Patents by Inventor Rahul Raut

Rahul Raut has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11929341
    Abstract: A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: March 12, 2024
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Shamik Ghosal, Remya Chandran, Venodh Manoharan, Siuli Sarkar, Bawa Singh, Rahul Raut
  • Publication number: 20230374289
    Abstract: A composition for use in the manufacture of an in-mould electronic (IME) component, the composition containing a binder comprising: a cross-linking agent comprising melamine formaldehyde, a thermoplastic resin comprising a hydroxyl group, and a solvent.
    Type: Application
    Filed: October 7, 2021
    Publication date: November 23, 2023
    Inventors: Nirmalya Kumar CHAKI, Chetan Pravinchandra SHAH, Bawa SINGH, Rahul RAUT, Vasuki Srinivas KAUSHIK, Ranjit PANDHER, Niveditha NAGARAJAN, Sandeesh M KUMAR, Anubhav RUSTOGI
  • Publication number: 20230287232
    Abstract: This invention discloses formulations of mutually compatible sets of graphene, graphene-carbon, metal and dielectric inks for the fabrication of high performance membrane touch switches (MTS). The compositions of these inks are optimized to achieve higher degree of compatibility with highly engineered polymeric substrates, thereby offering a holistic solution for fabricating high-performance MTS. These sets of materials can also be used for fabrication of sensors, biosensors and RFIDs on flexible substrates, such as polymers and papers.
    Type: Application
    Filed: February 24, 2023
    Publication date: September 14, 2023
    Inventors: Nirmalya Kumar CHAKI, Chetan Pravinchandra SHAH, Barun DAS, Supriya DEVARAJAN, Siuli SARKAR, Rahul RAUT, Bawa SINGH, Anubhav RUSTOGI, Anna Jane HARRIS, Keith Paul PARSONS, Jeffrey William BRAHAM
  • Patent number: 11624000
    Abstract: This invention discloses formulations of mutually compatible sets of graphene, graphene-carbon, metal and dielectric inks for the fabrication of high performance membrane touch switches (MTS). The compositions of these inks are optimized to achieve higher degree of compatibility with highly engineered polymeric substrates, thereby offering a holistic solution for fabricating high-performance MTS. These sets of materials can also be used for fabrication of sensors, biosensors and RFIDs on flexible substrates, such as polymers and papers.
    Type: Grant
    Filed: May 22, 2018
    Date of Patent: April 11, 2023
    Assignees: Alpha Assembly Solutions Inc., MacDermid Autotype Limited
    Inventors: Nirmalya Kumar Chaki, Chetan Pravinchandra Shah, Barun Das, Supriya Devarajan, Siuli Sarkar, Rahul Raut, Bawa Singh, Anubhav Rustogi, Anna Jane Harris, Keith Paul Parsons, Jeffrey William Braham
  • Publication number: 20220371089
    Abstract: A sintering composition, consisting essentially of: a solvent; and a metal complex dissolved in the solvent, wherein: the sintering composition contains at least 60 wt. % of the metal complex, based on the total weight of the sintering composition; and the sintering composition contains at least 20 wt. % of the metal of the metal complex, based on the total weight of the sintering composition.
    Type: Application
    Filed: September 24, 2020
    Publication date: November 24, 2022
    Inventors: Shamik GHOSHAL, Nirmalya Kumar CHAKI, Remya CHANDRAN, Manoharan VENODH, Bawa SINGH, Barun DAS, Niveditha NAGARAJAN, Rahul RAUT, Oscar KHASELEV, Ranjit PANDHER, Supriya DEVARAJAN, Anubhav RUSTOGI
  • Publication number: 20220169905
    Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
    Type: Application
    Filed: October 4, 2021
    Publication date: June 2, 2022
    Applicant: Alpha Assembly Solutions Inc.
    Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana de Avila Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
  • Patent number: 11162007
    Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: November 2, 2021
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana de Avila Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
  • Publication number: 20210283727
    Abstract: A solder alloy comprising: from 40 to 65 wt. % bismuth; from I to IO wt. % indium; at least one of: from 0.1 to 5 wt. % gallium, from 0.1 to 5 wt. % zinc, from 0.1 to 2 wt. % copper, from 0.01 to 0.1 wt. % cobalt, from 0.1 to 2 wt. % silver, from 0.005 to 0.05 wt. % titanium, and from 0.01 to 1 wt. % nickel; optionally up to 1 wt. % of one or more of: vanadium, rare earth metals, neodymium, chromium, iron, aluminium, phosphorus, gold, tellurium, selenium, calcium, vanadium, molybdenum, platinum, magnesium, silicon, and manganese; and the balance tin together with any unavoidable impurities.
    Type: Application
    Filed: October 23, 2019
    Publication date: September 16, 2021
    Inventors: Rahul RAUT, Nirmalyakumar CHAKI, Bawa SINGH, Ranjit PANDHER, Siuli SARKAR
  • Publication number: 20210162496
    Abstract: A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.
    Type: Application
    Filed: June 21, 2019
    Publication date: June 3, 2021
    Inventors: Shamik GHOSAL, Remya CHANDRAN, Venodh MANOHARAN, Siuli SARKAR, Bawa SINGH, Rahul RAUT
  • Publication number: 20210061664
    Abstract: Methods for producing graphene-based products using graphene paste compositions. These methods include producing free-standing graphene foils, films, sheets, polymer supported graphene films, printed graphene structures, graphene features on polymer films, graphene substrates, and graphene metal foils. The methods impart functional characteristics, including corrosion protection and barrier properties to achieve selective enhancement of desired electrical, thermal, mechanical, barrier and other properties.
