Patents by Inventor Rainer Goering

Rainer Goering has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11982396
    Abstract: A process for producing a thermoplastic composite pipe, where the process includes: a) providing a tubular liner having a wall containing a thermoplastic polymer A in the region of the outer surface; b) providing a tape containing reinforcing fibres in a matrix containing a thermoplastic polymer B, where polymer A and polymer B are different; c) applying a film or a composite which is produced in d) and is composed of a film and a tape provided in step b) to the tubular liner, with melting of the outer surface of the liner and of the contact surface of the film either beforehand, simultaneously or thereafter, d) applying the tape provided in b) to the outer surface of the film, with melting of the outer surface of the film applied and of the contact surface of the tape either beforehand, simultaneously or thereafter, where the surface of the film which is brought into contact with the liner contains a moulding compound containing polymer A to an extent of at least 30% by weight, and the opposite surface o
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: May 14, 2024
    Assignee: Evonik Operations GmbH
    Inventors: Jasmin Berger, Hans Ries, Juergen Franosch, Rainer Goering, Horst Beyer
  • Patent number: 11504939
    Abstract: A flexible pipe of multilayer structure with unbonded layers, where the pipe has an interior lining which comprises the following layers: a) at least one layer of which the material is composed of a moulding composition based on a polymer selected from the group of: polyarylene ether ketone, polyphenyl sulphone, polyphenylene sulphide, polyarylene ether ketone/polyphenylene sulphide blend and semiaromatic polyamide, where from 5 to 100 mol % of the dicarboxylic acid content thereof derives from an aromatic dicarboxylic acid having from 8 to 22 carbon atoms, and which has a crystallite melting point Tm of at least 260° C.; b) at least one layer of which the material is composed of a fluoropolymer moulding composition can be operated at temperatures above 130° C. The pipe has particular suitability for offshore applications in the production of oil or of gas.
    Type: Grant
    Filed: March 29, 2011
    Date of Patent: November 22, 2022
    Assignee: EVONIK OPERATIONS GmbH
    Inventors: Karl Kuhmann, Andreas Dowe, Rainer Goering
  • Patent number: 11135821
    Abstract: A multilayer composite containing the following layers: I. a first layer (layer I) of a moulding compound containing at least 40 wt. % of the following components: 1) 60 to 99 parts by wt. of a copolyamide based on hexamethylenediamine, terephthalic acid and an aliphatic dicarboxylic acid having 8 to 19 carbon atoms and 2) 40 to 1 parts by wt. of an olefinic copolymer as impact modifier, wherein the parts by wt. of 1) and 2) sum to 100; and II. a second layer (layer II) of a moulding compound containing at least 60 wt. % of fluoropolymer, has a high heat distortion temperature, a very good impact resistance, a high elongation at break and good layer adhesion.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: October 5, 2021
    Assignee: Evonik Operations GmbH
    Inventors: Jasmin Berger, Rainer Goering, Klaus Gahlmann, Michael Boeer, Mario Resing
  • Patent number: 10816113
    Abstract: A process for producing a thermoplastic composite pipe is provided. The thermoplastic composite pipe thus produced contains a liner, two or more composite layers composed of tape laminas, and a single- or multilayer intermediate lamina arranged between different composite layers. Composite formation between identical polymers in the process achieves improved adhesion. The thermoplastic composite pipe is especially suitable for offshore applications in oil or gas production.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: October 27, 2020
    Assignee: Evonik Operations GmbH
    Inventors: Jasmin Berger, Hans Ries, Juergen Franosch, Rainer Goering, Horst Beyer
  • Patent number: 10464296
    Abstract: A multilayer composite containing the following layers: 1. a first layer (layer I) of a moulding compound containing at least 40 wt. % of the following components: 1) 60 to 99 parts by wt. of a copolyamide based on hexamethylenediamine, terephthalic acid and an aliphatic dicarboxylic acid having 8 to 19 carbon atoms and 2) 40 to 1 parts by wt. of an olefinic copolymer as impact modifier, wherein the parts by wt. of 1) and 2) sum to 100; and II. a second layer (layer II) of a moulding compound containing at least 60 wt. % of a mixture of the following components: 1) 75 to 100 parts by wt. of a partly aromatic copolyamide and 2) 25 to 0 parts by wt. of an olefinic copolymer as impact modifier with the proviso that in the moulding compound of layer II the mixture of components 1) and 2) comprises at least 5 fewer parts by wt, of olefinic copolymer than in the moulding compound of layer I, has a high heat distortion temperature, a very good impact resistance, a high elongation at break and good layer adhesion.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: November 5, 2019
