Patents by Inventor Rainer Klaus Krause
Rainer Klaus Krause has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20100297800Abstract: A solar cell panel and method of forming a solar cell panel. The method includes a: forming an electrically conductive bus bar on a top surface of a bottom cover plate; forming an electrically conductive contact frame proximate to a bottom surface of a top cover plate, the top cover plate transparent to visible light; and placing an array of rows and columns of solar cell chips between the bottom cover plate and the top cover plate, each solar cell chip of the array of solar cell chips comprising an anode adjacent to a top surface and a cathode adjacent to a bottom surface of the solar cell chip, the bus bar electrically contacting each anode of each solar cell chip of the array of solar cell chips and the contact frame contacting each anode of each solar cell chip of the array of solar cell chips.Type: ApplicationFiled: August 3, 2010Publication date: November 25, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Harold John Hovel, Rainer Klaus Krause, Xiaoyan Shao, Steven Erik Steen
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Publication number: 20100297802Abstract: Solar cell assemblies and method of making solar cell assemblies. The method, including: fabricating solar cell chips on solar cell wafers; dicing the solar cell wafers into individual solar cell chips; packaging the individual solar cell chips in molded plastic packages to form solar cell chip packages; and mounting on and electrically connecting one or more of the solar cell chip packages to a printed circuit board. The assemblies including a printed circuit board; one or more solar cell chip packages mounted on and electrically connected to the printed circuit board, each of said one or more solar chip packages comprising a solar cell chip and a lead frame encapsulated in a molded plastic body, top surfaces the solar cell chips exposed in top surfaces of the molded plastic bodies.Type: ApplicationFiled: August 3, 2010Publication date: November 25, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Christian Becker, Hans-Juergen Eickelmann, Michael Haag, Rainer Klaus Krause, Markus Schmidt
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Publication number: 20100050428Abstract: A method for manufacturing a solar concentrator cell module assembly within an integrated circuit process, which solar concentrator cell module assembly includes at least one solar device and which solar device includes one printed circuit board and one Fresnel lens. A printed circuit board is assembled according to a pre-defined circuit board base design layout that allows pick and place of a single solar concentrator cell chip onto a circuit board base. Connections are provided for the solar concentrator cell chip in a serialized or a parallelized arrangement on the circuit board base, and a plurality of openings are formed in the circuit board base below a backside of the solar concentrator chip to enable attachment of cooling fingers.Type: ApplicationFiled: September 3, 2008Publication date: March 4, 2010Applicant: International Business Machines CorporationInventors: Christian Becker, Hans-Juergen Eickelmann, Michael Haag, Rainer Klaus Krause, Thorsten Muehge, Markus Schmidt
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Publication number: 20100037933Abstract: A solar cell panel and method of forming a solar cell panel. The method includes a: forming an electrically conductive bus bar on a top surface of a bottom cover plate; forming an electrically conductive contact frame proximate to a bottom surface of a top cover plate, the top cover plate transparent to visible light; and placing an array of rows and columns of solar cell chips between the bottom cover plate and the top cover plate, each solar cell chip of the array of solar cell chips comprising an anode adjacent to a top surface and a cathode adjacent to a bottom surface of the solar cell chip, the bus bar electrically contacting each anode of each solar cell chip of the array of solar cell chips and the contact frame contacting each anode of each solar cell chip of the array of solar cell chips.Type: ApplicationFiled: August 12, 2008Publication date: February 18, 2010Inventors: Harold John Hovel, Rainer Klaus Krause, Xiaoyan Shao, Steven Erik Steen
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Publication number: 20100037936Abstract: Solar cell assemblies and method of making solar cell assemblies. The method, including: fabricating solar cell chips on solar cell wafers; dicing the solar cell wafers into individual solar cell chips; packaging the individual solar cell chips in molded plastic packages to form solar cell chip packages; and mounting on and electrically connecting one or more of the solar cell chip packages to a printed circuit board. The assemblies including a printed circuit board; one or more solar cell chip packages mounted on and electrically connected to the printed circuit board, each of said one or more solar chip packages comprising a solar cell chip and a lead frame encapsulated in a molded plastic body, top surfaces the solar cell chips exposed in top surfaces of the molded plastic bodies.Type: ApplicationFiled: August 12, 2008Publication date: February 18, 2010Inventors: Christian Becker, Hans-Juergen Eickelmann, Michael Haag, Rainer Klaus Krause, Markus Schmidt
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Publication number: 20100037939Abstract: A method of fabricating solar cell chips. The method includes creating an integrated circuit chip process route for fabricating integrated circuit chips using integrated circuit wafers in an integrated circuit fabrication facility; creating a solar cell process route for fabricating solar cells using solar cell wafers in the integrated circuit fabrication facility; releasing integrated circuit chip wafers and solar cell wafers into tool queues of tools of the an integrated circuit fabrication facility; and processing the solar cell wafers on at least some tools of the integrated circuit fabrication facility used to process the integrated circuit wafers. Also the process used to fabricate the solar cell chips.Type: ApplicationFiled: August 12, 2008Publication date: February 18, 2010Inventors: Hans-Juergen Eickelmann, Michael Haag, Harold J. Hovel, Rainer Klaus Krause, Markus Schmidt, Xiaoyan Shao, Steven Erik Steen
