Patents by Inventor Raimondo P. Sessego
Raimondo P. Sessego has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10012673Abstract: A system includes a MEMS sensor having dual proof masses capable of moving independently from one another in response to forces imposed upon the proof masses. Each proof mass includes an independent set of sense contacts configured to provide output signals corresponding to the physical displacement of the corresponding sense mass. A switch system is in communication with the sense contacts. The switch system is configured to enable a sense mode and various test modes for the MEMS sensor. When the switch system enables a sense mode, output signals from the sense contacts can be combined to produce sense signals. When the switch system enables a test mode, the second contacts are electrically decoupled from one another to disassociate the output signals from one another. The independent sense contacts and switch system enable the concurrent compensation and calibration of the proof masses along two different sense axes.Type: GrantFiled: September 15, 2017Date of Patent: July 3, 2018Assignee: NXP USA, Inc.Inventors: Tehmoor M. Dar, Bruno J. Debeurre, Raimondo P. Sessego
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Publication number: 20180003734Abstract: A system includes a MEMS sensor having dual proof masses capable of moving independently from one another in response to forces imposed upon the proof masses. Each proof mass includes an independent set of sense contacts configured to provide output signals corresponding to the physical displacement of the corresponding sense mass. A switch system is in communication with the sense contacts. The switch system is configured to enable a sense mode and various test modes for the MEMS sensor. When the switch system enables a sense mode, output signals from the sense contacts can be combined to produce sense signals. When the switch system enables a test mode, the second contacts are electrically decoupled from one another to disassociate the output signals from one another. The independent sense contacts and switch system enable the concurrent compensation and calibration of the proof masses along two different sense axes.Type: ApplicationFiled: September 15, 2017Publication date: January 4, 2018Inventors: Tehmoor M. Dar, Bruno J. Debeurre, Raimondo P. Sessego
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Patent number: 9834438Abstract: A sensor system includes a microelectromechanical systems (MEMS) sensor, processing circuitry, measurement circuitry, stimulus circuitry and memory. The system is configured to provide an output responsive to physical displacement within the MEMS sensor to the measurement circuitry. The stimulus circuitry is configured to provide a stimulus signal to the MEMS sensor to cause a physical displacement within the MEMS sensor. The measurement circuitry is configured to process the output from the MEMS sensor and provide it to the processing circuitry, which is configured to generate stimulus signals and provide them to the stimulus circuitry for provision to the MEMS sensor. Output from the measurement circuitry corresponding to the physical displacement occurring in the MEMS sensor is monitored and used to calculate MEMS sensor characteristics. Methods for monitoring and calibrating MEMS sensors are also provided.Type: GrantFiled: November 20, 2015Date of Patent: December 5, 2017Assignee: NXP USA, INC.Inventors: Tehmoor M. Dar, Bruno J. Debeurre, Raimondo P. Sessego, Richard A. Deken, Aaron A. Geisberger, Krithivasan Suryanarayanan
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Patent number: 9797921Abstract: A system includes a MEMS sensor having dual proof masses capable of moving independently from one another in response to forces imposed upon the proof masses. Each proof mass includes an independent set of sense contacts configured to provide output signals corresponding to the physical displacement of the corresponding sense mass. A switch system is in communication with the sense contacts. The switch system is configured to enable a sense mode and various test modes for the MEMS sensor. When the switch system enables a sense mode, output signals from the sense contacts can be combined to produce sense signals. When the switch system enables a test mode, the second contacts are electrically decoupled from one another to disassociate the output signals from one another. The independent sense contacts and switch system enable the concurrent compensation and calibration of the proof masses along two different sense axes.Type: GrantFiled: September 3, 2015Date of Patent: October 24, 2017Assignee: NXP USA, Inc.Inventors: Tehmoor M. Dar, Bruno J. Debeurre, Raimondo P. Sessego
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Publication number: 20170067932Abstract: A system includes a MEMS sensor having dual proof masses capable of moving independently from one another in response to forces imposed upon the proof masses. Each proof mass includes an independent set of sense contacts configured to provide output signals corresponding to the physical displacement of the corresponding sense mass. A switch system is in communication with the sense contacts. The switch system is configured to enable a sense mode and various test modes for the MEMS sensor. When the switch system enables a sense mode, output signals from the sense contacts can be combined to produce sense signals. When the switch system enables a test mode, the second contacts are electrically decoupled from one another to disassociate the output signals from one another. The independent sense contacts and switch system enable the concurrent compensation and calibration of the proof masses along two different sense axes.Type: ApplicationFiled: September 3, 2015Publication date: March 9, 2017Inventors: TEHMOOR M. DAR, BRUNO J. DEBEURRE, RAIMONDO P. SESSEGO
