Abstract: A circuit configuration for switching current flow through an ignition coil, in which the switching process is able to be executed by at least one first transistor that is controllable by a control signal which is able to be supplied via a control signal input of the circuit configuration, and the control signal input is connected to at least one variable resistor.

Abstract: A circuit configuration for switching current flow through an ignition coil, in which the switching process is able to be executed by at least one first transistor that is controllable by a control signal which is able to be supplied via a control signal input of the circuit configuration, and the control signal input is connected to at least one variable resistor.

Abstract: A semiconductor component that is able to be produced simply, quickly, and yet reliably and that usable for power applications, and including a semiconductor chip, a lower, first main electrode layer formed on a first side of the semiconductor chip, a lower control electrode layer formed on the first side, an insulation layer formed on the first side between the lower first main electrode layer and the lower control electrode layer and which partly covers the lower first main electrode layer, an upper first main electrode layer which is formed on the lower first main electrode layer, an upper control electrode layer which is formed on the lower control electrode layer and the insulation layer and extends on the insulation layer partially above the lower first main electrode layer, and a second main electrode layer formed on a second side of the semiconductor chip.

Abstract: A diode system and a generator, uses Zener diodes. The diode system has AC voltage terminals and DC voltage terminals, in which the Zener diodes are operable in the forward direction to rectify an AC voltage present at the AC voltage terminals, in which a lower limit is provided for the Zener voltage of the Zener diodes, and in which the lower limit of the Zener voltage is provided so that it is lower than a preset lower DC voltage.

Abstract: An electronic system having a sandwich design and including two carriers, each carrier having a printed circuit layer, the upper printed circuit layer being positioned on different planes.

Abstract: A semiconductor component that is able to be produced simply, quickly, and yet reliably and that usable for power applications, and including a semiconductor chip, a lower, first main electrode layer formed on a first side of the semiconductor chip, a lower control electrode layer formed on the first side, an insulation layer formed on the first side between the lower first main electrode layer and the lower control electrode layer and which partly covers the lower first main electrode layer, an upper first main electrode layer which is formed on the lower first main electrode layer, an upper control electrode layer which is formed on the lower control electrode layer and the insulation layer and extends on the insulation layer partially above the lower first main electrode layer, and a second main electrode layer formed on a second side of the semiconductor chip.

Abstract: A method of establishing an electric connection between electric terminals of a semiconductor component as part of an electric module and additional parts of the electric module by using a punched grid having internal terminal ends and external terminal ends that are electrically connected to the internal terminal ends by metal strip conductors, the semiconductor component and the punched grid are joined so that at least two electric terminals of the semiconductor component are positioned on corresponding internal terminal ends so that a slip-proof mounting of the semiconductor component on the two internal terminal ends is then possible, this mechanical mounting at the same time establishing an electric connection between the electric terminals of the semiconductor component and the internal terminal ends, whereby a metal strip grid, e.g.

Abstract: A semiconductor circuit configuration is described, in particular for ignition applications, having a semiconductor power switching device which has a first main terminal, a second main terminal and a control terminal; a clamping diode device which is switched between the first main terminal and the control terminal for clamping an external voltage (VA) which is applied at the first main terminal; the clamping diode device having a first part with a first clamp voltage and a second part with a second clamp voltage (VKL?), the second part being connected in series with the first part; a controllable semiconductor switching device which is connected in parallel with the first part for controllable bridging of the first part, so that either the sum (VKL) of the first and the second clamp voltages, or the second clamp voltage (VKL?) is provided for clamping the external voltage (VA) applied at the first main terminal; and a control circuit for controlling the controllable semiconductor switching device as a funct

Abstract: An electrical assembly including an electrical circuit situated in a housing, and a method for the manufacture of such an assembly, in which the electrical circuit is covered at least partially with a protective layer, wherein the protective layer has first and second regions having different hardnesses, so that the protective layer can be optimized with respect to mechanical and thermal loading capacity.