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Publication number: 20090254535Abstract: The present invention provides an improved method of handling product recall activities through traceability. One embodiment of the present invention involves gathering data in a multi-layered database architecture containing supply, process, test, and customer layers. The data is supplied to a traceability module which contains a search engine to link and access the data. The search engine enables a search by part number, lot number, serial number, time stamp, and date/time frame. A traceability analysis is generated from the search, allowing failure analysis of the data. This analysis is performed through an event list over the entire supply, manufacturing, and customer data, facilitating backward and forward traceability of parts and components of the parts. This failure analysis further facilitates automatic response such as automatic warning and automatic recall to manufacturers and customers.Type: ApplicationFiled: April 2, 2008Publication date: October 8, 2009Applicant: International Business Machines CorporationInventors: Hans-Juergen Eickelmann, Rainer Klaus Krause, Thorsten Muhge
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Patent number: 7335461Abstract: The invention relates to a method of structuring of a substrate by providing a polymerization starter layer on the substrate, applying a radiation field on the polymerization starter layer for selectively reducing a density of polymerization starters of the polymerization starter layer, applying monomers and then polymerizing of the monomers, the polymerization being initiated by the starters of the polymerization starter layer, and structuring the substrate using the polymerized monomers as a mask.Type: GrantFiled: July 26, 2006Date of Patent: February 26, 2008Assignee: International Business Machines CorporationInventors: Rainer Klaus Krause, Markus Schmidt
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Patent number: 7336445Abstract: A magnetic recording device makes use of an “anchored” conductive stud which is securely attached within its surrounding insulator materials. The conductive stud is formed over a conductive layer which is coupled to or part of a read or a write head element of the magnetic recording device. The conductive stud has a top stud portion and a bottom undercut portion formed over the conductive layer. In one illustrated embodiment, the bottom undercut portion has a width that is greater than the width of the top stud portion. Since an insulator is formed around the conductive stud and over its bottom undercut portion, a secure coupling between the conductive stud and the conductive layer is provided. Preferably, the conductive layer is made of copper (Cu), the conductive stud is made of gold (Au), and the insulator is alumina (Al2O3). A seed layer may be formed between the conductive stud and the conductive layer. A method of making the conductive stud using a photolithography process is also disclosed.Type: GrantFiled: January 4, 2006Date of Patent: February 26, 2008Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Rainer Klaus Krause, Jan Marien, Johannes Thomas Paul, Gunther Wilhelm Sandmann, Gerhard Anton Scherb, Hubert Erwin Schuy, Stefan Seifried
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Publication number: 20070289896Abstract: A package for the transportation of contamination vulnerable articles is provided, comprising a closeable plastic container which is loaded with the respective articles, a first bag made from plastic surrounding said container, and a second bag made from plastic wrapping said first bag, wherein said first bag is provided with a valve-filter arrangement in order to allow a controlled air stream into said first bag when opening said valve-filter arrangement.Type: ApplicationFiled: March 12, 2007Publication date: December 20, 2007Applicant: International Business Machines CorporationInventors: Rainer Klaus Krause, Michael Haag, Gerd Pfeiffer, Markus Schmidt
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Patent number: 7270940Abstract: The invention relates to a method of structuring of a substrate by providing a polymerization starter layer on the substrate, applying a radiation field on the polymerization starter layer for selectively reducing a density of polymerization starters of the polymerization starter layer, applying monomers and then polymerizing of the monomers, the polymerization being initiated by the starters of the polymerization starter layer, and structuring the substrate using the polymerized monomers as a mask.Type: GrantFiled: December 3, 2003Date of Patent: September 18, 2007Assignee: International Business Machines CorporationInventors: Rainer Klaus Krause, Markus Schmidt
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Patent number: 7041436Abstract: Method for the Manufacture of Micro Structures A method for the manufacture of micro structures in substrates is provided. The method uses a combination of photolithographic mask technology and micro contact printing.Type: GrantFiled: December 12, 2003Date of Patent: May 9, 2006Assignee: International Business Machines CorporationInventors: Rainer Klaus Krause, Markus Schmidt
