Patents by Inventor Raguvir Kanda

Raguvir Kanda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging for an electronic device
    Patent number: 9865807
    Abstract: In one aspect, a method includes processing a metal substrate, performing a first etch on a first surface of the metal substrate to form, for an integrated circuit package, secondary leads and a curved component having two primary leads and performing a second etch, on a second surface of the substrate opposite the first surface, at locations on the secondary leads and locations on the curved component to provide a locking mechanism. Each primary lead located at a respective end of the curved component.
    Type: Grant
    Filed: October 7, 2015
    Date of Patent: January 9, 2018
    Assignee: Allegro MicroSystems, LLC
    Inventors: Shixi Louis Liu, Harianto Wong, Paul A. David, John B. Sauber, Shaun D. Milano, Raguvir Kanda, Bruce Hemenway
  • PACKAGING FOR AN ELECTRONIC DEVICE
    Publication number: 20160028001
    Abstract: In one aspect, a method includes processing a metal substrate, performing a first etch on a first surface of the metal substrate to form, for an integrated circuit package, secondary leads and a curved component having two primary leads and performing a second etch, on a second surface of the substrate opposite the first surface, at locations on the secondary leads and locations on the curved component to provide a locking mechanism. Each primary lead located at a respective end of the curved component.
    Type: Application
    Filed: October 7, 2015
    Publication date: January 28, 2016
    Inventors: Shixi Louis Liu, Harianto Wong, Paul A. David, John B. Sauber, Shaun D. Milano, Raguvir Kanda, Bruce Hemenway
  • Packaging for an electronic device
    Patent number: 9190606
    Abstract: In one aspect, a method includes processing a metal substrate, performing a first etch on a first surface of the metal substrate to form, for an integrated circuit package, secondary leads and a curved component having two primary leads and performing a second etch, on a second surface of the substrate opposite the first surface, at locations on the secondary leads and locations on the curved component to provide a locking mechanism. Each primary lead located at a respective end of the curved component.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: November 17, 2015
    Assignee: Allegro Micosystems, LLC
    Inventors: Shixi Louis Liu, Harianto Wong, Paul David, John B. Sauber, Shaun D. Milano, Raguvir Kanda, Bruce Hemenway
  • PACKAGING FOR AN ELECTRONIC DEVICE
    Publication number: 20140264678
    Abstract: In one aspect, a method includes processing a metal substrate, performing a first etch on a first surface of the metal substrate to form, for an integrated circuit package, secondary leads and a curved component having two primary leads and performing a second etch, on a second surface of the substrate opposite the first surface, at locations on the secondary leads and locations on the curved component to provide a locking mechanism. Each primary lead located at a respective end of the curved component.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: Allegro Microsystems, Inc.
    Inventors: SHIXI LOUIS LIU, Harianto Wong, Paul David, John B. Sauber, Shaun D. Milano, Raguvir Kanda, Bruce Hemenway
  • Housing for an electronic device
    Patent number: D719115
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: December 9, 2014
    Assignee: Allegro Microsystems, LLC
    Inventors: Shixi Louis Liu, Harianto Wong, Paul David, John B. Sauber, Shaun D. Milano, Raguvir Kanda, Bruce Hemenway