Abstract: The method of making and using an electrically conductive composite membrane provides for manufacturing of an electrically conductive composite membrane for water sterilization. The electrically conductive composite membrane is made by first dipping cotton fiber into a graphite solution to form a cotton-graphite composite fiber. The cotton-graphite composite fiber is then coated with different silver nanostructures to form a cotton-graphite-silver composite material. The cotton-graphite-silver composite material may then be dipped into a solution containing a conducting polymer, thus forming the electrically conductive composite membrane. In use, the electrically conductive composite membrane is electrified by passing electrical current therethrough. Then, water to be sterilized is passed through the electrified electrically conductive composite membrane, producing potable drinking water.

Abstract: The high impact strength conductive adhesive is a mixture formed from a bisphenol A-based epoxy resin, a curing agent, and silver flakes. In one embodiment, the bisphenol A-based epoxy resin forms about 10.5 wt % of the mixture and the curing agent forms about 14.5 wt % of the mixture, the balance being silver flakes. In this embodiment, the curing agent is preferably an oligomeric polyamine curing agent, such as amidoamine-polyoxypropylenediamine t-butyl phenol. Each silver flake preferably has a tap density of between about 4.0 g/cm3 and about 5.8 g/cm3, and a surface area of between about 0.8 m2/g and about 0.3 m2/g. In an alternative embodiment, the bisphenol A-based epoxy resin forms about 11.7 wt % of the mixture and the curing agent forms about 16.3 wt % of the mixture, the balance being silver flakes.

Abstract: The method of making and using an electrically conductive composite membrane provides for manufacturing of an electrically conductive composite membrane for water sterilization. The electrically conductive composite membrane is made by first dipping cotton fiber into a graphite solution to form a cotton-graphite composite fiber. The cotton-graphite composite fiber is then coated with different silver nanostructures to form a cotton-graphite-silver composite material. The cotton-graphite-silver composite material may then be dipped into a solution containing a conducting polymer, thus forming the electrically conductive composite membrane. In use, the electrically conductive composite membrane is electrified by passing electrical current therethrough. Then, water to be sterilized is passed through the electrified electrically conductive composite membrane, producing potable drinking water.

Abstract: A water-sterilizing polymeric membrane is made from cotton fibers, conductive polyaniline and silver nanostructures. In a first, two-step method of making the membrane, cotton is coated with a conductive polyaniline polymer, and then silver nano structures are incorporated with the polyaniline-coated cotton by conformal or dip coating. The silver nanostructures may be in the form of silver nanoparticles, silver nanowires, silver flakes, combinations thereof, or the like. In a second, one-step approach, silver nanostructures are generated or synthesized in situ during the polymerization of aniline on the cotton fibers. In use, the membrane is used for a filter electrode by passing electrical current therethrough. Then, water to be sterilized is passed through the electrified matrix membrane, producing potable drinking water. The polyaniline, silver and electrical current all contribute to antimicrobial activity in the matrix membrane.

Abstract: The high impact strength conductive adhesive is a mixture formed from a bisphenol A-based epoxy resin, a curing agent, and silver flakes. In one embodiment, the bisphenol A-based epoxy resin forms about 10.5 wt % of the mixture and the curing agent forms about 14.5 wt % of the mixture, the balance being silver flakes. In this embodiment, the curing agent is preferably an oligomeric polyamine curing agent, such as amidoamine-polyoxypropylenediamine t-butyl phenol. Each silver flake preferably has a tap density of between about 4.0 g/cm3 and about 5.8 g/cm3, and a surface area of between about 0.8 m2/g and about 0.3 m2/g. In an alternative embodiment, the bisphenol A-based epoxy resin forms about 11.7 wt % of the mixture and the curing agent forms about 16.3 wt % of the mixture, the balance being silver flakes.

Abstract: The thermosetable composition incorporating organo-iodine compounds that provide improved x-ray contrast are prepared by reacting an epoxy resin with crosslinking agents, wherein the crosslinking agents include compounds having iodo-phenyl functionalities, and wherein the iodine atoms include iodine-127 isotope. The resulting thermoset material includes sufficient iodine-127 isotope covalently bound to the polymer matrix to impart excellent x-ray contrast. The cured polymer materials of this invention may be utilized as underfill material for electrical components, thereby facilitating use of x-ray analysis to detect problematic voids in the underfill.

Abstract: The present invention relates to rigid and clear thermosetting compositions formed from dendritic or hyperbranched polymers and cylcoaliphatic epoxy resins. The compositions may be used for coatings such as electronic device packaging, adhesives, wire coatings, and finishes.

Abstract: The present invention relates to rigid and clear thermosetting compositions formed from dendritic or hyperbranched polymers and cylcoaliphatic epoxy resins. The compositions may be used for coatings such as electronic device packaging, adhesives, wire coatings, and finishes.