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Patent number: 9527731Abstract: A method for testing a plurality of pressure sensors on a device wafer includes placing a diaphragm of one of the pressure sensors on the device wafer in proximity to a nozzle of a test system. A pneumatic pressure stimulus is applied to the diaphragm via an outlet of the nozzle and a cavity pressure is measured within a cavity associated with the pressure sensor in response to application of the pneumatic pressure stimulus. The pneumatic pressure stimulus within the cavity corresponds to the pressure applied to the diaphragm. Methodology is executed to test the strength and/or stiffness of the diaphragm. Additionally, the methodology and test system can be utilized to determine an individual calibration factor for each pressure sensor on the device wafer.Type: GrantFiled: October 15, 2014Date of Patent: December 27, 2016Assignee: NXP USA, Inc.Inventors: Bruno J. Debeurre, Peter T. Jones, William D. McWhorter, Raimondo P. Sessego
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Patent number: 9475689Abstract: A sensor system includes a microelectromechanical systems (MEMS) sensor, control circuit, signal evaluation circuitry, a digital to analog converter, signal filters, an amplifier, demodulation circuitry and memory. The system is configured to generate high and low-frequency signals, combine them, and provide the combined input signal to a MEMS sensor. The MEMS sensor is configured to provide a modulated output signal that is a function of the combined signal. The system is configured to demodulate and filter the modulated output signal, compare the demodulated, filtered signal with the input signal to determine amplitude and phase differences, and determine, based on the amplitude and phase differences, various parameters of the MEMS sensor. A method for determining MEMS sensor parameters is also provided.Type: GrantFiled: February 8, 2016Date of Patent: October 25, 2016Assignee: FREESCALE SEMICONDUCTOR, INC.Inventors: Raimondo P. Sessego, Tehmoor M. Dar, Bruno J. Debeurre
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Patent number: 9400226Abstract: Embodiments of systems for calibrating transducer-including devices include a board support structure, one or more motors, a motor control module, and a calibration control module. The board support structure holds a calibration board in a fixed position with respect to the board support structure. The motor(s) rotate the board support structure around one or more axes of a fixed coordinate system. The motor control module sends motor control signals to the motor(s) to cause the motor(s) to move the board support structure through a series of orientations with respect to the fixed coordinate system. The calibration control module sends, through a communication structure, signals to the transducer-including devices, which are loaded into a plurality of sockets of the calibration board. The signals cause the transducer-including devices to generate transducer data while the board support structure is in or moving toward each orientation of the series of orientations.Type: GrantFiled: April 9, 2013Date of Patent: July 26, 2016Assignee: FREESCALE SEMICONDUCTOR, INC.Inventors: Raimondo P. Sessego, Peter T. Jones, Seyed K. Paransun, James D. Stanley, William D. McWhorter
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Publication number: 20160167961Abstract: A sensor system includes a microelectromechanical systems (MEMS) sensor, processing circuitry, measurement circuitry, stimulus circuitry and memory. The system is configured to provide an output responsive to physical displacement within the MEMS sensor to the measurement circuitry. The stimulus circuitry is configured to provide a stimulus signal to the MEMS sensor to cause a physical displacement within the MEMS sensor. The measurement circuitry is configured to process the output from the MEMS sensor and provide it to the processing circuitry, which is configured to generate stimulus signals and provide them to the stimulus circuitry for provision to the MEMS sensor. Output from the measurement circuitry corresponding to the physical displacement occurring in the MEMS sensor is monitored and used to calculate MEMS sensor characteristics. Methods for monitoring and calibrating MEMS sensors are also provided.Type: ApplicationFiled: November 20, 2015Publication date: June 16, 2016Applicant: FREESCALE SEMICONDUCTOR, INC.Inventors: Tehmoor M. Dar, Bruno J. Debeurre, Raimondo P. Sessego, Richard A. Deken, Aaron A. Geisberger, Krithivasan Suryanarayanan
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Patent number: 9365413Abstract: Embodiments of packaged transducer-including devices and methods for their calibration are disclosed. Each device includes one or more transducers, an interface configured to facilitate communications with an external calibration controller, a memory, and a processing component. The external calibration controller sends calibration commands to the transducer-including devices through a communication structure. The processing component of each device executes code in response to receiving the calibration commands. Execution of the code includes generating transducer data from the one or more transducers, calculating calibration coefficients using the transducer data, and storing the calibration coefficients within the memory of the device.Type: GrantFiled: August 8, 2013Date of Patent: June 14, 2016Assignee: FREESCALE SEMICONDUCTOR, INC.Inventors: Andres Barrilado, Peter T. Jones, Stephane Lestringuez, Seyed K. Paransun, Raimondo P. Sessego, James D. Stanley
