Abstract: A method of measuring vapor flux density including directing a light beam through a vapor flux to a pixel array sensor and using the pixel array sensor to measure attenuation of the light beam.

Abstract: An inline vacuum deposition system contains thermal source pairs configured in adjacent deposition zones. Dopant sources allow the electrical characteristics of the sequentially formed layers to be controlled for a preferred deposition growth profile.

Abstract: A flux monitor system includes a light source and a sensor.

Abstract: A flux monitor system includes a light source and a sensor.

Abstract: A particle detector for evaporation flux is disclosed. The particle detector includes a light source and at least one reflective surface.

Abstract: A photovoltaic module has a diagonal mounting bracket for structural attachment of the module to a support structure. The photovoltaic module has a back cover with an outer surface and a diagonal mounting bracket is attached to the back cover and extends along at least a portion of a diagonal of the back cover. A method of forming a photovoltaic module with a diagonal mounting bracket is also described.

Abstract: A probe head for testing semiconductor wafers has a probe contactor substrate have a first side and a second side. A plurality of probe contactor tips are coupled to the first side and the plurality of tips lie in a first plane. A plurality of mounting structures are coupled to the second side with each of the mounting structures each having a top surface lying in a second plane, wherein the first plane is substantially parallel to the second plane.

Abstract: A pumping and valve control device can be used in an atomic layer deposition system.

Abstract: A selenium deposition system can improve the selenium vapor distribution.

Abstract: A deposition system includes a load lock chamber for receiving a substrate and exposing a substrate to a load lock temperature and load lock pressure suitable to prepare a substrate for subsequent low-pressure and high-temperature processing or for ambient temperature and pressure conditions.

Abstract: A particle detector for evaporation flux is disclosed. The particle detector includes a light source and at least one reflective surface.

Abstract: An vapor deposition control system includes a multi-level control scheme.

Abstract: A photovoltaic structure can include a protective cap, which can include sodium.

Abstract: A flux monitor system includes a light source and a sensor.

Abstract: The present invention relates to A microfabricated tip and post structure comprising a post having a rough top surface that diffuses incident light and a cross-section, and a tip, lithographically plated on the rough top surface of the post, having a smooth reflective surface appropriate for automatic vision recognition, and having a cross-section that is less than the cross-section of the post.

Abstract: The present invention is directed to a probe head having a probe contactor substrate with at least one slot that passes through the probe contactor substrate, at least one probe contactor adapted to test a device under test, with the probe contactor being coupled to the a top side of the probe contactor substrate and electrically connected to a terminal also disposed on top of the probe contactor substrate, and a space transformer having at least one bond pad coupled to a top side of the space transformer, and a bond interconnect which electrically couples the bond pad to the terminal through the slot in the probe contactor substrate.

Abstract: A method for repairing a damaged probe from a probe card comprising the steps of removing the damaged probe from the probe card, separating one a plurality of replacement probes from a substrate and installing the one probe separated from the plurality of replacement probes where the damaged probe was removed.

Abstract: A probe card assembly has a probe contactor substrate having a plurality of probe contactor tips thereon and a probe card wiring board with an interposer disposed between the two. Support posts contacting the probe contactor substrate are vertically adjustable until secured by a locking mechanism which is coupled to the probe card wiring board. When the posts are secured in a fixed position, the position is one in which the plane of the plurality of probe contactor substrates is substantially parallel to a predetermined reference plane.

Abstract: A probe card assembly has a probe contactor substrate having a plurality of probe contactor tips thereon and a probe card wiring board with an interposer disposed between the two. Support posts contacting the probe contactor substrate are vertically adjustable until secured by a locking mechanism which is coupled to the probe card wiring board. When the posts are secured in a fixed position, the position is one in which the plane of the plurality of probe contactor substrates is substantially parallel to a predetermined reference plane.

Abstract: The present invention relates to a probe for making electrical connection to a contact pad on a microelectronic device. A foot having a length, a thickness, a width, a proximal end, and a distal end, is connected to a substrate. The length of the foot is greater than its width. A torsion bar having a length, a width, a thickness, a proximal end, and a distal end, is connected to the distal end of the foot at the proximal end of torsion bar. The torsion bar lies in a first plane. A spacer having a length, a width, and a thickness, is connected to the distal end of the torsion bar. An arm having a length, a width, a thickness, a proximal end, and a distal end is connected to said spacer at the arms proximal end. The arm lies in a second plane and the second plane is in a different plane than the first plane. A first post having a top side and a bottom side is connected to the arm near the distal end of the arm. A tip is electrically connected to the top side of the post.