    Type: Application
    Filed: April 8, 2019
    Publication date: March 4, 2021
    Inventors: Nirmalya Kumar Chaki, Supriya Devarajan, Barun Das, Chetan Pravinchandra Shah, Venodh Manoharan, Rahul Raut, Bawa Singh, Ranjit Pandher
  • Patent number: 10682732
    Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: June 16, 2020
    Assignee: ALPHA ASSEMBLY SOLUTIONS INC.
    Inventors: Ramakrishna Hosur Venkatagiriyappa, Morgana De Avila Ribas, Barun Das, Harish Hanchina Siddappa, Sutapa Mukherjee, Siuli Sarkar, Bawa Singh, Rahul Raut, Ranjit Pandher
  • Publication number: 20200087528
    Abstract: This invention discloses formulations of mutually compatible sets of graphene, graphene-carbon, metal and dielectric inks for the fabrication of high performance membrane touch switches (MTS). The compositions of these inks are optimized to achieve higher degree of compatibility with highly engineered polymeric substrates, thereby offering a holistic solution for fabricating high-performance MTS. These sets of materials can also be used for fabrication of sensors, biosensors and RFIDs on flexible substrates, such as polymers and papers.
    Type: Application
    Filed: May 22, 2018
    Publication date: March 19, 2020
    Inventors: Nirmalya Kumar CHAKI, Chetan Pravinchandra SHAH, Barun DAS, Supriya DEVARAJAN, Siuli SARKAR, Rahul RAUT, Bawa SINGH, Anubhav RUSTOGI, Anna Jane HARRIS, Keith Paul PARSONS, Jeffrey William BRAHAM
  • Publication number: 20190194517
    Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
    Type: Application
    Filed: March 1, 2019
    Publication date: June 27, 2019
    Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana de Avila Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
  • Publication number: 20190143461
    Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.
    Type: Application
    Filed: March 31, 2016
    Publication date: May 16, 2019
    Inventors: Ramakrishna Hosur Venkatagiriyappa, Morgana De Avila Ribas, Barun Das, Harish Hanchina Siddappa, Sutapa Mukherjee, Siuli Sarkar, Bawa Singh, Rahul Raut, Ranjit Pandher
  • Patent number: 10259980
    Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
    Type: Grant
    Filed: October 29, 2013
    Date of Patent: April 16, 2019
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
  • Patent number: 10065274
    Abstract: A flux comprising one or more amines which is especially useful as a solder flux in soldering operations involving reactive metals such as aluminum; and a process for making aluminum surfaces solderable using the flux and conventional solders.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: September 4, 2018
    Inventors: Ranjit Pandher, Bawa Singh, Rahul Raut, Sanyogita Arora, Ravindra Bhatkal, Bin Mo
  • Publication number: 20180072573
    Abstract: A method of synthesizing high quality graphene for producing graphene particles and flakes is presented. The engineered qualities of the graphene include size, aspect ratio, edge definition, surface functionalization and controlling the number of layers. Fewer defects are found in the end graphene product in comparison to previous methods. The inventive method of producing graphene is less aggressive, lower cost and more environmentally friendly than previous methods. This method is applicable to both laboratory scale and high volume manufacturing for producing high quality graphene flakes.
    Type: Application
    Filed: September 14, 2016
    Publication date: March 15, 2018
    Inventors: Nirmalya Kumar Chaki, Barun Das, Supriya Devarajan, Siuli Sarkar, Rahul Raut, Bawa Singh, Ranjit Pandher, Oscar Khaselev
  • Publication number: 20180056455
    Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.
    Type: Application
    Filed: March 31, 2016
    Publication date: March 1, 2018
    Inventors: Ramakrishna Hosur Venkatagiriyappa, Morgana De Avila Ribas, Barun Das, Harish Hanchina Siddappa, Sutapa Mukherjee, Siuli Sarkar, Bawa Singh, Rahul Raut, Ranjit Pandher
  • Patent number: 9802275
    Abstract: Rosin-free thermosetting flux formulations for enhancing the mechanical reliability of solder joints. In accordance with one or more aspects, a solder paste as shown and described herein imparts improved or enhanced solder joint properties relating to at least one of drop shock, thermal cycling, thermal shock, shear strength, flexural strength performance, and/or other thermal-mechanical performance attributes.
    Type: Grant
    Filed: December 31, 2014
    Date of Patent: October 31, 2017
    Inventors: Morgana de Avila Ribas, Rahul Raut, Traian Cornel Cucu, Shu Tai Yong, Siuli Sarkar, Ramakrishna Hosur Katagiriyappa
  • Patent number: 9786629
    Abstract: Dual-side reinforcement (DSR) materials and methods for semiconductor fabrication. The DSR materials exhibit the properties of conventional underfill materials with enhanced stability at room temperature.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: October 10, 2017
    Inventors: Ramakrishna Hosur Venkatagiriyappa, Sutapa Mukherjee, Harish Hanchina Siddappa, Morgana De Avila Ribas, Siuli Sarkar, Bawa Singh, Rahul Raut