    Assignee: Evonik Degussa GmbH
    Inventors: Jasmin Berger, Rainer Goering, Karl Kuhmann
  • Patent number: 10427390
    Abstract: A multilayer composite containing the following layers: I. a first layer (layer I) of a molding compound containing at least 40 wt. % of the following components: 1) 60 to 99 parts by wt. of a copolyamide based on hexamethylenediamine, terephthalic acid and an aliphatic dicarboxylic acid having 8 to 19 carbon atoms and 2) 40 to 1 parts by wt. of an olefinic copolymer as impact modifier, wherein the parts by wt. of 1) and 2) sum to 100; and II. a second layer (layer II) of a molding compound containing at least 60 wt. % of thermoplastic polyester, has a high heat distortion temperature, a very good impact resistance, a high elongation at break and good layer adhesion.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: October 1, 2019
    Assignee: Evonik Degussa GmbH
    Inventors: Jasmin Berger, Rainer Goering, Klaus Gahlmann, Michael Boeer, Mario Resing
  • Patent number: 10252498
    Abstract: A multilayer composite containing the following layers: I. a first layer (layer I) of a molding compound containing at least 40 wt. % of the following components: 1) 60 to 99 parts by wt. of a copolyamide based on hexamethylenediamine, terephthalic acid and an aliphatic dicarboxylic acid having 8 to 19 carbon atoms and 2) 40 to 1 parts by wt. of an olefinic copolymer as impact modifier, wherein the parts by wt. of 1) and 2) sum to 100; II. a second layer (layer II) of a molding compound containing at least 60 wt. % of EVOH; III. a third layer of a polyamide molding compound, has a high heat distortion temperature, a very good impact resistance, a high elongation at break and good layer adhesion.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: April 9, 2019
    Assignee: Evonik Degussa GmbH
    Inventors: Jasmin Berger, Rainer Goering, Klaus Gahlmann, Michael Boeer, Mario Resing
  • Patent number: 10118222
    Abstract: The present invention relates to a process for the bonding of material for the production of three-dimensional objects by selective heating via a laser of wavelength from 100 to 3000 nm. The beam spot may be a focused or unfocused beam spot, or may indeed be spread, as is the case with the diode laser, where the bars may have a stacked arrangement. The selectivity of the melting process is achieved via the application of an absorber to certain subregions of a layer composed of a pulverulent substrate, and then heating of the absorber by laser radiation of wavelength from 100 to 3000 nm. The heated absorber transfers the energy present therein to its surrounding pulverulent substrate, which is melted thereby and, after cooling, has firm cohesive bonding.
    Type: Grant
    Filed: May 20, 2015
    Date of Patent: November 6, 2018
    Assignee: Evonik Degussa GmbH
    Inventors: Sylvia Monsheimer, Maik Grebe, Rainer Goering, Franz-Erich Baumann
  • Patent number: 10094505
    Abstract: A heatable line pipe useful for diesel fuel systems and fuel cell systems is provided. The heatable line pipe comprises in order from an inside of the pipe: a) an electrically insulating inner layer; b) a first electrically conductive layer; c) at least two current leads wound spirally around the first electrically conductive layer; d) a second electrically conductive layer over the at least two current leads forming a surface; and e) an outer cladding of an electrically insulating plastic material. The thickness of the second electrically conductive layer is 0.1 to 1.5 mm, and the at least two current leads form wave peaks in the surface of the second electrically conductive layer. The line pipe has the advantage that a fall in heating performance over the lifetime is effectively prevented.
    Type: Grant
    Filed: May 13, 2013
    Date of Patent: October 9, 2018
    Assignees: EVONIK DEGUSSA GmbH, VOSS AUTOMOTIVE GmbH
    Inventors: Rainer Goering, Michael Boeer, Juergen Franosch, Joerg Westmeier, Otfried Schwarzkopf, Daniel De Beer
  • Patent number: 10072786
    Abstract: A metal conduit pipe, which is covered with an extruded layer made of polyamide molding compound, is used to produce a duct laid in water, wherein in the course of laying the duct, the coating is exposed to a shearing pressure load and/or a bending load due to laying method selected.
