Patents by Inventor Rainier Chua

Rainier Chua has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12044385
    Abstract: A light system comprises at least three separate individual rigid metal LED heat sinks each having a respective substantially planar outwardly facing LED support surface and a flexible printed circuit board. The flexible printed circuit board comprises a flexible substrate carrying a plurality of LEDs, electrical control components, electrical input components and electrical traces. LED regions of the flexible printed circuit board carrying the LEDs are disposed on the outwardly facing LED support surfaces with light-emitting surfaces of the LEDs outwardly facing. Adjacent LED heat sinks are foldably coupled to one another by joints formed by fold regions of the flexible printed circuit board extending between respective spaced-apart edges of the adjacent ones of the LED heat sinks. Each adjacent pair of the outwardly facing LED support surfaces are non-parallel to one another whereby the outwardly facing LED support surfaces are disposed on notional faces of a notional polyhedron.
    Type: Grant
    Filed: December 8, 2023
    Date of Patent: July 23, 2024
    Assignee: SWS WARNING LIGHTS INC.
    Inventor: Rainier Chua
  • Publication number: 20240200757
    Abstract: A light system comprises at least three separate individual rigid metal LED heat sinks each having a respective substantially planar outwardly facing LED support surface and a flexible printed circuit board. The flexible printed circuit board comprises a flexible substrate carrying a plurality of LEDs, electrical control components, electrical input components and electrical traces. LED regions of the flexible printed circuit board carrying the LEDs are disposed on the outwardly facing LED support surfaces with light-emitting surfaces of the LEDs outwardly facing. Adjacent LED heat sinks are foldably coupled to one another by joints formed by fold regions of the flexible printed circuit board extending between respective spaced-apart edges of the adjacent ones of the LED heat sinks. Each adjacent pair of the outwardly facing LED support surfaces are non-parallel to one another whereby the outwardly facing LED support surfaces are disposed on notional faces of a notional polyhedron.
    Type: Application
    Filed: December 8, 2023
    Publication date: June 20, 2024
    Inventor: Rainier CHUA
  • Patent number: 10072817
    Abstract: The present disclosure describes light systems in which the intensity of base color LEDs configured to emit light within a target color region is increased using additional white LEDs and the emitted light is filtered so that a dominant portion of light passing through the filter at a particular viewing angle is within the target color region. The present disclosure also describes methods for forming a printed circuit board with an integral heat sink arrangement by depositing additional solder on solder pads that are not used to connect electronic components so that the additional solder acts as a heat sink.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: September 11, 2018
    Assignee: SWS WARNING SYSTEMS INC.
    Inventors: Steven A. Sergenese, Jerico Wong, Rainier Chua, Umer Anwer
  • Publication number: 20170284630
    Abstract: The present disclosure describes light systems in which the intensity of base color LEDs configured to emit light within a target color region is increased using additional white LEDs and the emitted light is filtered so that a dominant portion of light passing through the filter at a particular viewing angle is within the target color region. The present disclosure also describes methods for forming a printed circuit board with an integral heat sink arrangement by depositing additional solder on solder pads that are not used to connect electronic components so that the additional solder acts as a heat sink.
    Type: Application
    Filed: March 31, 2016
    Publication date: October 5, 2017
    Inventors: Steven A. Sergenese, Jerico Wong, Rainier Chua, Umer Anwer