Patents by Inventor Rainer Plontke

Rainer Plontke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7880152
    Abstract: The invention relates to a device and a method for producing resist profiled elements. According to the invention, an electron beam lithography system is used to produce an electron beam, the axis of the beam being essentially perpendicular to a resist layer in which the resist profiled element is to be produced. The electron beam can be adjusted in terms of the electron surface dose in such a way that a non-orthogonal resist profiled element can be produced as a result of the irradiation by the electron beam.
    Type: Grant
    Filed: March 30, 2005
    Date of Patent: February 1, 2011
    Assignees: Giesecke & Devrient GmbH, Vistec Electron Beam GmbH
    Inventors: Wittich Kaule, Rainer Plontke, Ines Stolberg, Andreas Schubert, Marius Dichtl
  • Publication number: 20080197295
    Abstract: The invention relates to a device and a method for producing resist profiled elements. According to the invention, an electron beam lithography system is used to produce an electron beam, the axis of the beam being essentially perpendicular to a resist layer in which the resist profiled element is to be produced. The electron beam can be adjusted in terms of the electron surface dose in such a way that a non-orthogonal resist profiled element can be produced as a result of the irradiation by the electron beam.
    Type: Application
    Filed: March 30, 2005
    Publication date: August 21, 2008
    Applicant: VISTEC ELECTRON BEAM GMBH
    Inventors: Wittich Kaule, Rainer Plontke, Ines Stollberg, Andreas Schubert, Marius Dichtl
  • Patent number: 6774375
    Abstract: In a method for forming, with the aid of an electron beam (6), a polyline on a substrate (4) coated with a radiation-sensitive resist, the electron beam (6) is directed onto a surface of the substrate (4) in the direction of a Z coordinate, and the substrate (4) is displaced relative to the electron beam (6) in an X-Y plane in individual steps. After each individual step of the displacement, the electron beam (6) acts with a predefined energy input on the substrate (4) during a halt in the displacement motion. The energy input for each individual step is determined as a function of the shape of the polyline ascertained from several preceding individual steps. Also described is a corresponding apparatus with which, using electron beam lithography, it is possible to form polylines with a very uniform line width. The method and apparatus are particularly suitable for writing curved polylines.
    Type: Grant
    Filed: March 5, 2001
    Date of Patent: August 10, 2004
    Assignee: Leica Microsystems Lithography GmbH
    Inventors: Rainer Plontke, Andreas Schubert, Michael Blume, Ines Stolberg
  • Patent number: 6635884
    Abstract: The invention refers to the field of electron beam lithography, in particular to a method for directing an electron beam (6) onto a target position (Z) on the surface of a substrate, the substrate first being placed onto a movable stage (2) and the stage (2) then being displaced stepwise, in the X and/or Y coordinates of a Cartesian grid, until the target position (Z) is located at a spacing from the impact point (P) of the undeflected electron beam (6) which is smaller than the smallest step distance of the stage displacement system, and then the electron beam (6) is directed onto the target position (Z) by deflection. This results in a considerable increase in positioning accuracy in electron beam lithography. Positioning accuracies on the order of 0.1 nm to 0.05 are achievable. The method is suitable in particular for writing grating patterns in which the spacing between the individual grating lines must be maintained with high accuracy.
    Type: Grant
    Filed: March 5, 2001
    Date of Patent: October 21, 2003
    Assignee: Leica Microsystems Lithography GmbH
    Inventors: Rainer Plontke, Ines Stolberg, Michael Blume, Rainer Kaebsch, Matthias Zierbock
  • Publication number: 20010040221
    Abstract: In a method for forming, with the aid of an electron beam (6), a polyline on a substrate (4) coated with a radiation-sensitive resist, the electron beam (6) is directed onto a surface of the substrate (4) in the direction of a Z coordinate, and the substrate (4) is displaced relative to the electron beam (6) in an X-Y plane in individual steps. After each individual step of the displacement, the electron beam (6) acts with a predefined energy input on the substrate (4) during a halt in the displacement motion.
    Type: Application
    Filed: March 5, 2001
    Publication date: November 15, 2001
    Inventors: Rainer Plontke, Andreas Schubert, Michael Blume, Ines Stolberg
  • Publication number: 20010028039
    Abstract: The invention refers to the field of electron beam lithography, in particular to a method for directing an electron beam (6) onto a target position (Z) on the surface of a substrate, the substrate first being placed onto a movable stage (2) and the stage (2) then being displaced stepwise, in the X and/or Y coordinates of a Cartesian grid, until the target position (Z) is located at a spacing from the impact point (P) of the undeflected electron beam (6) which is smaller than the smallest step distance of the stage displacement system, and then the electron beam (6) is directed onto the target position (Z) by deflection.
    Type: Application
    Filed: March 5, 2001
    Publication date: October 11, 2001
    Inventors: Rainer Plontke, Ines Stolberg, Michael Blume, Rainer Kabsch, Matthias Zierbock