    Type: Grant
    Filed: January 20, 2010
    Date of Patent: September 11, 2018
    Assignees: Evonik Degussa GmbH, Salzgitter Mannesmann Line Pipe GmbH
    Inventors: Andreas Dowe, Rainer Goering, Hans-Juergen Kocks, Joern Winkels
  • Publication number: 20180195647
    Abstract: A process for producing a thermoplastic composite pipe is provided. The thermoplastic composite pipe thus produced contains a liner, two or more composite layers composed of tape laminas, and a single- or multilayer intermediate lamina arranged between different composite layers. Composite formation between identical polymers in the process achieves improved adhesion. The thermoplastic composite pipe is especially suitable for offshore applications in oil or gas production.
    Type: Application
    Filed: January 9, 2018
    Publication date: July 12, 2018
    Applicant: Evonik Degussa GmbH
    Inventors: Jasmin Berger, Hans Ries, Juergen Franosch, Rainer Goering, Horst Beyer
  • Patent number: 9574700
    Abstract: A pipeline laid trenchlessly and/or without a sand bed is produced using a metallic conduit which is encased with an extruded layer of a polyamide molding material. In this way, the durability of the outer shell required for trenchless laying techniques without a sand bed is ensured.
    Type: Grant
    Filed: August 27, 2008
    Date of Patent: February 21, 2017
    Assignees: Evonik Degussa GmbH, Salzgitter Mannesmann Line Pipe GmbH
    Inventors: Andreas Dowe, Rainer Goering, Martin Risthaus, Klaus Gahlmann, Reinhard Buessing, Hans-Juergen Kocks, Joern Winkels
  • Patent number: 9314989
    Abstract: The invention relates to a flexible pipe having a multi-layered structure comprising unbonded layers, comprising an inner lining having the following layer arrangement: a) an innermost layer made of a fluoropolymer molding compound, b) an intermediate layer made of a molding compound on the basis of an olefinic polymer, which is selected from the group consisting of polyethylene, isotactic polypropylene, syndiotactic polypropylene and syndiotactic polystyrene, c) an outer layer made of a polyamide molding compound, wherein the layer made of a polyamide molding compound is particularly efficiently protected against hydrolysis. The pipe is thus particularly suited for offshore applications in oil or gas production.
    Type: Grant
    Filed: March 18, 2011
    Date of Patent: April 19, 2016
    Assignee: Evonik Degussa GmbH
    Inventors: Karl Kuhmann, Andreas Dowe, Rainer Goering
  • Patent number: 9309998
    Abstract: The invention relates to a flexible tube of multilayer construction having unbonded layers, wherein at least one layer is formed in that a tape made of a plastic molding compound is spirally wound about a further inner layer, wherein the upper and lower layers of the tape are simultaneously or subsequently welded to each other at overlapping regions.
    Type: Grant
    Filed: April 6, 2011
    Date of Patent: April 12, 2016
    Assignee: Evonik Degussa GmbH
    Inventors: Karl Kuhmann, Andreas Dowe, Rainer Goering
  • Patent number: 9151418
    Abstract: A flexible pipe of multilayer structure which comprises the following layers, from the inside to the outside: an interior lining; an inner reinforcement layer; a layer of molded electrically conductive plastic; an outer reinforcement layer; and an exterior sheath. The electrically conductive plastic layer is in electrical contact with the two reinforcement layers, and the two reinforcement layers can be connected to a source of electrical current. It is thus possible to achieve efficient heating of the pipe, and it can therefore be used for conveying oil in cold regions.
    Type: Grant
    Filed: April 27, 2012
    Date of Patent: October 6, 2015
    Assignee: Evonik Degussa GmbH
    Inventors: Rainer Goering, Andreas Dowe, Karl Kuhmann, Maximilian Gruhn, Juergen Franosch
  • Patent number: 9133965
    Abstract: A flexible pipe which can be heated efficiently, and may therefore be used for conveying oil in cold regions, is provided. The pipe comprises in order from inside to outside: an interior lining; a wound tape; and at least one reinforcement layer. The wound tape contains a first exterior layer of a plastics molding composition that is not electrically conductive; an intermediate layer of an electrically conductive plastics molding composition; and a second exterior layer of a plastics molding composition that is not electrically conductive. A volume resistivity to IEC 60093 of the intermediate layer is in the range from 10?3 to 1010 ?m, and the intermediate layer comprises at least two metallic conductors embedded into the plastic molding composition along an entire length of the tape in such a way that, the two conductors do not touch one another.