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Publication number: 20160152464Abstract: A sensor system includes a microelectromechanical systems (MEMS) sensor, control circuit, signal evaluation circuitry, a digital to analog converter, signal filters, an amplifier, demodulation circuitry and memory. The system is configured to generate high and low-frequency signals, combine them, and provide the combined input signal to a MEMS sensor. The MEMS sensor is configured to provide a modulated output signal that is a function of the combined signal. The system is configured to demodulate and filter the modulated output signal, compare the demodulated, filtered signal with the input signal to determine amplitude and phase differences, and determine, based on the amplitude and phase differences, various parameters of the MEMS sensor. A method for determining MEMS sensor parameters is also provided.Type: ApplicationFiled: February 8, 2016Publication date: June 2, 2016Inventors: RAIMONDO P. SESSEGO, Tehmoor M. DAR, Bruno J. DEBEURRE
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Patent number: 9335340Abstract: A sensor system includes a microelectromechanical systems (MEMS) sensor, control circuit, signal evaluation circuitry, a digital to analog converter, signal filters, an amplifier, demodulation circuitry and memory. The system is configured to generate high and low-frequency signals, combine them, and provide the combined input signal to a MEMS sensor. The MEMS sensor is configured to provide a modulated output signal that is a function of the combined signal. The system is configured to demodulate and filter the modulated output signal, compare the demodulated, filtered signal with the input signal to determine amplitude and phase differences, and determine, based on the amplitude and phase differences, various parameters of the MEMS sensor. A method for determining MEMS sensor parameters is also provided.Type: GrantFiled: July 23, 2013Date of Patent: May 10, 2016Assignee: FREESCALE SEMICONDUCTOR, INC.Inventors: Raimondo P. Sessego, Tehmoor M. Dar, Bruno J. Debeurre
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Patent number: 9335396Abstract: A sensor system includes a microelectromechanical systems (MEMS) sensor, a processor, measurement circuitry, stimulus circuitry and memory. The MEMS sensor is configured to provide an output responsive to physical displacement within the MEMS sensor to the measurement circuitry. The stimulus circuitry is configured to provide a stimulus signal to the MEMS sensor to cause a physical displacement within the MEMS sensor. The measurement circuitry is configured to process the output from the MEMS sensor and provide it to the processor. The processor is configured to generate stimulus signals and provide them to the stimulus circuitry for provision to the MEMS sensor. The processor is configured to monitor the output from the measurement circuitry corresponding to the physical displacement occurring in the MEMS sensor, calculate MEMS sensor characteristics based on the output, and update calibration values based on the output. Methods for monitoring and calibrating MEMS sensors are also provided.Type: GrantFiled: March 12, 2013Date of Patent: May 10, 2016Assignee: FREESCALE SEMICONDUCTOR, INC.Inventors: Bruno Debeurre, Tehmoor M. Dar, Raimondo P. Sessego
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Publication number: 20160116361Abstract: A system for testing pressure sensors on a device wafer includes a tray for holding the device wafer. The tray includes a base having a surface, a spacer extending from the surface, and a tacky material disposed on the surface. The spacer holds the device wafer spaced apart from the surface of the base to form a chamber between the surface and the device wafer. A wafer chuck retains the tray and the device wafer under vacuum. The system further includes a nozzle and a seal element in fixed engagement with the nozzle. The seal element surrounds the outlet of the nozzle and is adapted for mechanical contact with the device wafer. An actuator is configured to place the nozzle and a diaphragm of one of the pressure sensors in proximity to one another, wherein a pneumatic pressure stimulus is applied to the diaphragm via an outlet of the nozzle.Type: ApplicationFiled: October 28, 2014Publication date: April 28, 2016Inventors: BRUNO J. DEBEURRE, ALBERT S. CHECKANOV, JANSEN D. CURRENS, PETER T. JONES, WILLIAM D. MCWHORTER, RAIMONDO P. SESSEGO
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Publication number: 20160107887Abstract: A method for testing a plurality of pressure sensors on a device wafer includes placing a diaphragm of one of the pressure sensors on the device wafer in proximity to a nozzle of a test system. A pneumatic pressure stimulus is applied to the diaphragm via an outlet of the nozzle and a cavity pressure is measured within a cavity associated with the pressure sensor in response to application of the pneumatic pressure stimulus. The pneumatic pressure stimulus within the cavity corresponds to the pressure applied to the diaphragm. Methodology is executed to test the strength and/or stiffness of the diaphragm. Additionally, the methodology and test system can be utilized to determine an individual calibration factor for each pressure sensor on the device wafer.Type: ApplicationFiled: October 15, 2014Publication date: April 21, 2016Inventors: BRUNO J. DEBEURRE, PETER T. JONES, WILLIAM D. MCWHORTER, RAIMONDO P. SESSEGO
