Patents by Inventor Rainer E. Thomas

Rainer E. Thomas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mainboard assembly including a package overlying a die directly attached to the mainboard
    Patent number: 10555417
    Abstract: Disclosed are embodiments of a system-level assembly including an integrated circuit (IC) die directly attached to a mainboard. An IC die directly attached to a mainboard or other circuit board may be referred to as a direct-chip attach (DCA) die. A package is disposed over at least a portion of the DCA die and coupled with the mainboard. The package includes one or more other IC die disposed on a substrate. Other embodiments are described and claimed.
    Type: Grant
    Filed: February 20, 2019
    Date of Patent: February 4, 2020
    Assignee: Intel Corporation
    Inventors: Damion Searls, Weston C. Roth, Margaret D. Ramirez, James D. Jackson, Rainer E. Thomas, Charles A. Gealer
  • MAINBOARD ASSEMBLY INCLUDING A PACKAGE OVERLYING A DIE DIRECTLY ATTACHED TO THE MAINBOARD
    Publication number: 20190182958
    Abstract: Disclosed are embodiments of a system-level assembly including an integrated circuit (IC) die directly attached to a mainboard. An IC die directly attached to a mainboard or other circuit board may be referred to as a direct-chip attach (DCA) die. A package is disposed over at least a portion of the DCA die and coupled with the mainboard. The package includes one or more other IC die disposed on a substrate. Other embodiments are described and claimed.
    Type: Application
    Filed: February 20, 2019
    Publication date: June 13, 2019
    Inventors: Damion SEARLS, Weston C. ROTH, Margaret D. RAMIREZ, James D. JACKSON, Rainer E. THOMAS, Charles A. GEALER
  • Mainboard assembly including a package overlying a die directly attached to the mainboard
    Patent number: 10251273
    Abstract: Disclosed are embodiments of a system-level assembly including an integrated circuit (IC) die directly attached to a mainboard. An IC die directly attached to a mainboard or other circuit board may be referred to as a direct-chip attach (DCA) die. A package is disposed over at least a portion of the DCA die and coupled with the mainboard. The package includes one or more other IC die disposed on a substrate. Other embodiments are described and claimed.
    Type: Grant
    Filed: September 8, 2008
    Date of Patent: April 2, 2019
    Assignee: Intel Corporation
    Inventors: Damion Searls, Weston C. Roth, Margaret D. Ramirez, James D. Jackson, Rainer E. Thomas, Charles A. Gealer
  • Mainboard assembly including a package overlying a die directly attached to the mainboard
    Publication number: 20100061056
    Abstract: Disclosed are embodiments of a system-level assembly including an integrated circuit (IC) die directly attached to a mainboard. An IC die directly attached to a mainboard or other circuit board may be referred to as a direct-chip attach (DCA) die. A package is disposed over at least a portion of the DCA die and coupled with the mainboard. The package includes one or more other IC die disposed on a substrate. Other embodiments are described and claimed.
    Type: Application
    Filed: September 8, 2008
    Publication date: March 11, 2010
    Inventors: Damion Searls, Weston C. Roth, Margaret D. Ramirez, James D. Jackson, Rainer E. Thomas, Charles A. Gealer
  • Electronic packaging including die with through silicon via
    Patent number: 7317256
    Abstract: An apparatus, method, and system for electronic device packaging having stacked dice are disclosed herein. A first die has a through silicon via formed therethrough. A second die is landed on the through silicon via of the first die. A mount having a lead is coupled to the through silicon via of the first die.
    Type: Grant
    Filed: June 1, 2005
    Date of Patent: January 8, 2008
    Assignee: Intel Corporation
    Inventors: Christina K. Williams, Rainer E. Thomas