    Type: Grant
    Filed: May 3, 2012
    Date of Patent: September 15, 2015
    Assignee: Evonik Degussa GmbH
    Inventors: Rainer Goering, Andreas Dowe, Karl Kuhmann, Maximilian Gruhn, Juergen Franosch
  • Patent number: 9114567
    Abstract: The present invention relates to a process for the bonding of material for the production of three-dimensional objects by selective heating via a laser of wavelength from 100 to 3000 nm. The beam spot may be a focused or unfocused beam spot, or may indeed be spread, as is the case with the diode laser, where the bars may have a stacked arrangement. The selectivity of the melting process is achieved via the application of an absorber to certain subregions of a layer composed of a pulverulent substrate, and then heating of the absorber by laser radiation of wavelength from 100 to 3000 nm. The heated absorber transfers the energy present therein to its surrounding pulverulent substrate, which is melted thereby and, after cooling, has firm cohesive bonding.
    Type: Grant
    Filed: January 27, 2005
    Date of Patent: August 25, 2015
    Assignee: EVONIK DEGUSSA GmbH
    Inventors: Sylvia Monsheimer, Maik Grebe, Rainer Goering, Franz-Erich Baumann
  • Patent number: 8999086
    Abstract: A molding compound for joining two moldings each made of a PA11 and/or PA12 molding compound contains at least 50% by weight of a polyamide component so chosen that it is preparable from linear aliphatic diamines and dicarboxylic acids and/or lactams or ?-aminocarboxylic acids, there being 11 to 12 carbon atoms present per carboxamide group in the repeating units, and, furthermore, this polyamide component containing not more than 80% by weight of either one of the polyamides PA11 and PA12. With this compound a firm weld is obtained both to a PA11 molding and to a PA12 molding.
    Type: Grant
    Filed: August 13, 2008
    Date of Patent: April 7, 2015
    Assignee: Evonik Degussa GmbH
    Inventors: Sonja Bollmann, Rainer Goering, Franz-Erich Baumann, Andreas Dowe, Vera Schiemann
  • Patent number: 8679270
    Abstract: A pipe or hose composed of a polyamide moulding composition whose molecular weight has been increased by condensation, via addition of a compound having at least two carbonate units in a quantitative proportion of from 0.005 to 10% by weight, based on polyamide, where a) a starting polyamide moulding composition was provided, b) a mixture of the starting polyamide moulding composition and of the compound having at least two carbonate units was produced, c) the premix was, if desired, stored and/or transported, and d) the premix was then processed to give the moulding, this step being the first in which the increase of molecular weight by condensation occurred, the moulding being a pipe or hose whose external diameter is at least 25 mm is used as inliner for a pipeline.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: March 25, 2014
    Assignee: Evonik Degussa GmbH
    Inventors: Andreas Dowe, Rainer Goering, Christian Baron
  • Patent number: 8647551
    Abstract: A process for producing moldings with condensing-up of a polyamide molding composition whose polyamide component contains, as a result of the method of preparation, at least 5 ppm of phosphorus in the form of an acidic compound by means of a compound having at least two carbonate units, wherein a) from 0.001 to 10% by weight, based on the polyamide, of a salt of a weak acid is added to the polyamide molding composition prior to compounding or during compounding, b) a mixture of the finished composition and the compound having at least two carbonate units is prepared, c) the mixture is, if appropriate, stored and/or transported and d) the mixture is subsequently processed to produce the molding, with the condensing-up occurring only in this step, effects a significant increase in the melt stiffness combined with moderate processing pressures, which considerably simplifies, in particular, the production of hollow bodies and hollow profiles having large diameters.
    Type: Grant
    Filed: February 15, 2006
    Date of Patent: February 11, 2014
    Assignee: Evonik Degussa GmbH
    Inventors: Andreas Dowe, Rainer Goering, Martin Himmelmann, Sonja Bollmann, Franz-Erich Baumann, Roland Wursche