Patents by Inventor Raichur S. Narayan

Raichur S. Narayan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4281034
    Abstract: An article fabricated from a resin (e.g. ABS, polycarbonates, polyethylenes, polyaryl ether, or polypropylene of platable grades) susceptible to softening when contacted with trichloroethylene or a mixture of trichloroethylene and methylene chloride is dipped into an alkaline detergent, rinsed, and immersed in an agitated bath (by volume, 90 parts of trichloroethylene, 9 to 10 parts of ethanol, and 0 to 1 part of methylene chloride--1 part of methylene chloride if the resin is polypropylene) to which copper or nickel has been added as a powder (50 to 150 microns, 200 to 250 grams per liter) whereupon the article is drained, dipped in an agitated bath of similar composition, and dried. Alternatively, the powder may be sprayed onto the article, after the article has been immersed in such a bath. Next, the article may be dipped in dilute nitric acid, rinsed and immersed in a non-catalytic bath for deposition of nickel.
    Type: Grant
    Filed: April 3, 1980
    Date of Patent: July 28, 1981
    Assignee: Sunbeam Corporation
    Inventor: Raichur S. Narayan
  • Patent number: 4272570
    Abstract: A process for providing surface layers of copper or copper alloyed with zinc on die castings of zinc or zinc alloys comprises a step of immersing the castings in an agitated bath containing an aqueous vehicle, which has been adjusted to a pH of from 8 to 10, and to which cupric oxide has been added as a powder in an amount of approximately from 200 to 250 grams per liter of the agitated bath. Cuprous oxide may be substituted for cupric oxide. At a pH not exceeding 8.5, the surface layer tends to be copper alloyed with zinc. At a pH exceeding 8.5, the surface layer tends to be copper. At a pH of 9, the surface layer of copper tends to be very adherent. The pH is adjusted by addition of sodium hydroxide, potassium hydroxide, or ammonium hydroxide, preferably sodium hydroxide.
    Type: Grant
    Filed: April 11, 1980
    Date of Patent: June 9, 1981
    Assignee: Sunbeam Corporation
    Inventor: Raichur S. Narayan