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Patent number: 9221679Abstract: A sensor system includes a microelectromechanical systems (MEMS) sensor, processing circuitry, measurement circuitry, stimulus circuitry and memory. The system is configured to provide an output responsive to physical displacement within the MEMS sensor to the measurement circuitry. The stimulus circuitry is configured to provide a stimulus signal to the MEMS sensor to cause a physical displacement within the MEMS sensor. The measurement circuitry is configured to process the output from the MEMS sensor and provide it to the processing circuitry, which is configured to generate stimulus signals and provide them to the stimulus circuitry for provision to the MEMS sensor. Output from the measurement circuitry corresponding to the physical displacement occurring in the MEMS sensor is monitored and used to calculate MEMS sensor characteristics. Methods for monitoring and calibrating MEMS sensors are also provided.Type: GrantFiled: January 22, 2014Date of Patent: December 29, 2015Assignee: FREESCALE SEMICONDUCTOR, INC.Inventors: Tehmoor M. Dar, Bruno J. Debeurre, Raimondo P. Sessego, Richard A. Deken, Aaron A. Geisberger, Krithivasan Suryanarayanan
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Publication number: 20150027198Abstract: A sensor system includes a microelectromechanical systems (MEMS) sensor, control circuit, signal evaluation circuitry, a digital to analog converter, signal filters, an amplifier, demodulation circuitry and memory. The system is configured to generate high and low-frequency signals, combine them, and provide the combined input signal to a MEMS sensor. The MEMS sensor is configured to provide a modulated output signal that is a function of the combined signal. The system is configured to demodulate and filter the modulated output signal, compare the demodulated, filtered signal with the input signal to determine amplitude and phase differences, and determine, based on the amplitude and phase differences, various parameters of the MEMS sensor. A method for determining MEMS sensor parameters is also provided.Type: ApplicationFiled: July 23, 2013Publication date: January 29, 2015Applicant: FREESCALE SEMICONDUCTOR, INC.Inventors: Raimondo P. Sessego, Tehmoor M. Dar, Bruno J. Debeurre
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Publication number: 20140352400Abstract: Embodiments of packaged transducer-including devices and methods for their calibration are disclosed. Each device includes one or more transducers, an interface configured to facilitate communications with an external calibration controller, a memory, and a processing component. The external calibration controller sends calibration commands to the transducer-including devices through a communication structure. The processing component of each device executes code in response to receiving the calibration commands. Execution of the code includes generating transducer data from the one or more transducers, calculating calibration coefficients using the transducer data, and storing the calibration coefficients within the memory of the device.Type: ApplicationFiled: August 8, 2013Publication date: December 4, 2014Applicant: FREESCALE SEMICONDUCTOR, INC.Inventors: Andres BARRILADO, Peter T. JONES, Stephane LESTRINGUEZ, Seyed K. PARANSUN, Raimondo P. SESSEGO, James D. STANLEY
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Publication number: 20140303926Abstract: Embodiments of systems for calibrating transducer-including devices include a board support structure, one or more motors, a motor control module, and a calibration control module. The board support structure holds a calibration board in a fixed position with respect to the board support structure. The motor(s) rotate the board support structure around one or more axes of a fixed coordinate system. The motor control module sends motor control signals to the motor(s) to cause the motor(s) to move the board support structure through a series of orientations with respect to the fixed coordinate system. The calibration control module sends, through a communication structure, signals to the transducer-including devices, which are loaded into a plurality of sockets of the calibration board. The signals cause the transducer-including devices to generate transducer data while the board support structure is in or moving toward each orientation of the series of orientations.Type: ApplicationFiled: April 9, 2013Publication date: October 9, 2014Inventors: Raimondo P. Sessego, Peter T. Jones, Seyed K. Paransun, James D. Stanley, William D. McWhorter
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Publication number: 20140266246Abstract: A sensor system includes a microelectromechanical systems (MEMS) sensor, a processor, measurement circuitry, stimulus circuitry and memory. The MEMS sensor is configured to provide an output responsive to physical displacement within the MEMS sensor to the measurement circuitry. The stimulus circuitry is configured to provide a stimulus signal to the MEMS sensor to cause a physical displacement within the MEMS sensor. The measurement circuitry is configured to process the output from the MEMS sensor and provide it to the processor. The processor is configured to generate stimulus signals and provide them to the stimulus circuitry for provision to the MEMS sensor. The processor is configured to monitor the output from the measurement circuitry corresponding to the physical displacement occurring in the MEMS sensor, calculate MEMS sensor characteristics based on the output, and update calibration values based on the output. Methods for monitoring and calibrating MEMS sensors are also provided.Type: ApplicationFiled: March 12, 2013Publication date: September 18, 2014Applicant: Freescale Semiconductor, Inc.Inventors: Bruno Debeurre, Tehmoor M. Dar, Raimondo P. Sessego