Patents by Inventor Rainer A. Schraivogel

Rainer A. Schraivogel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interconnection structure with raised perimeter portions
    Patent number: 5877833
    Abstract: By providing an interconnection structure (1) with strip-shaped elevations (11) which, in a plan view, are preferably asterisk-shaped, the contact face is cleaned during compression and an adhesive can easily flow away. The interconnection structure is very suitable for face-down bonding of drive ICs in a display device.
    Type: Grant
    Filed: September 10, 1991
    Date of Patent: March 2, 1999
    Assignee: U.S. Philips Corporation
    Inventors: Rainer A. Schraivogel, Guido Plangger
  • Substrate and device comprising interconnection structures
    Patent number: 5061984
    Abstract: For face-down bonding by means of (pressure) contacts interconnection structures (bumps) 3 are provided in rows or line arrangements (11) on a substrate 2. This leads to a better distribution of elastical tensions in the substrate 2 and to more reliable contacts.
    Type: Grant
    Filed: March 20, 1990
    Date of Patent: October 29, 1991
    Assignee: U.S. Philips Corporation
    Inventors: Rainer A. Schraivogel, Cornelis G. M. Van Kessel, Jan Bouwma