Abstract: The method and the device serve for soldering of workpieces, namely of pc boards and substrates, which are equipped with chip component parts and/or microelements and/or assemblies comprised thereof. Such boards are passed through a main solder bath or at least one main solder wave, and the workpiece is contacted with the surface of the wave. The solder wave has an imaginary break edge 2, i.e., a break edge at which the solder loses the contact with the workpiece in connection with an unwettable workpiece. The imaginary break edge 2 of the soldering device 1 extends not in a straight line and, viewed in the direction of conveyance 3, has at least one diminution 4, i.e., two edge parts ending in a point, i.e., the edges form a triangle.