Abstract: A package for assembling one or more integrated circuits and routing signals of the one or more integrated circuits using multiple redistribution layers and a method for shielding a signal pad of an integrated circuit in the package are disclosed. The top layer of the redistribution layers is facing the integrated circuit, the bottom layer of the redistribution layers is an interface layer facing a substrate or PCB. A shielding structure is provided on the top layer of the redistribution layers above a signal pad of an integrated circuit. The signal pad is on the bottom layer of the redistribution layers and is used for routing high-frequency or high-speed signals.

Abstract: A matrix for use with a radio transceiver having at least two signal sources is provided. The matrix comprises for each selected set of two or more signal sources, a list of combinations of harmonics of the signal sources, the combinations of harmonics each having a predicted amplitude greater than a predetermined threshold, and a frequency within a defined range related to a frequency range of one of the signal sources. Further, methods for generating such matrix and methods for avoiding spurs are provided.