least part of a cooling system; and using at least one determined performance metric to control one or more physical parameters of at least part of a cooling system.

Abstract: A cooling apparatus includes thermosyphon loops for cooling multiple electronic devices. Each of the thermosyphon loops includes at least one evaporator and at least one condenser. Sensors within the thermosyphon loop measure can measure various parameters such as vapour quality within an inlet and outlet of at least one of the evaporators, total heat load of at least one of the evaporators; and the liquid level in a downcomer of the thermosyphon loop.

Abstract: Systems, devices and methods for providing cooling to hardware components, and more specifically to manifold systems, devices and methods for thermal management of hardware in computer server racks and related equipment in computer data centers.

Abstract: Systems, devices, and methods for providing a passive coolant distributions unit (pCDU) to promote refrigerant flow circulation, manage and monitor refrigerant inventory in a closed loop system.

Abstract: The application relates to a heat exchanger apparatus comprising: a channel for fluid flow extending between an inlet and an outlet; a porous layer dividing a first portion of the channel from a second portion of the channel, wherein the porous layer comprises a plurality of pores configured to enable fluid to be transferred from the first portion of the channel to the second portion of the channel; a plurality of evaporator structures located within the second portion of the channel wherein the evaporator structures comprise a wicking layer configured to enable evaporation of fluid from the surface of the evaporator structures; an ejector section configured to combine fluid from the first portion of the channel with fluid from the second portion of the channel and provide the combined fluid to the outlet.

Abstract: Examples of the disclosure relate to an oscillating heat pipe. The oscillating heat pipe includes a channel, a wick structure and a vent. The channel is configured to enable flow of working fluid between at least one condenser region and at least one evaporator region. The wick structure is in fluidic connection with the channel so as to enable working fluid to flow from the channel into the wick structure. The vent is configured to enable working fluid in an, at least partial, vapour phase to be returned from the wick structure to the channel.

Abstract: A device and method are provided for more efficient thermal management of optoelectronic devices. A microfluidic distribution apparatus embedded with the optoelectronic device uses a working fluid in phase change to passively remove heat from an optoelectronic device. The working fluid undergoes phase change through various conversions between a liquid state and a two-phase liquid-vapor state to facilitate evaporation and condensation processes as the working fluid is distributed through micro-structures in the embedded microfluidic distribution apparatus. Passive two-phase cooling provides high thermal performance due to the use of the latent heat of a fluid in phase change, as well as the presence of favorable two-phase flow regimes at micro-scale dimensions.

Abstract: An apparatus for cooling electronic circuitry components and photonic components. In examples of the disclosure at least one photonic component is positioned overlaying at least one electronic circuitry component. In examples of the disclosure there is also provided a spacer for spacing the at least one electronic circuitry component and the at least one photonic component, wherein the spacer for spacing are thermally insulating. In examples of the disclosure there is also provided a first heat transfer configured to remove heat from the at least one electronic circuitry component, and a second heat transfer configured to remove heat from the at least one photonic component.

Abstract: Examples of the disclosure relate to a cooling system for cooling one or more electronic components. The cooling system comprises at least one two-phase cooling system configured to cool one or more electronic components that are thermally coupled to the at least one two-phase cooling system and at least one air-cooling system configured to cool one or more electronic components. The at least one air-cooling system comprises at least one heat exchanger within the at least one air-cooling system wherein the at least one heat exchanger is coupled to a two-phase cooling system or a liquid phase cooling system. The at least one air-cooling system also comprises recirculation means configured to re-circulate air through the at least one air-cooling system to the one or more electronic components.

Abstract: Examples of the disclosure relate to an oscillating heat pipe comprising for cooling components within a bendable electronic device. The oscillating heat pipe comprises at least one condenser region to be positioned in a first portion of the bendable electronic device and at least one evaporator region to be positioned in a second portion of the bendable electronic device. The oscillating heat pipe also comprises at least one bendable region provided between the condenser region and the evaporator region and configured to extend across a hinge of a bendable electronic device wherein at least one bendable region comprises a polymer tubing supported by a flexible helical support structure.

Abstract: A device and method are provided for more efficient thermal management of optoelectronic devices. A microfluidic distribution apparatus embedded with the optoelectronic device uses a working fluid in phase change to passively remove heat from an optoelectronic device. The working fluid undergoes phase change through various conversions between a liquid state and a two-phase liquid-vapor state to facilitate evaporation and condensation processes as the working fluid is distributed through micro-structures in the embedded microfluidic distribution apparatus. Passive two-phase cooling provides high thermal performance due to the use of the latent heat of a fluid in phase change, as well as the presence of favorable two-phase flow regimes at micro-scale dimensions.