Abstract: A solid-state contactor includes a housing, a lead, a bus plate, and an end connector. The lead extends through the housing and into an interior of the housing. The bus plate is disposed within the housing interior and mounts a die which is electrically connected to the lead through the bus plate. The end connector extends between the bus plate and the lead, attaching to the bus plate at an angle for coupling a plurality of bus plates with die to the lead in a stacked arrangement.

Abstract: A solid state power controller including: a plurality of pairs of FETs connected in parallel, each pair comprising a first, forward-facing FET and a second, backward-facing FET connected by their respective sources; gate drive means for switching said FETs on and off; and means for isolating the sources of the backwards-facing FETs of the plurality of pairs of FETs from each other and operating the backwards-facing FETs in 3rd quadrant operation mode.

Abstract: An electrical contactor assembly is provided including an electrical bus bar and at least one electrical contactor. The electrical bus bar includes a layer of insulation, a layer of copper, and a composite core having at least one wire embedded therein. The wire is configured to locally reduce thermal strain. The at least one electrical contactor is mounted to the layer of copper through an opening in the layer of insulation. The electrical contactor and the bus bar are thermally and electrically connected.

Abstract: A solid state switch module is provided for use in a power distribution network including an input differential protection connection for receiving a measured current value from an upstream module. The solid state switch module also includes an output differential protection connection for sending a measured current value. The solid state switch module includes a trip outlet for sending a trip signal to an upstream solid state switch, and a trip inlet for receiving a trip signal from a downstream solid state switch. The trip inlet is operably coupled to the switch. A current sensor measures the current value of a connected power transmission line across the solid state switch module. A summer adds a current input from a parallel module with the current measures by the current sensor. A comparator determines whether an amount of current lost between the solid state switch module and an upstream module is acceptable.

Abstract: A solid state power controller including: a plurality of pairs of FETs connected in parallel, each pair comprising a first, forward-facing FET and a second, backward-facing FET connected by their respective sources; gate drive means for switching said FETs on and off; and means for isolating the sources of the backwards-facing FETs of the plurality of pairs of FETs from each other and operating the backwards-facing FETs in 3rd quadrant operation mode.

Abstract: A solid-state contactor includes a housing, a lead, a bus plate, and an end connector. The lead extends through the housing and into an interior of the housing. The bus plate is disposed within the housing interior and mounts a die which is electrically connected to the lead through the bus plate. The end connector extends between the bus plate and the lead, attaching to the bus plate at an angle for coupling a plurality of bus plates with die to the lead in a stacked arrangement.

Abstract: An electrical contactor assembly is provided including an electrical bus bar and at least one electrical contactor. The electrical bus bar includes a layer of insulation, a layer of copper, and a composite core having at least one wire embedded therein. The wire is configured to locally reduce thermal strain. The at least one electrical contactor is mounted to the layer of copper through an opening in the layer of insulation. The electrical contactor and the bus bar are thermally and electrically connected.

Abstract: A printed wiring board (PWB) includes a substrate having first and second opposing surfaces and a busbar coupled to the substrate. The busbar includes a power input connector and a cross-sectional dimension configured and disposed to carry at least 100 amperes. At least one semiconductor device is mounted to the busbar. The at least one semiconductor device includes an input electrically coupled to the busbar and an output. One or more output conductors are electrically coupled to the output of the at least one semiconductor device. The one or more output conductors include a cross-sectional dimension configured and disposed to carry at least 50 amperes.

Abstract: A method is described for interconnecting first, 27, and second, 22, components on a substrate, 21. The method comprises attaching said first component, 27, to said substrate, attaching said second component, 22, to said substrate, 21, said first and second components being positioned relative to each other on said substrate to form a gap, 31, therebetween. The method further comprises the step of depositing a layer, 24, of electrically insulating material in said gap, and electrically connecting said first component, 27, with said second component, 22, by depositing, upon said electrically insulating layer, a layer of electrically conducting material, 26, which is in contact with and extends from a surface of said first electronic component, across said gap, 31, and said layer of electrically insulating material, 24, and to a surface of said second electronic component, 22. The method is characterized in that a plasma deposition process is used to deposit at least one of said layers of material.

Abstract: A solid state switch module is provided for use in a power distribution network including an input differential protection connection for receiving a measured current value from an upstream module. The solid state switch module also includes an output differential protection connection for sending a measured current value. The solid state switch module includes a trip outlet for sending a trip signal to an upstream solid state switch, and a trip inlet for receiving a trip signal from a downstream solid state switch. The trip inlet is operably coupled to the switch. A current sensor measures the current value of a connected power transmission line across the solid state switch module. A summer adds a current input from a parallel module with the current measures by the current sensor. A comparator determines whether an amount of current lost between the solid state switch module and an upstream module is acceptable.

Abstract: An electrical fuse apparatus comprises a conductor element defining an electrically conductive path between respective wire terminals for connecting the fuse apparatus to an electrical circuit. The conductor element includes a first reactive material and at least one ignition point for receiving external energy to initiate an exothermic reaction of the first reactive material with a second reactive material. The reaction generates a quantity of heat sufficient to melt the conductor and break the conductive path. The fuse can be an element in electrical circuits, including power controllers. A method for protecting a system using an exothermic fuse apparatus is also disclosed.

Abstract: A current measurement and comparing assembly for a power distribution system includes a solid state contactor module having a control section and a power section, wherein the power section includes at least one solid state switch. Also included is a current sensor disposed in the control section and in operable communication with the at least one solid state switch, wherein the current sensor distributes current data to a switch control configured to control the at least one solid state switch and distributes current data to a current measurement and comparison circuit.

Abstract: A power distribution system includes a plurality of power sources for generating power. Also included is at least one power routing element in operable communication with each of the plurality of power sources, the at least one power routing element being configured to selectively receive power from the plurality of power sources. Further included is at least one load in operable communication with the at least one power routing element, wherein the at least one power routing element controllably determines which of the plurality of power sources to selectively receive power from.

Abstract: A printed wiring board (PWB) includes a substrate having first and second opposing surfaces and a busbar coupled to the substrate. The busbar includes a power input connector and a cross-sectional dimension configured and disposed to carry at least 100 amperes. At least one semiconductor device is mounted to the busbar. The at least one semiconductor device includes an input electrically coupled to the busbar and an output. One or more output conductors are electrically coupled to the output of the at least one semiconductor device. The one or more output conductors include a cross-sectional dimension configured and disposed to carry at least 50 amperes.

Abstract: An interface module includes a first side having a plurality of input connectors of a same cross-sectional area corresponding to a same amperage rating, a second side having a plurality of output connectors of different cross-sectional areas from each other corresponding to different amperage ratings from each other, and wiring in the interface module configured to connect a first number of input connectors to a first one of the output connectors having a first amperage rating, and configured to connect a second number of input connectors to a second one of the output connectors having a second amperage rating different from the first amperage rating.