Abstract: The invention relates to a method for lateral alignment of a substrate for photolithography, wherein the substrate's back side has a reference mark and the substrate front side is coated with a photoresist. The method includes the steps of: retrieving the reference mark on the substrate's back side, applying an alignment mark on the front side of the substrate by means of a first exposure of the photoresist with electromagnetic radiation to provide an undeveloped alignment mark, the undeveloped alignment mark being laterally positioned on the photoresist with respect to the reference mark on the substrate's back side, aligning the substrate by making use of the undeveloped alignment mark, applying a further manufacturing process on the front side of the aligned substrate.