Abstract: Disclosed is a curable composition having a low CTE. In one embodiment, a curable composition is disclosed that comprises (i) a binder comprising at least one epoxy compound of the structure: X—((CH2)m—(N)—((CH2)n-(Z))2)p wherein X is an aromatic ring or a six membered cycloaliphatic ring, m is from about 0 to about 2, n is from about 1 to about 3, Z is an epoxy group of empirical formula: C2H3O, p is a number from about 2 to about 3, and (ii) a cross-linking agent comprising at least one polyamine. This curable composition is characterized by a CTE of no more than 60 ppm/° C. when cured for a time of from about 20 to about 60 minutes at temperature of from about 100 to 240° C. Also disclosed are methods of making integrated circuits and integrated circuits made there from, especially flip chips.

Abstract: A themosettable material having excellent processability, and which cures to form a thermoset composition having a low coefficient of thermal expansion and a high glass transition temperature includes functionalized nanoscopic silica particles dispersed in a curable resin comprising a polyepoxide having at least three epoxide groups per molecule. The composition is useful as an underfill for flip-chip circuit assemblies.

Abstract: A themosettable material having excellent processability, and which cures to form a thermoset composition having a low coefficient of thermal expansion and a high glass transition temperature includes functionalized nanoscopic silica particles dispersed in a curable resin comprising a polyepoxide having at least three epoxide groups per molecule. The composition is useful as an underfill for flip-chip circuit assemblies.

Abstract: A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixture that comprises a principal underfill composition of a rigid octaaminophenyl silsesquioxane (OAPS) that is used as a curing agent for a tetrafunctional, low viscosity, and relatively rigid TGMX epoxy resin. An embodiment is also directed to the assembly of a flip chip package that uses the underfill mixture.

Abstract: The present invention relates to rigid and clear thermosetting compositions formed from dendritic or hyperbranched polymers and cylcoaliphatic epoxy resins. The compositions may be used for coatings such as electronic device packaging, adhesives, wire coatings, and finishes.

Abstract: The thermosetable composition incorporating organo-iodine compounds that provide improved x-ray contrast are prepared by reacting an epoxy resin with crosslinking agents, wherein the crosslinking agents include compounds having iodo-phenyl functionalities, and wherein the iodine atoms include iodine-127 isotope. The resulting thermoset material includes sufficient iodine-127 isotope covalently bound to the polymer matrix to impart excellent x-ray contrast. The cured polymer materials of this invention may be utilized as underfill material for electrical components, thereby facilitating use of x-ray analysis to detect problematic voids in the underfill.

Abstract: Disclosed is a curable composition having a low CTE. In one embodiment, a curable composition is disclosed that comprises (i) a binder comprising at least one epoxy compound of the structure: X—((CH2)m—(N)—((CH2)n-(Z))2)p wherein X is an aromatic ring or a six membered cycloaliphatic ring, m is from about 0 to about 2, n is from about 1 to about 3, Z is an epoxy group of empirical formula: C2H3O, p is a number from about 2 to about 3, and (ii) a cross-linking agent comprising at least one polyamine. This curable composition is characterized by a CTE of no more than 60 ppm/° C. when cured for a time of from about 20 to about 60 minutes at temperature of from about 100 to 240° C. Also disclosed are methods of making integrated circuits and integrated circuits made there from, especially flip chips.

Abstract: Disclosed is a method for making a low CTE curable composition. In one embodiment, the method comprises mixing together (i) from 0.1 to 60.0% by weight of a nanoparticle composition and (ii) from 20.0 to 90.0% by weight of a curable binder to provide a premixture, based on the total weight of the premixture, and subjecting the premixture to high shear forces until the nanoparticle composition (i) is sufficiently dispersed in the curable binder (ii) to provide a curable composition. It has been found that the nanoparticle composition (i) must be at least one of (a) a strongly functionalized nanoparticle composition having no more than 25 mole % functionalization, (b) a weakly functionalized nanoparticle composition having from 1 to 100 mole % functionalization, (c) a nonfunctionalized nanoparticle composition, or (d) mixtures thereof.

Abstract: A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixture that comprises a principal underfill composition of a rigid octaaminophenyl silsesquioxane (OAPS) that is used as a curing agent for a tetrafunctional, low viscosity, and relatively rigid TGMX epoxy resin. An embodiment is also directed to the assembly of a flip chip package that uses the underfill mixture.

Abstract: An arc quenching electrical connector has a male pin terminal which inserts longitudinally into a receptacle or terminal having a gassing wall engaged concentrically about the receptacle. During “hot unplugging” of the electrical connector, an arc is carried between a tip of the male pin and a contact surface of a leading end of the receptacle. The gassing wall extends over and is directly engaged to a portion of the contact surface. Because the gassing wall is also preferably an electrical insulator, the arc communicates electrically with the exposed contact surface and is biased directly against the gassing wall. The gassing wall, when heated by the adjacent arc, quenches or reduces the energy of the arc by releasing gas which eliminates arc erosion of the terminals.

Abstract: This disclosure relates to transducers, methods of making transducers and methods of converting between electrical energy and mechanical energy. The transducers comprise an elastomeric film disposed between two electrodes wherein at least one electrode can be a compliant electrode. The elastomeric film comprises a polyphosphazene.

Abstract: This disclosure relates to transducers, methods of making transducers and methods of converting between electrical energy and mechanical energy. The transducers comprise an elastomeric film disposed between two electrodes wherein at least one electrode can be a compliant electrode. The elastomeric film comprises a polyphosphazene.