Patents by Inventor Raimon GORITZ

Raimon GORITZ has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microwave arrangement for the transmission of high-frequency signals
    Patent number: 9406992
    Abstract: The invention relates to a microwave arrangement for the transmission of high-frequency signals of high powers comprising a microstrip conductor on an upper side of a substrate. The microstrip line comprises a multi-stage signal splitter and a ground surface on an underside of the substrate disposed opposite to the upper side. A defected ground structure is introduced into the ground-surface below a first stage of the signal splitter. Further a power combiner and/or a power splitter with a microwave arrangement according to example embodiments of the invention.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: August 2, 2016
    Assignee: Rohde & Schwarz GmbH & Co. KG
    Inventor: Raimon Goritz
  • MICROWAVE ARRANGEMENT FOR THE TRANSMISSION OF HIGH-FREQUENCY SIGNALS
    Publication number: 20150002242
    Abstract: The invention relates to a microwave arrangement for the transmission of high-frequency signals of high powers comprising a microstrip conductor on an upper side of a substrate. The microstrip line comprises a multi-stage signal splitter and a ground surface on an underside of the substrate disposed opposite to the upper side. A defected ground structure is introduced into the ground-surface below a first stage of the signal splitter. Further a power combiner and/or a power splitter with a microwave arrangement according to example embodiments of the invention.
    Type: Application
    Filed: June 30, 2014
    Publication date: January 1, 2015
    Inventor: Raimon GORITZ