Abstract: The invention relates to a method and a device for coating powder- or granular-form particles by means of gas flow sputtering with a hollow cathode functioning as a target, which is arranged in an evacuable container together with an anode and a collection container. In order to work efficiently and with easier handling, it is proposed that after a metered introduction into an inlet opening, the powder- or granular-form particles to be coated pass through the evacuated interior of the hollow cathode in a free fall of 0.3 m to 1 m and are collected in a lower collection container.

Abstract: The invention relates to an inline system for coating individual substrates or groups of substrates, which has several chambers arranged one behind the other and evacuatable via pumps, namely a feed chamber, a waiting chamber, at least one process chamber, a further waiting chamber and a discharge chamber, through which the substrates or substrate groups pass in succession and which can each be closed by valves. According to the invention, the feed chamber and the discharge chamber each have a capacity for simultaneously receiving several, namely n, substrates or substrate groups, as well as a waiting chamber the capacity of which allows (n?1) substrates or substrate groups to be received, whereas the receiving capacity of the treatment chambers is limited to one substrate or one substrate group in each case.

Abstract: Provided is a hot filament CVD device capable of easily attaching, detaching, and replacing a filament. The hot filament CVD device includes a chamber, a base material support that supports multiple base materials, filament cartridges, and paired holding parts. The filament cartridges each include multiple filaments (60), a first frame, a second frame, and paired connecting members. The paired holding parts guide each of the filament cartridges when it is inserted into the chamber, and hold the filament cartridges in the chamber so that the filament cartridges face the multiple base materials.

Abstract: Provided is a hot filament CVD device capable of easily disposing multiple base materials in a chamber. A hot filament CVD device includes a chamber, multiple filaments, multiple base material supports supporting respective multiple base materials, and a table. The multiple base material supports can be inserted into the chamber in a predetermined insertion direction through an opening, and support the corresponding multiple base materials so that the multiple base materials are disposed at intervals in the insertion direction. The table has a mounting surface on which the multiple base material supports are allowed to be mounted allowing the multiple base materials to be disposed facing the corresponding multiple filaments, and supports the multiple base material supports inside the chamber while allowing the multiple base material supports to be disposed adjacent to each other in a chamber width direction.

Abstract: Provided is a hot filament CVD device capable of performing coating treatment on a base material while stably correcting slack of a filament due to thermal expansion. The hot filament CVD device includes a chamber, a base material support that supports multiple base materials, multiple filaments, a first frame, a second frame, a power source, a drive unit, a drive control unit, a calculation unit, and a temperature information acquisition unit. The temperature information acquisition unit acquires information on temperature of the multiple filaments, the temperature changing with application of voltage. The calculation unit calculates an amount of thermal expansion of the multiple filaments based on the acquired information on temperature. The drive control unit causes the second frame to move apart from the first frame in accordance with the amount of thermal expansion calculated by the calculation unit.

Abstract: Provided is a hot filament CVD device capable of easily attaching, detaching, and replacing a filament. The hot filament CVD device includes a chamber, a base material support that supports multiple base materials, filament cartridges, and paired holding parts. The filament cartridges each include multiple filaments (60), a first frame, a second frame, and paired connecting members. The paired holding parts guide each of the filament cartridges when it is inserted into the chamber, and hold the filament cartridges in the chamber so that the filament cartridges face the multiple base materials.

Abstract: In an ion bombardment apparatus of the present invention, a heating type thermal electron emission electrode formed by a filament is placed on one inner surface of a vacuum chamber, an anode for receiving a thermal electron from the thermal electron emission electrode is placed on another inner surface of the vacuum chamber, and a base material is placed between the thermal electron emission electrode and the anode. Further, the ion bombardment apparatus has a discharge power supply for generating a glow discharge upon application of a potential difference between the thermal electron emission electrode and the anode, a heating power supply for heating the thermal electron emission electrode so as to emit the thermal electron, and a bias power supply for applying negative pulse-shaped bias potential with respect to the vacuum chamber to the base material.

Abstract: The invention relates to an apparatus and a method for pretreating and coating bodies by means of magnetron sputtering. In a vacuum chamber having a metallic chamber wall (26), magnetrons with sputter targets are arranged, at least one of which is an HPPMS magnetron to which electric pulses are fed by connecting a capacitive element (6) with the sputter target of the HPPMS magnetron via a switching element (5). To achieve effective pretreatment and coating of substrates it is provided according to a first aspect to arrange the switching element on the chamber wall. According to a second aspect, an electrode pair is provided, wherein a first electrode is an HPPMS magnetron (1) and the first and second electrodes are arranged in such a manner that a body (11) supported on a substrate table (4) is arranged between the active surfaces of the electrode pair or is moved through the space between the active surfaces of the electrode pair.

Abstract: A coated body and a process for producing a layer of hard material on a substrate are described. The body comprises a substrate (30) and a layer of hard material (36) which has been applied to the substrate (30) and at least partly covers the body. The layer of hard material comprises the metallic elements Al, Cr and Si and also nonmetallic elements selected from the group consisting of B, C, N, O. The atomic proportion of oxygen among the nonmetallic elements is greater than 30%. The layer of hard material is deposited on the substrate by means of magnetron atomization.

Abstract: The invention relates to an apparatus and a method for pretreating and coating bodies by means of magnetron sputtering. In a vacuum chamber having a metallic chamber wall (26), magnetrons with sputter targets are arranged, at least one of which is an HPPMS magnetron to which electric pulses are fed by connecting a capacitive element (6) with the sputter target of the HPPMS magnetron via a switching element (5). To achieve effective pretreatment and coating of substrates it is provided according to a first aspect to arrange the switching element on the chamber wall. According to a second aspect, an electrode pair is provided, wherein a first electrode is an HPPMS magnetron (1) and the first and second electrodes are arranged in such a manner that a body (11) supported on a substrate table (4) is arranged between the active surfaces of the electrode pair or is moved through the space between the active surfaces of the electrode pair.

Abstract: A coated body and a process for producing a layer of hard material on a substrate are described. The body comprises a substrate (30) and a layer of hard material (36) which has been applied to the substrate (30) and at least partly covers the body. The layer of hard material comprises the metallic elements Al, Cr and Si and also nonmetallic elements selected from the group consisting of B, C, N, O. The atomic proportion of oxygen among the nonmetallic elements is greater than 30%. The layer of hard material is deposited on the substrate by means of magnetron atomization.