Abstract: The invention relates to a lead-frame configuration with a frame base and multiplicity of lead-frames connected with the frame base, of which each lead-frame is intended to hold a chip, where each lead-frame has two connection plates of which each is intended to connect with a connection of a chip, where the two connection plates of each lead-frame delimit a bridging zone which can be bridged using a chip.

Abstract: In the case of a product (1) having a first product sub-part (4) and a second product sub-part (3), the two product sub-parts (3, 4) each comprise two connection zones (8, 9, 10, 11) consisting of metal and of suitably thin construction for a crimping process and the connection zones (8, 9, 10, 11) are connected together in pairs by means in each case of a crimp connection, in which the connection zones (10, 11) of at least one product sub-part (3) exhibit the remnants (16), remaining after performance of the crimping process, of elevations (17) present prior to performance of the crimping process.

Abstract: In a data carrier (1), or a module (3) for such a data carrier (1), the module (3) has an integrated component (4) with at least two projecting connection contacts (5, 6) and, for each connection contact (5, 6), a connecting part (7, 8) which is electrically conductively connected thereto, the connecting parts (7, 8) consisting of metal, being constructed so as to be plate-shaped, and including remnants (11) of raised portions which have been formed by mechanical deformation of the connecting parts (7, 8).

Abstract: In a data carrier (1), or a module (3) for such a data carrier (1), the module (3) has an integrated component (4) with at least two projecting connection contacts (5, 6) and, for each connection contact (5, 6), a connecting part (7, 8) which is electrically conductively connected thereto, the connecting parts (7, 8) consisting of metal, being constructed so as to be plate-shaped, and including remnants (11) of raised portions which have been formed by mechanical deformation of the connecting parts (7, 8).

Abstract: In a lead-frame configuration (1), which has a frame base (3) and a multiplicity of lead-frames (6, 7, 8, 9, 10, 11) connected with the frame base (3) and intended to hold a chip each, each lead-frame (6, 7, 8, 9, 10, 11) has two connecting plates (12, 13), and each connecting plate (12, 13) is connected with the frame base (3) via connecting webs (28, 29, 30, 31, 32, 33) and the two connecting plates (12, 13) of each lead-frame (6, 7, 8, 9, 10, 11) delimit a bridging zone (34) which can be bridged using a chip and which is formed by only a narrow air gap (34) so that the two connecting plates (12, 13) of each lead-frame (6, 7, 8, 9, 10, 11) about each other directly without a further intermediate section of the lead-frame concerned.

Abstract: In the case of a product (1) having a first product sub-part (4) and a second product sub-part (3), the two product sub-parts (3, 4) each comprise two connection zones (8, 9, 10, 11) consisting of metal and of suitably thin construction for a crimping process and the connection zones (8, 9, 10, 11) are connected together in pairs by means in each case of a crimp connection, in which the connection zones (10, 11) of at least one product sub-part (3) exhibit the remnants (16), remaining after performance of the crimping process, of elevations (17) present prior to performance of the crimping process.

Abstract: In a product (4) with a component (19) which has at least one component contact (20, 21) formed by a metal bump (20, 21), and with a substrate (15) which has at least one substrate contact (16, 17), an electrically conductive intermetallic connection (34, 35) is formed in each case between a component contact (20, 21) and a substrate contact (16, 17) and between the component (19) and the substrate (15) is provided a protective layer (26) formed using a foil which was fixedly connected with the substrate (15) before formation of the electrically conductive intermetallic connection (34, 35) existing in each case between a component contact (20, 21) and a substrate contact (16, 17) and which can be softened at least once under the effect of heat.

Abstract: A hair drier hood is formed of an approximately sickle shaped laterally open cap (1) and a pair of arms (4, 5) located on the opposite sides of the cap. Each of said arm has a heating element (12), and a plurality of spaced apart heating elements (8) are located in the cap. A box shaped projection (2) is located at the end of the cap arranged to be located adjacent the neck of a person. A blower (13) is positioned in the projection (2) and arranged to direct air into the cap. In the cap (1) the heating elements (8) are separated from ducts (15, 16) by a reflector (10). The reflector (10) contain air outlet orifices (9) spaced apart along the cap. Air is directed through the ducts (15, 16) along the length of the cap (1) and passes through the air outlet orifices (9) and toward the head of the person using the drier.