Abstract: A sound test device for testing a DUT in particular a MEMS microphone, comprises a sound chamber a socket unit and a sound generator unit, wherein the sound generator unit includes a speaker comprising a speaker membrane, an opening, and a reference microphone comprising a microphone membrane wherein the opening is adapted to receive a DUT opening of the DUT and wherein the microphone membrane and the opening are arranged to opposing each other, and the socket unit includes the at least one contact element being adapted to contact to a contact terminal of the DUT, and wherein the sound chamber is limited by the speaker membrane, the microphone membrane, and the opening.

Abstract: According to the invention, there is provided a boat which comprises, a surface on which a plurality of electronic components can be supported, the surface having a plurality holes defined therein through which a vacuum can be passed to hold components on the surface; and a first vacuum inlet which is in fluid communication with the plurality of holes, wherein the first vacuum inlet can be fluidly connected to a first vacuum generating means so that the first vacuum generating means can provide a vacuum at the plurality of holes; a second vacuum inlet which is in fluid communication with the same plurality of holes with which the first vacuum inlet is in fluid communication with, wherein the second vacuum inlet can be fluidly connected to a second vacuum generating means so that the second vacuum generating means can provide a vacuum at the plurality of holes.

Abstract: According to the present invention there is provided a component handling assembly ( ) suitable for facilitating loading or unloading a plurality of components onto/from a carrier, the assembly comprising, a carrier (1) which comprises a surface (3) on which a plurality of components (50) can be supported, wherein the surface (3) has a plurality of holes (5) defined therein; a vacuum generator (21) which can be arranged in fluid communication with said plurality of holes (5) in the surface (3) of the carrier (1) so that a vacuum can be applied, through said plurality of holes (5), to components (50) supported on the surface (3) of the carrier (1), to hold components (50) on the surface (3) of the carrier (5); a vacuum sensor (22) for sensing the level of vacuum applied to components (50) supported on the surface (3) of the carrier; a controller (23) for controlling the vacuum generator (21) during loading and/or unloading of component(s) onto/from the surface (3) of the carrier, based on the level of vacuum s

Abstract: Contactor arrangement of an IC test handler, comprising: a contactor unit which has test contacts for contacting an IC in test and for temporarily pressing the IC against the test contacts, a plunger head, which has a recessed central region corresponding to the geometrical configuration of the IC, such that those surface of the IC which is adjacent to the upper surface of the plunger head does not touch the plunger head surface, and a contactor unit interface, which includes a vacuum suction system for actively attracting the IC to an IC contact surface of the contactor unit interface, that corresponds with an adjacent surface of the IC having IC device contacts and, thus, towards the test contacts of the contactor unit.

Abstract: Contactor arrangement of an IC test handler, comprising: a contactor unit which has test contacts for contacting an IC in test and for temporarily pressing the IC against the test contacts, a plunger head, which has a recessed central region corresponding to the geometrical configuration of the IC, such that those surface of the IC which is adjacent to the upper surface of the plunger head does not touch the plunger head surface, and a contactor unit interface, which includes a vacuum suction system for actively attracting the IC to an IC contact surface of the contactor unit interface, that corresponds with an adjacent surface of the IC having IC device contacts and, thus, towards the test contacts of the contactor unit.