Patents by Inventor Rainer Silbermann

Rainer Silbermann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4603455
    Abstract: A thin-film humidity sensor for measuring the absolute humidity having a base electrode, a moisture-sensitive dielectric layer and a top electrode is formed at the end face of an electrically insulating bushing body by the thin-film technique. The connecting conductors are led through the bushing body and terminate in contact areas which are ground plane and polished together with the end face of the bushing body. The metal layers forming the electrodes are so shaped on application, preferably by means of perforated masks, that they each cover the contact area of the associated connecting conductor and are electrically connected thereto. The bushing body is inserted into a sleeve of a highly alloyed nickel-molybdenum compound and connected thereto in pressure-resistant manner.
    Type: Grant
    Filed: April 19, 1985
    Date of Patent: August 5, 1986
    Assignee: Endress u. Hauser GmbH u. Co.
    Inventors: Wolfgang Woest, Rainer Silbermann, Frank Hegner
  • Patent number: 4530030
    Abstract: A thin-film humidity sensor for measuring the absolute humidity having a base electrode, a moisture-sensitive dielectric layer and a top electrode is formed at the end face of an electrically insulating bushing body by the thin-film technique. The connecting conductors are led through the bushing body and terminate in contact areas which are ground plane and polished together with the end face of the bushing body. The metal layers forming the electrodes are so shaped on application, preferably by means of perforated masks, that they each cover the contact area of the associated connecting conductor and are electrically connected thereto. The bushing body is inserted into a sleeve of a highly alloyed nickel-molybdenum compound and connected thereto in pressure-resistant manner.
    Type: Grant
    Filed: December 22, 1983
    Date of Patent: July 16, 1985
    Assignee: Endress u. Hauser GmbH u. Co.
    Inventors: Wolfgang Woest, Rainer Silbermann, Frank Hegner