Patents by Inventor Raimund Hoffmann

Raimund Hoffmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9766546
    Abstract: The method comprises the steps of applying a layer of a negative photoresist on a bottom layer, providing the layer of the negative photoresist with a pattern arranged in a border zone of the resist structure to be produced, irradiating a surface area of the layer of the negative photoresist according to the resist structure to be produced, and removing the layer of the negative photoresist outside the irradiated surface area. The pattern is produced in such a manner that it comprises a dimension that is smaller than a minimal resolution of the irradiation. The pattern may especially be designed as a sub-resolution assist feature.
    Type: Grant
    Filed: July 25, 2014
    Date of Patent: September 19, 2017
    Assignee: AMS AG
    Inventors: Gerhard Eilmsteiner, Raimund Hoffmann
  • Publication number: 20160179009
    Abstract: The method comprises the steps of applying a layer of a negative photoresist on a bottom layer, providing the layer of the negative photoresist with a pattern arranged in a border zone of the resist structure to be produced, irradiating a surface area of the layer of the negative photoresist according to the resist structure to be produced, and removing the layer of the negative photoresist outside the irradiated surface area. The pattern is produced in such a manner that it comprises a dimension that is smaller than a minimal resolution of the irradiation. The pattern may especially be designed as a sub-resolution assist feature.
    Type: Application
    Filed: July 25, 2014
    Publication date: June 23, 2016
    Inventors: Gerhard EILMSTEINER, Raimund HOFFMANN
  • Publication number: 20130160706
    Abstract: The invention relates to a device for coating a surface of a wafer. The device includes a retaining system for placing the wafer on a retaining surface, a nozzle system for coating the wafer in a Z-direction, and a ring having an inside periphery that surrounds a side periphery of the wafer (2), wherein the ring can be arranged for expanding a coating surface when coating the wafer.
    Type: Application
    Filed: October 19, 2010
    Publication date: June 27, 2013
    Inventors: Johanna Bartel, Ronald Holzleitner, Raimund Hoffmann, Franz Schrank, Jordi Teva-MeroƱo