Abstract: An interconnect module includes a metal clip having a first end section, a second end section and a middle section extending between the first and the second end sections. The first end section is configured for external attachment to a bare semiconductor die or packaged semiconductor die attached to a carrier or to a metal region of the carrier. The second end section is configured for external attachment to a different metal region of the carrier or to a different semiconductor die or packaged semiconductor die attached to the carrier. The module further includes a magnetic field sensor secured to the metal clip. The magnetic field sensor is operable to sense a magnetic field produced by current flowing through the metal clip. The interconnect module can be used to form a direct electrical connection between components and/or metal regions of a carrier to which the module is attached.

Abstract: A semiconductor device package includes a leadframe and a semiconductor chip mounted to the leadframe. The semiconductor device package further includes a molded encapsulant configured to cast-in-place the leadframe. A surface area of the leadframe remains exposed by the encapsulant. An electrically insulating covering layer extends over a part of the surface area and is configured to divide the surface area in at least two zones.

Abstract: A semiconductor device package includes a leadframe and a semiconductor chip mounted to the leadframe. The semiconductor device package further includes a molded encapsulant configured to cast-in-place the leadframe. A surface area of the leadframe remains exposed by the encapsulant. An electrically insulating covering layer extends over a part of the surface area and is configured to divide the surface area in at least two zones.

Abstract: An interconnect module includes a metal clip having a first end section, a second end section and a middle section extending between the first and the second end sections. The first end section is configured for external attachment to a bare semiconductor die or packaged semiconductor die attached to a carrier or to a metal region of the carrier. The second end section is configured for external attachment to a different metal region of the carrier or to a different semiconductor die or packaged semiconductor die attached to the carrier. The module further includes a magnetic field sensor secured to the metal clip. The magnetic field sensor is operable to sense a magnetic field produced by current flowing through the metal clip. The interconnect module can be used to form a direct electrical connection between components and/or metal regions of a carrier to which the module is attached.

Abstract: The present invention relates to increasing the molecular weight during a thermal treatment of polyester in combination with a latent heat granulation. With the newly-developed method, an SSP (Solid State Postcondensation) can be directly combined with an underwater granulation. The method differs from a conventional solid state postcondensation by an increase in the molecular weight being possible without additional heat input and hence only by using the residual heat and the crystallization heat present. A characterizing element is improved water separation and dehumidification during the granulation. Only in this way is an increase in viscosity possible even with a small granulate of an average particle weight less than 20 mg.

Abstract: The present invention relates to increasing the molecular weight during a thermal treatment of polyester in combination with a latent heat granulation. With the newly-developed method, an SSP (Solid State Postcondensation) can be directly combined with an underwater granulation. The method differs from a conventional solid state postcondensation by an increase in the molecular weight being possible without additional heat input and hence only by using the residual heat and the crystallisation heat present. A characterising element is improved water separation and dehumidification during the granulation. Only in this way is an increase in viscosity possible even with a small granulate of an average particle weight less than 20 mg.

Abstract: A filter device for filtering plastic melts includes a filter wheel having cavities which are covered by screening elements. A pressure sensor is provided in a melt inflow line upstream of the filter wheel. A pressure sensor is also provided in a melt outflow line downstream of the filter wheel. The pressure sensors measure the pressure drop across the filter. The melt inflow and outflow lines are connected to a melt channel in the filter device, respectively. A melt return line is in connection via a pump and a discharge line with a backflushing slot. The discharge line is connected to an accelerator for increasing pressure in surges. A further melt return/discharge line is connected via a 3-way valve and a return line to the melt inflow line or to a disposal line.

Abstract: A polycondensation reactor for processing low viscosity polyester or another polymer into relatively highly viscosity polymer comprises a substantially cylindrical horizontal reactor vessel with a polymer inlet and a polymer outlet adjacent its opposite ends and a vapor exhaust opening in the upper side of the vessel at its outlet end. A polymer agitator is rotated axially within the chamber and includes plural alternating annular overflow and underflow baffles and multiple perforated film-forming screens disposed therebetween in parallel spaced relation to one another. The overflow baffles are in peripheral polymer-sealing relation to the vessel while the underflow baffles have multiple underflow recesses in their outer peripheries, whereby the baffles define a tortuous polymer flow path alternately through their respective polymer overflow and underflow openings to control residence time, distribution and viscosity growth as the polymer flows between the baffles.

Abstract: Process for isolating dimethyl 4,4'-biphenyldicarboxylate from residues of DMT production, which includes first distilling the residues at a pressure of at most 7 mbar at a boiler temperature from 200.degree. to 350.degree. C., subsequently treating the distillate which distills over in the range from 230.degree. to 270.degree. C. at a pressure of, for example, 0.2 mbar for from 10 to 60 minutes with 0.7 to 10 times the amount of an organic solvent at a temperature from 70.degree. to 180.degree. C., if required, separating the clear solution from undissolved components, cooling the removed clear solution to a temperature from 45.degree. to 65.degree. C. and allowing it to crystallize at this temperature, resulting in a suspension of dimethyl 4,4'-biphenyldicarboxylate crystals from which the crystals are isolated by washing one or more times with the same or a different solvent and by drying.

Abstract: Compounds of the formula (I) ##STR1## in which n denotes a number from 2 to 6, m denotes 1 or 2,R denotes ##STR2## R.sup.1 denotes (substituted) alkyl, (substituted) alkenyl, C.sub.3 -alkynyl, cycloalkyl, cycloalkenyl or an aromatic or heteroaromatic radical, R.sup.2 denotes H or alkyl and Y denotes H, alkyl, phenyl or halophenyl, and the metal-salt complexes thereof have advantageous fungicidal actions and are highly suitable for use in plant protection or in the industrial sector.