Abstract: An electronic system having a sandwich design and including two carriers, each carrier having a printed circuit layer, the upper printed circuit layer being positioned on different planes.

Abstract: A diode system and a generator, uses Zener diodes. The diode system has AC voltage terminals and DC voltage terminals, in which the Zener diodes are operable in the forward direction to rectify an AC voltage present at the AC voltage terminals, in which a lower limit is provided for the Zener voltage of the Zener diodes, and in which the lower limit of the Zener voltage is provided so that it is lower than a preset lower DC voltage.

Abstract: A device for protecting electronic components against overvoltages of a supply voltage is provided, which device includes at least one semiconductor transistor which is switchable by a trigger circuit when a predetermined overvoltage value is reached, thereby converting electrical energy to thermal energy.

Abstract: A semiconductor circuit configuration is described, in particular for ignition applications, having a semiconductor power switching device (100) which has a first main terminal (102), a second main terminal (101) and a control terminal (103); a clamping diode device (205a, 205b) which is switched between the first main terminal (102) and the control terminal (103) for clamping an external voltage (VA) which is applied at the first main terminal (202); the clamping diode device (205a, 205b) having a first part (205a) with a first clamp voltage and a second part (205b) with a second clamp voltage (VKL′), the second part (205b) being connected in series with the first part (205a); a controllable semiconductor switching device (402, 650) which is connected in parallel with the first part (205a) for controllable bridging of the first part (205a), so that either the sum (VKL) of the first and the second clamp voltages, or the second clamp voltage (VKL′) is provided for clamping the external voltage (VA)

Abstract: An electrical assembly is proposed having an electrical circuit situated in a housing, and a method is proposed for the manufacture of such an assembly, in which the electrical circuit is covered at least partially with a protective layer, wherein the protective layer has first and second regions having different hardnesses, so that the protective layer can be optimized with respect to mechanical and thermal loading capacity.

Abstract: A method of establishing an electric connection between electric terminals of a semiconductor component as part of an electric module and additional parts of the electric module by using a punched grid having internal terminal ends (11) and external terminal ends (10) that are electrically connected to the internal terminal ends by metal strip conductors (12), the semiconductor component and the punched grid being joined so that at least two electric terminals of the semiconductor component are positioned on corresponding internal terminal ends so that a slip-proof mounting of the semiconductor component on the two internal terminal ends is then possible, this mechanical mounting at the same time establishing an electric connection between the electric terminals of the semiconductor component and the internal terminal ends,whereby a metal strip grid, in particular a punched grid, which, even before being joined to the semiconductor component, has already been embedded on at least one side in at least one part

Abstract: A plug connector is proposed, in particular for a control device (100), which includes a plug input having at least two input connections (1, 2, 3), a plug output having at least two output connections (4, 5, 6), and at least one connecting part (10, 20) via which the respective associated connections (1, 2, 3, 4, 5, 6)—input connection and output connection—are interconnected.

Abstract: A power component is proposed which reliably switches inductive loads and has a current detection element to detect the current through the inductive load. The component includes a protective element which is connected to the source terminals of the sense element and of the actuator. The protective element protects against parasitic effects between the sense element and the actuator.

Abstract: A device for protecting electronic components against overvoltages of a supply voltage is provided, which device includes at least one semiconductor transistor which is switchable by a trigger circuit when a predetermined overvoltage value is reached, thereby converting electrical energy to thermal energy.

Abstract: With a housing for accommodating a planar power transistor, a chip of the power transistor is arranged hermetically sealed inside the housing, and metallized areas on the chip lead out of the housing by way of electric terminals. At least in some areas, the housing is formed by at least one of the electric power terminals.

Abstract: A window heating system, in particular for heating a window of a motor vehicle, includes a resistance heating device, applied onto or integrated into the window, that is connectable to a heating voltage source via terminal contacts by way of an electrical switching device. The switching device is a semiconductor switching device arranged directly on the window to be heated.