Abstract: Disclosed is a device for testing components under elevated pressure in which a pressure chamber is provided. The lateral boundary of the pressure chamber included a ring and an annular part, which may move perpendicularly to the plane of the component to be tested. A velvet-like lining is provided on the end face of the annular part or of the ring that faces the component to be tested. The fibers of the lining protrude from the annular part or from the ring toward the component to be tested and bridge the gap between the device and the component.

Abstract: Disclosed is a device for testing components under elevated pressure in which a pressure chamber is provided. The lateral boundary of the pressure chamber included a ring and an annular part, which may move perpendicularly to the plane of the component to be tested. A velvet-like lining is provided on the end face of the annular part or of the ring that faces the component to be tested. The fibers of the lining protrude from the annular part or from the ring toward the component to be tested and bridge the gap between the device and the component.

Abstract: A device for avoiding spark discharge during high voltage testing of semiconductor components on semiconductor wafers, includes a pressure chamber provided for the semiconductor wafer in a sealed manner, and having a pressurized gas feed so that the interior thereof is subjected to overpressure and thus the sparking voltage for a spark discharge between contact faces is higher than the maximum test voltage to be applied. The pressure chamber is connected to a probe card including contact probes. The pressure chamber has a movable part, which is movable relative to the parts of the pressure chamber connected to the probe card. An air bearing in the gap between the pressure chamber and the semiconductor wafer holds the movable part of the pressure chamber in a sealed manner spaced from the surface of the semiconductor wafer. The movable part is pressed by a spring force towards the semiconductor wafer.

Abstract: A device for avoiding spark discharge during high voltage testing of semiconductor components on semiconductor wafers, includes a pressure chamber provided for the semiconductor wafer in a sealed manner, and having a pressurized gas feed so that the interior thereof is subjected to overpressure and thus the sparking voltage for a spark discharge between contact faces is higher than the maximum test voltage to be applied. The pressure chamber is connected to a probe card including contact probes. The pressure chamber has a movable part, which is movable relative to the parts of the pressure chamber connected to the probe card. An air bearing in the gap between the pressure chamber and the semiconductor wafer holds the movable part of the pressure chamber in a sealed manner spaced from the surface of the semiconductor wafer. The movable part is pressed by a spring force towards the semiconductor wafer.

Abstract: To limit the current in heavy current testing of semiconductor components with test needles, upstream of each needle a circuit is connected which has low resistance in the range of allowable currents and has high resistance above a given limit current in order to limit the current. The current source which undertakes limitation in the electrical supply lead to the probes is galvanically separated from the voltage supply of the current source itself.

Abstract: To limit the current in heavy current testing of semiconductor components with test needles, upstream of each needle a circuit is connected which has low resistance in the range of allowable currents and has high resistance above a given limit current in order to limit the current. The current source which undertakes limitation in the electrical supply lead to the probes is galvanically separated from the voltage supply of the current source itself.