Patents by Inventor Rain Liu

Rain Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thinned semiconductor chip with edge support
    Patent number: 11251152
    Abstract: A semiconductor device with reduced device resistance is disclosed. The semiconductor device comprises a semiconductor chip in which the chip thickness at the center portion of the chip where the circuit elements are disposed is uniform and is different from the chip thickness near the chip sides distant from the circuit elements.
    Type: Grant
    Filed: March 12, 2020
    Date of Patent: February 15, 2022
    Assignee: DIODES INCORPORATED
    Inventors: Duane Wilcoxen, Chiao-Shun Chuang, Rain Liu, Thomas Tsai, Will Zhang
  • Thinned semiconductor chip with edge support
    Publication number: 20210288014
    Abstract: A semiconductor device with reduced device resistance is disclosed. The semiconductor device comprises a semiconductor chip in which the chip thickness at the center portion of the chip where the circuit elements are disposed is uniform and is different from the chip thickness near the chip sides distant from the circuit elements.
    Type: Application
    Filed: March 12, 2020
    Publication date: September 16, 2021
    Applicant: Diodes Incorporated
    Inventors: Duane Wilcoxen, Chiao-Shun Chuang, Rain Liu, Thomas Tsai, Will Zhang