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Patent number: 7020959Abstract: Methods of making a magnetic recording device with an “anchored” conductive stud which is securely attached within its surrounding insulator materials. The conductive stud is formed over a conductive layer which is coupled to or part of a read or a write head element of the magnetic recording device. The conductive stud has a top stud portion and a bottom undercut portion formed over the conductive layer. In one illustrated embodiment, the bottom undercut portion has a width that is greater than the width of the top stud portion. Since an insulator is formed around the conductive stud and over its bottom undercut portion, a secure coupling between the conductive stud and the conductive layer is provided. Preferably, the conductive layer is made of copper (Cu), the conductive stud is made of gold (Au), and the insulator is alumina (Al2O3). A seed layer may be formed between the conductive stud and the conductive layer.Type: GrantFiled: December 6, 2002Date of Patent: April 4, 2006Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Rainer Klaus Krause, Jan Marien, Johannes Thomas Paul, Gunther Wilhelm Sandmann, Gerhard Anton Scherb, Hubert Erwin Schuy, Stefan Seifried
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Patent number: 6934111Abstract: The invention relates to a method and a system for testing a head gimbal assembly, the system comprising means (54) for inputting a control command to perform a long seek operation, means (55) for measuring the mechanical frequency response of the head gimbal assembly to the long seek operation, and means (57) for comparing the frequency response to a master frequency response (58).Type: GrantFiled: July 8, 2003Date of Patent: August 23, 2005Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Rainer Klaus Krause, Edgar Maehringer-Kunz
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Patent number: 6844144Abstract: A method of constructing an air bearing on a single slider used as a support for a magnetic recording head is described. A recessed surface of the air bearing is constructed by: applying a polymerization initiator (preferably azomonochlorsilane), forming a pattern in the initiator, forming a polymer brush, and ion milling. The application of the polymerization initiator may be from solution or by stamping.Type: GrantFiled: August 27, 2002Date of Patent: January 18, 2005Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Rainer Klaus Krause, Markus Schmidt, Stefan Seifried, Wolfgang Egert, Eva Urlaub, Ashok Lahiri
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Publication number: 20040121527Abstract: The invention relates to a method of structuring of a substrate by providing a polymerization starter layer on the substrate, applying a radiation field on the polymerization starter layer for selectively reducing a density of polymerization starters of the polymerization starter layer, applying monomers and then polymerizing of the monomers, the polymerization being initiated by the starters of the polymerization starter layer, and structuring the substrate using the polymerized monomers as a mask.Type: ApplicationFiled: December 3, 2003Publication date: June 24, 2004Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Rainer Klaus Krause, Markus Schmidt
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Publication number: 20040109258Abstract: A magnetic recording device makes use of an “anchored” conductive stud which is securely attached within its surrounding insulator materials. The conductive stud is formed over a conductive layer which is coupled to or part of a read or a write head element of the magnetic recording device. The conductive stud has a top stud portion and a bottom undercut portion formed over the conductive layer. In one illustrated embodiment, the bottom undercut portion has a width that is greater than the width of the top stud portion. Since an insulator is formed around the conductive stud and over its bottom undercut portion, a secure coupling between the conductive stud and the conductive layer is provided. Preferably, the conductive layer is made of copper (Cu), the conductive stud is made of gold (Au), and the insulator is alumina (Al2O3). A seed layer may be formed between the conductive stud and the conductive layer. A method of making the conductive stud using a photolithography process is also disclosed.Type: ApplicationFiled: December 6, 2002Publication date: June 10, 2004Inventors: Rainer Klaus Krause, Jan Marien, Johannes Thomas Paul, Gunther Wilhelm Sandmann, Gerhard Anton Scherb, Hubert Erwin Schuy, Stefan Seifried
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Publication number: 20040043335Abstract: A method of constructing an air bearing on a single slider used as a support for a magnetic recording head is described. A recessed surface of the air bearing is constructed by: applying a polymerization initiator (preferably azomonochlorsilane), forming a pattern in the initiator, forming a polymer brush, and ion milling. The application of the polymerization initiator may be from solution or by stamping.Type: ApplicationFiled: August 27, 2002Publication date: March 4, 2004Inventors: Rainer Klaus Krause, Markus Schmidt, Stefan Seifried, Wolfgang Egert, Eva Urlaub, Ashok Lahiri
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Publication number: 20040036996Abstract: The invention relates to a method and a system for testing a head gimbal assembly, the system comprising means (54) for inputting a control command to perform a long seek operation, means (55) for measuring the mechanical frequency response of the head gimbal assembly to the long seek operation, and means (57) for comparing the frequency response to a master frequency response (58).Type: ApplicationFiled: July 8, 2003Publication date: February 26, 2004Applicant: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Rainer Klaus Krause, Edgar Maehringer-Kunz
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Publication number: 20030218831Abstract: The present invention provides for a write head used in magnetic recording. The write head has at least one coil and the turns in the coil may have a high aspect ratio allowing the head to be used in high density, high data rate applications. Voids in the spaces between turns are avoided by partially removing a photoresist layer before a protective layer overcoat is applied.Type: ApplicationFiled: May 21, 2002Publication date: November 27, 2003Inventors: Rainer Klaus Krause, Marion Hejny, Stefan Seifried, Markus Schmidt, Manfred Ebert