Patents by Inventor Rainer Sewald

Rainer Sewald has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Arrangement of optoelectronic components
    Patent number: 8638565
    Abstract: A method for producing an arrangement of optoelectronic components (10) is specified, comprising the following steps: producing at least two fixing regions (2) on a first connection carrier (1); introducing solder material (3) into the fixing regions (2); applying a second connection carrier (4) to the fixing regions (2); and soldering the second connection carrier (4) onto the first connection carrier (1) with the solder material (3) in the fixing regions (2).
    Type: Grant
    Filed: September 21, 2007
    Date of Patent: January 28, 2014
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Rainer Sewald, Markus Kirsch
  • Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body
    Patent number: 7718451
    Abstract: A method for patterned metallization of a plastic-containing body, which comprises the steps of producing the body via a two-component injection-molding process with at least two plastics, one of which is non-metallizable, and metallizing the body in such a way that a metallized region and a non-metallized region are formed, wherein the non-metallized region is determined by the non-metallizable plastic. A method for the patterned metallization of a plastic-containing body in particular a package body for an optoelectronic device is also provided.
    Type: Grant
    Filed: July 23, 2007
    Date of Patent: May 18, 2010
    Assignee: Osram Opto Semiconductor GmbH
    Inventors: Thomas Höfer, Herbert Brunner, Frank Möllmer, Günter Waitl, Rainer Sewald, Markus Zeiler
  • Method for Producing an Arrangement of Optoelectronic Components, and Arrangement of Optoelectronic Components
    Publication number: 20100079964
    Abstract: A method for producing an arrangement of optoelectronic components (10) is specified, comprising the following steps: producing at least two fixing regions (2) on a first connection carrier (1); introducing solder material (3) into the fixing regions (2); applying a second connection carrier (4) to the fixing regions (2); and soldering the second connection carrier (4) onto the first connection carrier (1) with the solder material (3) in the fixing regions (2).
    Type: Application
    Filed: September 21, 2007
    Publication date: April 1, 2010
    Applicant: OSRAM Semiconductors GmbH
    Inventors: Rainer Sewald, Markus Kirsch
  • Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body
    Publication number: 20070269927
    Abstract: A method for patterned metallization of a plastic-containing body, which comprises the steps of producing the body via a two-component injection-molding process with at least two plastics, one of which is non-metallizable, and metallizing the body in such a way that a metallized region and a non-metallized region are formed, wherein the non-metallized region is determined by the non-metallizable plastic. A method for the patterned metallization of a plastic-containing body in particular a package body for an optoelectronic device is also provided.
    Type: Application
    Filed: July 23, 2007
    Publication date: November 22, 2007
    Inventors: Thomas Hofer, Herbert Brunner, Frank Mollmer, Gunter Waitl, Rainer Sewald, Markus Zeiler
  • Optoelectronic device with patterned-metallized package body, method for producing such a device and method for the patterned metallization of a plastic-containing body
    Patent number: 7247940
    Abstract: An optoelectronic device, comprising a package body (57) and at least one semiconductor chip (50) arranged on the package body (57). The surface of the package body (57) has a metallized subregion (15) and a non-metallized subregion (20). The package body (57) includes at least two different plastics (53, 54), one of the plastics being non-metallizable (54) and this plastic determining the non-metallized subregion (20). A method for producing such components and a method for the patterned metallization of a plastic-containing body are also provided.
    Type: Grant
    Filed: March 1, 2004
    Date of Patent: July 24, 2007
    Assignee: Osram Opto Semiconductor GmbH
    Inventors: Thomas Höfer, Herbert Brunner, Frank Möllmer, Günter Waitl, Rainer Sewald, Markus Zeiler
  • Optoelectronic device with patterned-metallized package body, method for producing such a device and method for the patterned metallization of a plastic-containing body
    Publication number: 20040232435
    Abstract: An optoelectronic device, comprising a package body (57) and at least one semiconductor chip (50) arranged on the package body (57). The surface of the package body (57) has a metallized subregion (15) and a non-metallized subregion (20). The package body (57) includes at least two different plastics (53, 54), one of the plastics being non-metallizable (54) and this plastic determining the non-metallized subregion (20). A method for producing such components and a method for the patterned metallization of a plastic-containing body are also provided.
    Type: Application
    Filed: March 1, 2004
    Publication date: November 25, 2004
    Applicant: Osram Opto Semiconductors GmbH
    Inventors: Thomas Hofer, Herbert Brunner, Frank Mollmer, Gunter Waitl, Rainer Sewald, Markus Zeiler