Abstract: A communications system for a motor vehicle in which the hands-free device for a mobile phone is integrated into an audio or information system of the motor vehicle such as a car radio. The voice and/or data transmission between the mobile phone and the hands-free device takes place over an additional short-range radio link. A transceiver for this short-range radio link is contained both in the car radio and in the mobile phone. The need to install additional connection interfaces is thus eliminated. In addition, the need to couple the mobile phone to the hands-free device using a cable is eliminated. This has the advantage that the mobile phone can remain, for example, in the driver's pocket. The coupling between the mobile phone and car radio occurs automatically if the mobile phone moves into the range of the short-range radio link of the car radio.

Abstract: A method for detecting a crack in a semiconductor wafer, which includes an electrical device and a connecting pad electrically coupled with the electrical device, is described. The crack is detected by an acoustic detector being acoustically coupled to the semiconductor wafer during contacting the contacting pad with a probe.

Abstract: A method for detecting a crack in a semiconductor wafer, which includes an electrical device and a connecting pad electrically coupled with the electrical device, is described. The crack is detected by an acoustic detector being acoustically coupled to the semiconductor wafer during contacting the contacting pad with a probe.

Abstract: The invention relates to an electronic component including a housing and a first substrate having at least one integrated circuit, a multiplicity of contact surfaces arranged in an arbitrary distribution on the surface of the first substrate. A second substrate forms a housing and is mechanically joined to the surface of the first substrate in a surface-to-surface contact, via an insulating joining layer. The second substrate has contact connection surfaces that are surface-to-surface connected to the contact surfaces of the first substrate in an electrically conductive manner. The second substrate has symmetrically arranged external contact surfaces that are conductively connected to the contact connection surfaces via through-contacts in the second substrate.

Abstract: A communications system of a motor vehicle is disclosed in which a communications device (101) for setting up a mobile radio link is installed in the motor vehicle, which mobile radio link also has a short-range radio device. An external mobile radio device (118; 119) also additionally has such a short-range radio device. If the mobile radio device (118; 119) enters the radio range of the short-range radio device of the communications device (101) in the vehicle, data is exchanged between the devices over the short-range radio link. A comparator module in the communications device of the vehicle compares the received data with stored data with respect to specific features which contain an identifier of the mobile radio device (118; 119). If an authorized mobile radio device (118; 119) is detected, a call diversion is activated automatically within the cellular mobile phone network. Furthermore, a corresponding communications device (101) and a method for operating the communications system are proposed.

Abstract: An electronic component includes a semiconductor chip and/or a test structure. The semiconductor chip includes a multi-layer coating having at least one interconnect layer, at least one insulation layer, and at least one planarization layer. A method of producing the component is also disclosed. Embedded adhesion regions are provided in the planarization layer, whereby the adhesion regions provide adhesion surfaces to the adjacent insulation layers.

Abstract: The invention relates to an electronic component including a housing and a first substrate having at least one integrated circuit, a multiplicity of contact surfaces arranged in an arbitrary distribution on the surface of the first substrate. A second substrate forms a housing and is mechanically joined to the surface of the first substrate in a surface-to-surface contact, via an insulating joining layer. The second substrate has contact connection surfaces that are surface-to-surface connected to the contact surfaces of the first substrate in an electrically conductive manner. The second substrate has symmetrically arranged external contact surfaces that are conductively connected to the contact connection surfaces via through-contacts in the second substrate.

Abstract: The present invention relates to an electronic component having a semiconductor chip (1) and/or a test structure (55), whereby the semiconductor chip (1) comprises a multi-layer coating (2) including at least one interconnect layer (3, 4, 5), one insulation layer (6, 7, 8, 9) and one planarization layer (10), and to a method of producing said component. Embedded adhesion regions (12) are provided in the planarization layer (10), whereby the adhesion regions (12) provide adhesion surfaces (13, 14) to the adjacent insulation layers (8, 9; 65, 66).